CX2HSM CRYSTAL
16 kHz to 600 kHz
™
Miniature Surface Mount
Quartz Crystal for Series Oscillators
DESCRIPTION
The CX2HSM quartz crystals are leadless devices designed
for surface mounting on printed circuit boards or hybrid
substrates. These miniature crystals are intended to be
used in Series oscillators. They are hermetically sealed in a
rugged, miniature ceramic package. The CX2HSM crystal
is manufactured using the STATEK-developed
photolithographic process, and was designed utilizing the
experience acquired by producing millions of crystals for
industrial, commercial, military and medical applications.
Maximum process temperature should not exceed 260
O
C.
FEATURES
actual size
Glass Lid Shown
PACKAGE DIMENSIONS
B
1
side view
2
I
G
3
F
H
A
Miniature tuning fork design
High shock resistance
Compatible with hybrid or PC board packaging
Low aging
Full military testing available
Designed and manufactured in the USA
SUGGESTED LAND PATTERN
C
D
E
TYP.
DIM
A
B
C
D
E
GRID
COURTYARD
MAX.
mm
6.60
2.39
-
0.89
1.50
1.27
2.67
3.94
5.33
inches
0.275
0.108
0.045
0.069
0.060
0.115
0.165
0.220
mm
6.99
2.74
1.14
1.75
1.52
2.92
4.19
5.59
inches
0.260
0.094
-
0.035
0.059
0.050
0.105
0.155
0.210
0.105 (2.67)
see below
0.113
(2.87)
0.060 (1.52)
inches (mm)
F
G
H
I
DIM “C”
MAX
SM1
SM2
SM3
1
2
0.060 (1.52)
GLASS LID
inches
0.065
0.067
0.070
mm
1.65
1.70
1.78
CERAMIC LID
inches
0.075
0.077
0.080
mm
1.91
1.96
2.03
CONVENTIONAL SERIES
OSCILLATOR CIRCUIT
Note: Terminal 1 is electrically connected internally to terminal 3
EQUIVALENT CIRCUIT
OSCILLATOR
CX2H XTAL
CX-2H XTAL
BUFFER
C
0
1
L
1
C
1
R
1
2
Contact factory for
design guidelines
R
1
Motional Resistance L
1
Motional Inductance
C
1
Motional Capacitance C
0
Shunt Capacitance
10137 - Rev B
S
YS
ERT
T
E
M
C
IFIC
T
A
N
IO
RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de
IS
O
90
01
SPECIFICATIONS
FIGURE 1
CX2H TYPICAL MOTIONAL RESISTANCE (R
1
)
Specifications are typical at 25
O
C unless otherwise noted.
Specifications are subject to change without notice.
Frequency Range
16 kHz to 600 kHz
Standard Calibration Tolerance* (see table below)
Motional Resistance (R
1
)
Figure 1
MAX: 16-169.9 kHz, 2x Typ.
170-600 kHz, 2.5x Typ.
Motional Capacitance (C
1
)
Quality Factor (Q)
Shunt Capacitance (C
0
)
Drive Level
Turning Point (T
0
)**
Aging, first year
Shock, survival***
Vibration, survival***
Operating Temp. Range
Figure 2
Figure 3
MIN is 0.25x Typ.
2.0 pF MAX.
16-24.9 kHz 1.5
µW
MAX.
25-600 kHz 3.0
µW
MAX.
Figure 4
1000
500
R
1
(k )
2
100
50
20
10
16
50
100
200
600
0
0
Frequency (kHz)
FIGURE 2
CX2H TYPICAL MOTIONAL CAPACITANCE (C
1
)
5
C
1
(fF)
Temperature Coefficient (k) -0.035 ppm/
O
C
2
5 ppm MAX
1,500 g peak, 0.3 ms,
1
/
2
sine
10 g RMS 20-2,000 Hz
-10 C to +70 C (Commercial)
-40
O
C to +85
O
C (Industrial)
-55
O
C to +125
O
C (Military)
-55
O
C to +125
O
C
260
O
C for 20 sec.
O
O
2
1.0
0.5
16
50
100
200
600
Frequency (kHz)
FIGURE 3
CX2H TYPICAL QUALITY FACTOR
(Q)
Storage Temp. Range
Max Process Temperature
* Tighter frequency calibration available.
** Other turning point available.
*** Higher shock and vibration available.
50
(in 1000's)
20
10
5
2
16
50
100
200
600
CX2H Standard Calibration T
olerance at 25
0
C
Frequency Range (kHz)
16-74.9
30 ppm
(0.003%)
+
_
+
_
75-169.9
50 ppm
(0.005%)
+
_
+
_
170-249.9
+
_
250-600
+
_
100 ppm
(0.01%)
200 ppm
(0.02%)
200 ppm
(0.02%)
500 ppm
(0.05%)
Frequency (kHz)
FIGURE 4
CX2H TYPICAL TURNING POINT TEMP (T
0
)
.
100 ppm
(0.01%)
100 ppm
(0.01%)
+
_
+
_
+
_
HOW TO ORDER CX2HSM CRYSTALS
CX2H
S
C
SM1
32.768K
Frequency
K = kHz
SM1 = Gold Plated
SM2 = Solder Plated
SM3 = Solder Dipped
,
30
/ M
Operating Temp. Range:
C = -10
O
C to +70
O
C
I = -40
O
C to +85
O
C
M = -55
O
C to +125
O
C
S = Customer Specified
“S” if special or
custom design.
Blank if Std.
Calibration
Tolerance
@ 25
O
C
(in ppm)
T
O
( C)
1000 ppm
(0.1%)
+
_
1000 ppm
(0.1%)
+
_
2000 ppm
(0.2%)
+
_
5000 ppm
(0.5%)
+80
+70
+60
+50
+40
+30
+20
+10
0
-10
-20
O
16
50
100
200
600
Frequency (kHz)
Note: Frequency f at temperature T is related to frequency f
0
at
turning point temperature T
0
by:
f-f
0
=
k(T-T )
2
0
Blank = Glass Lid
C = Ceramic Lid
f
0
TERMINATIONS
PACKAGING OPTIONS
Designation
SM1
SM2
SM3
Termination
Gold Plated
Solder Plated
Solder Dipped
CX2HSM
- Tray Pack
-16mm tape, 7” or 13” reels
(Reference tape and reel data sheet 10109
)
10137 - Rev B
S
YS
ERT
T
E
M
C
IFIC
T
A
N
IO
RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de
IS
O
90
01
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