KM6465AP-25 datasheet, PDF - EEWORLD Datasheet

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KM6465AP-25: DescriptionStandard SRAM, 16KX4, 25ns, CMOS, PDIP22, 0.300 INCH, PLASTIC, DIP-22; Categorystorage storage; File Size163KB，8 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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KM6465AP-25 Overview

Standard SRAM, 16KX4, 25ns, CMOS, PDIP22, 0.300 INCH, PLASTIC, DIP-22

KM6465AP-25 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SAMSUNG
Parts packaging code	DIP
package instruction	DIP, DIP22,.3
Contacts	22
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	25 ns
Other features	BATTERY BACKUP
I/O type	COMMON
JESD-30 code	R-PDIP-T22
JESD-609 code	e0
length	26.745 mm
memory density	65536 bit
Memory IC Type	STANDARD SRAM
memory width	4
Number of functions	1
Number of ports	1
Number of terminals	22
word count	16384 words
character code	16000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	16KX4
Output characteristics	3-STATE
Exportable	NO
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP22,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	5.08 mm
Maximum standby current	0.002 A
Minimum standby current	4.5 V
Maximum slew rate	0.1 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm

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KM6465AP-25 Related Products

	KM6465AP-25	KM6465AP-35	KM6465ALP-25	KM6465AP-45	KM6465ALP-45	KM6465ALP-35
Description	Standard SRAM, 16KX4, 25ns, CMOS, PDIP22, 0.300 INCH, PLASTIC, DIP-22	Standard SRAM, 16KX4, 35ns, CMOS, PDIP22, 0.300 INCH, PLASTIC, DIP-22	Standard SRAM, 16KX4, 25ns, CMOS, PDIP22, 0.300 INCH, PLASTIC, DIP-22	Standard SRAM, 16KX4, 45ns, CMOS, PDIP22, 0.300 INCH, PLASTIC, DIP-22	Standard SRAM, 16KX4, 45ns, CMOS, PDIP22, 0.300 INCH, PLASTIC, DIP-22	Standard SRAM, 16KX4, 35ns, CMOS, PDIP22, 0.300 INCH, PLASTIC, DIP-22
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG
Parts packaging code	DIP	DIP	DIP	DIP	DIP	DIP
package instruction	DIP, DIP22,.3	DIP, DIP22,.3	DIP, DIP22,.3	DIP, DIP22,.3	DIP, DIP22,.3	DIP, DIP22,.3
Contacts	22	22	22	22	22	22
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknow
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	25 ns	35 ns	25 ns	45 ns	45 ns	35 ns
Other features	BATTERY BACKUP	BATTERY BACKUP	BATTERY BACKUP	BATTERY BACKUP	BATTERY BACKUP	BATTERY BACKUP
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PDIP-T22	R-PDIP-T22	R-PDIP-T22	R-PDIP-T22	R-PDIP-T22	R-PDIP-T22
JESD-609 code	e0	e0	e0	e0	e0	e0
length	26.745 mm	26.745 mm	26.745 mm	26.745 mm	26.745 mm	26.745 mm
memory density	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bi
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	4	4	4	4	4	4
Number of functions	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1
Number of terminals	22	22	22	22	22	22
word count	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words
character code	16000	16000	16000	16000	16000	16000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	16KX4	16KX4	16KX4	16KX4	16KX4	16KX4
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	NO	NO	NO	NO	NO	NO
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP22,.3	DIP22,.3	DIP22,.3	DIP22,.3	DIP22,.3	DIP22,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.08 mm	5.08 mm	5.08 mm	5.08 mm	5.08 mm	5.08 mm
Maximum standby current	0.002 A	0.002 A	0.00005 A	0.002 A	0.00005 A	0.00005 A
Minimum standby current	4.5 V	4.5 V	2 V	4.5 V	2 V	2 V
Maximum slew rate	0.1 mA	0.1 mA	0.1 mA	0.1 mA	0.1 mA	0.1 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm

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Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

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