S3AB thru S3MB
Taiwan Semiconductor
CREAT BY ART
Surface Mount Rectifiers
FEATURES
- Glass passivated chip junction
- Ideal for automated placement
- Low forward voltage drop
- High surge current capability
- Moisture sensitivity level: level 1, per J-STD-020
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
- Halogen-free according to IEC 61249-2-21 definition
MECHANICAL DATA
Case:
DO-214AA (SMB)
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - green compound (halogen-free)
Base P/N with prefix "H" on packing code - AEC-Q101 qualified
Terminal:
Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
with prefix "H" on packing code meet JESD 201 class 2 whisker test
Polarity:
Indicated by cathode band
Weight:
0.09 g (approximately)
DO-214AA (SMB)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(T
A
=25℃ unless otherwise noted)
PARAMETER
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load
Maximum instantaneous forward voltage (Note 1)
@3A
Maximum reverse current @ rated VR
Typical reverse recovery time (Note 2)
Typical junction capacitance (Note 3)
Typical thermal resistance
Operating junction temperature range
Storage temperature range
Note 1: Pulse test with PW=300μs, 1% duty cycle
Note 2: Reverse Recovery Test Conditions: I
F
=0.5A, I
R
=1.0A, I
RR
=0.25A
Note 3: Measured at 1 MHz and Applied Reverse Voltage of 4.0V D.C.
T
J
=25
℃
T
J
=125
℃
SYMBOL
V
RRM
V
RMS
V
DC
I
F(AV)
I
FSM
V
F
I
R
Trr
Cj
R
θjL
T
J
T
STG
S3
AB
50
35
50
S3
BB
100
70
100
S3
DB
200
140
200
S3
GB
400
280
400
3
80
1.15
10
250
1.5
40
10
- 55 to +150
- 55 to +150
O
S3
JB
600
420
600
S3
KB
800
560
800
S3
MB
1000
700
1000
Unit
V
V
V
A
A
V
μA
μs
pF
C/W
O
O
C
C
Document Number: DS_D1405060
Version: H14
S3AB thru S3MB
Taiwan Semiconductor
ORDERING INFORMATION
PART NO.
AEC-Q101
QUALIFIED
S3xB
(Note 1)
R5
Prefix "H"
R4
M4
Suffix "G"
PACKING CODE
GREEN COMPOUND
CODE
SMB
SMB
SMB
850 / 7" Plastic reel
3,000 / 13" Paper reel
3,000 / 13" Plastic reel
PACKAGE
PACKING
Note 1: "x" defines voltage from 50V (S3AB) to 1000V (S3MB)
EXAMPLE
PREFERRED P/N
S3MB R5
S3MB R5G
S3MBHR5
PART NO.
S3MB
S3MB
S3MB
H
AEC-Q101
QUALIFIED
PACKING CODE
R5
R5
R5
G
Green compound
AEC-Q101 qualified
GREEN COMPOUND
CODE
DESCRIPTION
RATINGS AND CHARACTERISTICS CURVES
(TA=25℃ unless otherwise noted)
FIG.1 FORWARD CURRENT DERATING CURVE
INSTANTANEOUS REVERSE CURRENT (μA)
100
FIG. 2 TYPICAL REVERSE CHARACTERISTICS
3.5
AVERAGE FORWARD CURRENT (A)
3
2.5
2
1.5
1
0.5
0
0
20
40
60
80
100
120
140
160
RESISTIVE OR
INDUCTIVE LOAD
10
TJ=125℃
1
TJ=25℃
0.1
0
20
40
60
80
100
120
140
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
LEAD TEMPERATURE (
o
C)
FIG. 3 MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
PEAK FORWARD SURGE URRENT (A)
INSTANTANEOUS FORWARD CURRENT
(A)
100
8.3ms Single Half Sine Wave
100
FIG. 4 TYPICAL FORWARD CHARACTERISTICS
10
1
Pulse Width=300μs
1% Duty Cycle
0.6
0.7
0.8
0.9
1
1.1
1.2
1.3
1.4
1.5
1.6
10
1
10
100
0.1
FORWARD VOLTAGE (V)
NUMBER OF CYCLES AT 60 Hz
Document Number: DS_D1405060
Version: H14
S3AB thru S3MB
Taiwan Semiconductor
100
FIG. 5 TYPICAL JUNCTION CAPACITANCE
CAPACITANCE (pF)
10
f=1.0MHz
Vsig=50mVp-p
1
1
10
REVERSE VOLTAGE (V)
100
PACKAGE OUTLINE DIMENSIONS
Unit (mm)
Min
1.95
4.25
3.48
1.99
0.90
5.10
0.10
0.15
Max
2.10
4.75
3.73
2.61
1.41
5.30
0.20
0.31
Unit (inch)
Min
0.077
0.167
0.137
0.078
0.035
0.201
0.004
0.006
Max
0.083
0.187
0.147
0.103
0.056
0.209
0.008
0.012
DIM.
A
B
C
D
E
F
G
H
SUGGESTED PAD LAYOUT
Symbol
A
B
C
D
E
Unit (mm)
2.3
2.5
4.3
1.8
6.8
Unit (inch)
0.091
0.098
0.169
0.071
0.268
MARKING DIAGRAM
P/N
G
YW
F
= Specific Device Code
= Green Compound
= Date Code
= Factory Code
Document Number: DS_D1405060
Version: H14
S3AB thru S3MB
Taiwan Semiconductor
CREAT BY ART
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1405060
Version: H14
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