TMP93CS40DF datasheet, PDF - EEWORLD Datasheet

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TMP93CS40DF: Description16-BIT, MROM, 25 MHz, MICROCONTROLLER, PQFP144; CategoryThe embedded processor and controller Microcontrollers and processors; File Size355KB，48 Pages; ManufacturerToshiba Semiconductor; Websitehttp://toshiba-semicon-storage.com/

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TMP93CS40DF Overview

16-BIT, MROM, 25 MHz, MICROCONTROLLER, PQFP144

TMP93CS40DF Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Toshiba Semiconductor
Parts packaging code	QFP
package instruction	LFQFP, QFP100,.63SQ,20
Contacts	100
Reach Compliance Code	unknow
Has ADC	YES
Other features	OPERATES AT 2.7V MINIMUM SUPPLY @ 12.5MHZ
Address bus width	24
bit size	16
CPU series	TLCS-900/L
maximum clock frequency	20 MHz
DAC channel	NO
DMA channel	YES
External data bus width	16
JESD-30 code	S-PQFP-G100
JESD-609 code	e0
length	14 mm
Number of I/O lines	79
Number of terminals	100
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	LFQFP
Encapsulate equivalent code	QFP100,.63SQ,20
Package shape	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3/5 V
Certification status	Not Qualified
RAM (bytes)	2048
rom(word)	32768
ROM programmability	MROM
Maximum seat height	1.6 mm
speed	20 MHz
Maximum slew rate	30 mA
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	14 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

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Quality and Reliability Assurance / Handling Precautions

Quality And Reliability Assurance / Handling Precautions

In recent years, technical revolutions have become almost a daily occurrence in the

electronics industry. This is accompanied by the increasing application of semiconductors in

both the consumer and industrial sectors, and demands for higher quality and higher

reliability.

Toshiba is making every effort to improve both quality and reliability with the following

quality control system which incorporates product design, quality assurance for parts and

materials received, manufacturing process quality assurance, shipping quality and

reliability assurance, and quality after-service based on user demands and market survey

data.

1 Quality And Reliability Assurance

1.1

Quality Assurance

Trying to sense the customer’s needs, we do our best to incorporate the quality and

reliability required by the customer into the design, while considering the safety

and PL (Product Liability) of the products.

Quality and reliability evaluation are performed on the developed products

according to the Toshiba’s reliability test standard which is prepared in conformity

with JIS, EIAJ, MIL, etc., thereby certifying the design. The parts and materials

are standardized through the engineering department and the quality assurance

department. After the design is accepted, standardization is performed by the

engineering department on the parts and materials, process plan, and inspection

plan. Engineering Institution of Works (EW) is then established on the working

detail. The quality and reliability evaluation are performed on the mass-produced

products on an experimental basis.

In the mass production, the production department has control of the

manufacturing process, the environment and facility, and the quality assurance

department. Quality assurance performs incoming inspection of parts and

materials, modification control, instrument control, periodical reliability test and

line audit. The production technology divisions also participate in process

improvement, automatization, etc.

Education and training for quality and reliability, are given to new workers,

inspectors, engineers and small groups (QC/ZD movement). In shipping the

finished products, a lot quality assurance test is performed by the quality assurance

department. We then commence preparation of specifications meeting pre-arranged

quality and reliability standards and the inspection and reports on discrepant

products “quick action” as the motto. Figure 1 shows the quality assurance system

of semiconductor.

030901

QUA-1

2002-02-20

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