CHP1/8-100-R470-G-13 datasheet, PDF

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CHP1/8-100-R470-G-13: DescriptionFixed Resistor, Metal Glaze/thick Film, 0.25W, 0.47ohm, 200V, 2% +/-Tol, 100ppm/Cel, Surface Mount, 1206, MELF; CategoryPassive components The resistor; File Size316KB，24 Pages; ManufacturerTT Electronics plc; Websitehttp://www.ttelectronics.com/

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CHP1/8-100-R470-G-13 Overview

Fixed Resistor, Metal Glaze/thick Film, 0.25W, 0.47ohm, 200V, 2% +/-Tol, 100ppm/Cel, Surface Mount, 1206, MELF

CHP1/8-100-R470-G-13 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	TT Electronics plc
package instruction	MELF, 1206
Reach Compliance Code	compliant
ECCN code	EAR99
structure	Cylindrical
Installation features	SURFACE MOUNT
Number of terminals	2
Maximum operating temperature	150 °C
Minimum operating temperature	-55 °C
Package diameter	1.45 mm
Package length	3.2 mm
Package shape	CYLINDRICAL PACKAGE
Package form	MELF
method of packing	TR, 13 INCH
Rated power dissipation(P)	0.25 W
Rated temperature	70 °C
resistance	0.47 Ω
Resistor type	FIXED RESISTOR
size code	1206
surface mount	YES
technology	METAL GLAZE/THICK FILM
Temperature Coefficient	100 ppm/°C
Terminal shape	WRAPAROUND
Tolerance	2%
Operating Voltage	200 V

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IRC CHP Series Handbook

TT electronics

IRC - Wirewound & Film Technologies Division

736 Greenway Road

PO Box 1860

Boone, NC 28607 USA

1-828-264-8861

March 2003

2.0

2.1

PRODUCT MANUFACTURE, STRUCTURE, AND QUALITY CONTROL

MANUFACTURE AND STRUCTURE

2.1.1

FIRING

The Metal Glaze process starts with a high-grade alumina rod. After a metal-to-glass ratio

has been determined (to achieve desired resistance value), milled glaze is applied by dipping

the rod and withdrawing it at a controlled rate for uniform film-thickness control

The dipped rods are then fired at approximately 1000°C. As the glass in the glaze melts and

flows during firing, It creates a form of microencapsulation of the metal particles in this

process, the glass also forms a strong bond with the vitreous phase in the alumina substrate

2.1.2

TERMINATING

After firing, the glazed rods are masked in preparation for diamond sawing to the desired

length and in preparation for several stages of chemical processing.

Following the application of a selectively plated electroless nickel termination and other

treatments, the elements are robotically solder dipped. The standard termination for the CHP

is 60% Sn / 40% Pb solder.

2.1.3

BINNING

The elements in a firing batch are automatically sorted into lots with narrow resistance bands

(“bins”). Resistors are manufactured from a sample of the batch and evaluated using a

standard series of tests before acceptance of the batch. These tests cover mechanical

characteristics, DC resistance, TCR, solderability and STOL. Accepted elements are then

stored until needed. This lot acceptance testing allows IRC continuous monitoring of its

manufacturing system.

2.1.4

ADJUSTING TO FINAL RESISTANCE VALUE

When an order is placed, IRC’s production staff select an appropriate “bin” to meet the

customer’s required resistance and TCR. The resistance value is determined by using a

laser to cut a helical path, increasing resistance, while a precision resistance bridge monitors

resistance. When the resistance value is reached, the equipment controller shuts off the

laser and verifies that the helical conductor path covers an acceptable fraction of the element

length. IRC accepts only those elements that meet resistance and helixing requirements.

2.1.5

APPLYING THE DIELECTRIC COATING

A dielectric coating is applied to the resistor to seal the surface of the component from debris

that could affect performance and provide a dielectric layer to the customer.

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