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CY7C1356DV25-200BGXI

Description
256K X 36 ZBT SRAM, 3.5 ns, PQFP100
Categorystorage   
File Size575KB,29 Pages
ManufacturerCypress Semiconductor
Download Datasheet Parametric View All

CY7C1356DV25-200BGXI Overview

256K X 36 ZBT SRAM, 3.5 ns, PQFP100

CY7C1356DV25-200BGXI Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals100
Maximum operating temperature85 Cel
Minimum operating temperature-40 Cel
Maximum supply/operating voltage2.62 V
Minimum supply/operating voltage2.38 V
Rated supply voltage2.5 V
maximum access time3.5 ns
Processing package description14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, PLASTIC, MS-026, TQFP-100
Lead-freeYes
EU RoHS regulationsYes
China RoHS regulationsYes
stateACTIVE-UNCONFIRMED
packaging shapeRECTANGULAR
Package SizeFLATPACK, LOW PROFILE
surface mountYes
Terminal formGULL WING
Terminal spacing0.6500 mm
terminal coatingMATTE TIN
Terminal locationQUAD
Packaging MaterialsPLASTIC/EPOXY
Temperature levelINDUSTRIAL
memory width36
organize256K X 36
storage density9.44E6 deg
operating modeSYNCHRONOUS
Number of digits262144 words
Number of digits256K
Memory IC typeZBT SRAM
serial parallelPARALLEL
CY7C1354DV25, CY7C1356DV25
9-Mbit (256K x 36/512K x 18)
Pipelined SRAM with NoBL™ Architecture
Features
Functional Description
The CY7C1354DV25 and CY7C1356DV25 are 2.5V, 256K x 36
and 512K x 18 Synchronous pipelined burst SRAMs with No Bus
Latency™ (NoBL™) logic, respectively. They are designed to
support unlimited true back to back read and write operations
with no wait states. The CY7C1354DV25 and CY7C1356DV25
are equipped with the advanced (NoBL) logic required to enable
consecutive read and write operations with data being trans-
ferred on every clock cycle. This feature dramatically improves
the throughput of data in systems that require frequent write and
read transitions. The CY7C1354DV25 and CY7C1356DV25 are
pin compatible with and functionally equivalent to ZBT devices.
All synchronous inputs pass through input registers controlled by
the rising edge of the clock. All data outputs pass through output
registers controlled by the rising edge of the clock. The clock
input is qualified by the Clock Enable (CEN) signal, which when
deasserted suspends operation and extends the previous clock
cycle.
Write operations are controlled by the Byte Write Selects
(BW
a
–BW
d
for CY7C1354DV25 and BW
a
–BW
b
for
CY7C1356DV25) and a Write Enable (WE) input. All writes are
conducted with on-chip synchronous self timed write circuitry.
Three synchronous Chip Enables (CE
1
, CE
2
, CE
3
) and an
asynchronous Output Enable (OE) provide easy bank selection
and output tri-state control. To avoid bus contention, the output
drivers are synchronously tri-stated during the data portion of a
write sequence. For best practices recommendations, please
refer to the Cypress application note
System Design Guidelines
on
www.cypress.com.
Pin compatible with and functionally equivalent to ZBT™
Supports 250 MHz bus operations with zero wait states
Available speed grades are 250, 200, and 166 MHz
Internally self timed output buffer control to eliminate the need
to use asynchronous OE
Fully registered (inputs and outputs) for pipelined operation
Byte Write capability
Single 2.5V power supply (V
DD
)
Fast clock-to-output times
2.8 ns (for 250 MHz device)
Clock Enable (CEN) pin to suspend operation
Synchronous self timed writes
Available in Pb-free 100-pin TQFP package, Pb-free and non
Pb-free 119-ball BGA package, and 165-ball FBGA package
IEEE 1149.1 JTAG compatible boundary scan
Burst capability–linear or interleaved burst order
“ZZ” Sleep mode and Stop Clock options
Selection Guide
Description
Maximum Access Time
Maximum Operating Current
Maximum CMOS Standby Current
250 MHz
2.8
250
40
200 MHz
3.2
220
40
166 MHz
3.5
180
40
Unit
ns
mA
mA
Cypress Semiconductor Corporation
Document #: 001-48974 Rev. *A
198 Champion Court
San Jose
,
CA 95134-1709
408-943-2600
Revised July 31, 2009
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