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HSF-1-100-11R0-K-LF-13

Description
RESISTOR, METAL GLAZE/THICK FILM, 1 W, 10 %, 100 ppm, 11 ohm, SURFACE MOUNT, 2512
CategoryPassive components   
File Size354KB,2 Pages
ManufacturerIRC ( TT Electronics )
Websitehttp://www.irctt.com/
Download Datasheet Parametric Compare View All

HSF-1-100-11R0-K-LF-13 Overview

RESISTOR, METAL GLAZE/THICK FILM, 1 W, 10 %, 100 ppm, 11 ohm, SURFACE MOUNT, 2512

HSF-1-100-11R0-K-LF-13 Parametric

Parameter NameAttribute value
Maximum operating temperature150 Cel
Minimum operating temperature0.0 Cel
Processing package descriptionROHS COMPLIANT
Lead-freeYes
EU RoHS regulationsYes
stateACTIVE
packaging shapeCYLINDRICAL PACKAGE
Terminal shapeWRAPAROUND
terminal coatingTIN COPPER
Installation featuresSURFACE MOUNT
Rated temperature70 Cel
Manufacturer SeriesHSF-1
size code2512
deviation10 %
resistance11 ohm
CraftsmanshipMETAL GLAZE/THICK FILM
Resistor typeRESISTOR
Operating Voltage350 V
Temperature Coefficient100
Rated power P1 W
HSF-1 SERIES
METAL GLAZE™ GENERAL PURPOSE
SURFACE MOUNT SURGE RESISTOR
·
·
·
·
·
Up to triple the surge rating of the rugged CHP1
Replaces costly surface-mount wirewound resistors
150°C maximum operating temperature
1 Watt power rating
ROHS - Compatible Components Available
Metal Glaze
TM
thick film element
fired at 1000°C
to solid ceramic
High
temperature
dielectric
coating
60/40 Solder over
nickel barrier
Film
HSF-1 SPECIFICATIONS:
Size
Code
F
Industry
Footprint
2512
IRC
Type
HSF-1
Maximum
Power Rating
1W @ 70°C
Working
Voltage
350 VDC
Maximum
Voltage
1000 VDC
Resistance
Range (
Ω
)
Tolerance
(±%)
10
TCR
(ppm/°C)
±50, ±100
Product
Category
High Surge
5.9, 6.8, 11, 27,
62, 68, 270
Note 1: Consult factory for additional resistance values.
2: Consider the CHP for pulse applications requiring values greater than 300 Ω.
HSF-1 PERFORMANCE CHARACTERISTICS:
Characteristics
Temperature Coefficient
Thermal Shock
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding
Exposure
Solderability
Moisture Resistance
Life Test
Terminal Adhesion Strength
Resistance to Board Bending
Maximum Change
As specified
±0.5% +0.01 ohm
±0.25% +0.01 ohm
±0.5% +0.01 ohm
+0.5 +0.01 ohm
±0.25% 0.01 ohm
95% minimum coverage
±0.5% +0.01 ohm
±0.5% +0.01 ohm
±1% +0.01 ohm
no mechanical damage
±1% + 0.01 ohm
no mechanical damage
Test Method
MIL-R-55342E Par 4.7.9 (-55°C +125°C)
MIL-R-55342E Par 4.7.3 (-65°C +150°C, 5 cycles)
MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)
MIL-R-55342E Par 4.7.5
2.5 x
for 5 seconds
MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)
MIL-R-55342E Par 4.7.7
(Reflow soldered to board at 260°C for 10 seconds)
MIL-STD-202, Method 208 (245°C for 5 seconds)
MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)
MIL-R-55342E Par 4.7.10 (2000 hour at 70°C intermittent)
1200 gram push from underside of mounted chip for 60 seconds
Chip mounted in center of 90mm long board, deflected 5mm so as to
exert pull on chip contacts for 10 seconds
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
WIREWOUND AND FILM TECHNOLOGIES DIVISION
Telephone: 361-992-7900
·
Facsimile: 361-992-3377
·
Website: www.irctt.com
·
4222 South Staples Street
·
Corpus Christi Texas 78411 USA
A subsidiary of
TT electronics plc
Issue October 2008

HSF-1-100-11R0-K-LF-13 Related Products

HSF-1-100-11R0-K-LF-13 HSF-1-100-11R0-K-LF-7 HSF-1-100-11R0-K-LF-BLK HSF-1-50-11R0-K-LF-13 HSF-1-50-11R0-K-LF-7 HSF-1-50-11R0-K-LF-BLK
Description RESISTOR, METAL GLAZE/THICK FILM, 1 W, 10 %, 100 ppm, 11 ohm, SURFACE MOUNT, 2512 RESISTOR, METAL GLAZE/THICK FILM, 1 W, 10 %, 100 ppm, 11 ohm, SURFACE MOUNT, 2512 RESISTOR, METAL GLAZE/THICK FILM, 1 W, 10 %, 100 ppm, 11 ohm, SURFACE MOUNT, 2512 RESISTOR, METAL GLAZE/THICK FILM, 1 W, 10 %, 100 ppm, 11 ohm, SURFACE MOUNT, 2512 RESISTOR, METAL GLAZE/THICK FILM, 1 W, 10 %, 100 ppm, 11 ohm, SURFACE MOUNT, 2512 RESISTOR, METAL GLAZE/THICK FILM, 1 W, 10 %, 100 ppm, 11 ohm, SURFACE MOUNT, 2512
Maximum operating temperature 150 Cel 150 Cel 150 Cel 150 Cel 150 Cel 150 Cel
Minimum operating temperature 0.0 Cel 0.0 Cel 0.0 Cel 0.0 Cel 0.0 Cel 0.0 Cel
Processing package description ROHS COMPLIANT ROHS COMPLIANT ROHS COMPLIANT ROHS COMPLIANT ROHS COMPLIANT ROHS COMPLIANT
EU RoHS regulations Yes Yes Yes Yes Yes Yes
state ACTIVE Active Active ACTIVE ACTIVE ACTIVE
packaging shape CYLINDRICAL PACKAGE CYLINDRICAL PACKAGE CYLINDRICAL PACKAGE CYLINDRICAL PACKAGE CYLINDRICAL PACKAGE CYLINDRICAL PACKAGE
Terminal shape WRAPAROUND WRAPAROUND WRAPAROUND WRAPAROUND WRAPAROUND WRAPAROUND
terminal coating TIN COPPER TIN COPPER TIN COPPER TIN COPPER TIN COPPER TIN COPPER
Installation features SURFACE MOUNT SURFACE MOUNT SURFACE MOUNT SURFACE MOUNT SURFACE MOUNT SURFACE MOUNT
Rated temperature 70 Cel 70 Cel 70 Cel 70 Cel 70 Cel 70 Cel
Manufacturer Series HSF-1 HSF-1 HSF-1 HSF-1 HSF-1 HSF-1
size code 2512 2512 2512 2512 2512 2512
deviation 10 % 10 % 10 % 10 % 10 % 10 %
resistance 11 ohm 11 ohm 11 ohm 11 ohm 11 ohm 11 ohm
Craftsmanship METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Resistor type RESISTOR FIXED RESISTOR FIXED RESISTOR RESISTOR RESISTOR RESISTOR
Operating Voltage 350 V 350 V 350 V 350 V 350 V 350 V
Rated power P 1 W 1 W 1 W 1 W 1 W 1 W
Lead-free Yes - - Yes Yes Yes
Temperature Coefficient 100 - - 100 100 100
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