EEWORLDEEWORLDEEWORLD

Part Number

Search

D55342H07B14E3PBS

Description
RESISTOR, THIN FILM, 0.25 W, 1 %, 50 ppm, 14300 ohm, SURFACE MOUNT, 1206, CHIP
CategoryPassive components    The resistor   
File Size111KB,4 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Download Datasheet Parametric View All

D55342H07B14E3PBS Overview

RESISTOR, THIN FILM, 0.25 W, 1 %, 50 ppm, 14300 ohm, SURFACE MOUNT, 1206, CHIP

D55342H07B14E3PBS Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerVishay
package instructionSMT, 1206
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresNON-INDUCTIVE
structureRectangular
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package height0.254 mm
Package length3.2 mm
Package formSMT
Package width1.6 mm
method of packingBULK
Rated power dissipation(P)0.25 W
Rated temperature70 °C
GuidelineMIL-PRF-55342
resistance14300 Ω
Resistor typeFIXED RESISTOR
size code1206
surface mountYES
technologyTHIN FILM
Temperature Coefficient50 ppm/°C
Terminal shapeWRAPAROUND
Tolerance1%
Operating Voltage100 V
E/H (Military M/D55342)
Vishay Thin Film
QPL MIL-PRF-55342 Qualified Thin Film Resistor Chips
FEATURES
Established reliability, “R” failure rate level (100 ppm), C = 2
High purity alumina substrate 99.6 % purity
Wraparound termination featuring a tenacious adhesion
layer covered with an electroplated nickel barrier layer for
+ 150 °C operating conditions
Very low noise and voltage coefficient
(< - 25 dB, 0.5 ppm/V)
Non-inductive
Laser-trimmed tolerances ± 0.1 %
Wraparound resistance less than 0.010
Ω
typical
In-lot tracking less than 5 ppm/°C
Complete MIL-testing available in-house
Antistatic waffle pack or tape and reel packaging available
Military/aerospace/QPL
SURFACE MOUNT
CHIPS
Actual Size
M55342/02
Thin Film Mil chip resistors feature all sputtered wraparound
termination for excellent adhesion and dimensional
uniformity. They are ideal in applications requiring stringent
performance requirements. Established reliability is assured
through 100 % screening and extensive environmental lot
testing. Wafer is sawed producing exact dimensions and
clean, straight edges.
Note
Specification changed
MIL-PRF-55342
by
DSCC
from
MIL-R-55342
to
CONSTRUCTION
TYPICAL PERFORMANCE
ABS
Passivation
Resistor film
Solder
coating
Nickel barrier
High ourity
alumina substrate
Adhesion layer
TCR
TOL
25
0.1
STANDARD ELECTRICAL SPECIFICATIONS
Test
Material
Absolute TCR
Absolute Tolerance
Stability:
ΔR
Absolute
Voltage Coefficient
Operating Temperature Range
Storage Temperature Range
Noise
Shelf Life Stability
SPECIFICATIONS
Passivated nichrome
± 25 ppm/°C to ± 300 ppm/°C TCR
± 0.1 %
± 0.1 %
± 0.5 ppm/V
- 55 °C to + 125 °C
- 55 °C to + 150 °C
- 25 dB
100 ppm
1 year at + 25 °C
- 55 °C to + 125 °C
+ 25 °C
2000 h at + 70 °C
CONDITIONS
www.vishay.com
50
For technical questions, contact:
thin-film@vishay.com
Document Number: 60018
Revision: 16-Sep-09
There seems to be a function on PB that can directly run the program on the development board (such as MediaPlay). Under which menu of PB is this function?
How do I register a component (DLL) on WinCE? (Another program wants to call this component, but it cannot be called if it is not registered) There seems to be a function on PB that can directly run t...
qq123321 Embedded System
CC26x2R LaunchPad Development Kit
[i=s]This post was last edited by Jacktang on 2020-8-8 18:46[/i]SimpleLink Multi-Standard CC26x2R Wireless MCU LaunchPad Development Kit LAUNCHXL-CC26X2R1Get started with LaunchPad development:Step 1:...
Jacktang Wireless Connectivity
MOSFET Failure Causes
[align=left]As a switching power supply engineer, you will often encounter the problem that the MOSFET on the power supply board cannot work properly. First, you need to correctly test to determine wh...
lstj977672866 Analog electronics
A Dalian company is urgently recruiting WinCE developers
A large enterprise in Dalian is recruiting WinCE driver and application software developers, using x86 hardware platform. Requirements: Experience in setting up WinCE 6.0 x86 online development enviro...
tule2006 Embedded System
PLC and MCU
Hello everyone, there are two branches in front of me now, one is PLC and the other is single chip microcomputer. I am interested in both, but I don’t know which direction I should focus on. What I wa...
jinwen39325568 Embedded System
How to design the LM3S6432 emulator interface.
There are several simulators that can support LM3S6432 processing. I need to support both IAR and KEIL development environments. Which simulator should I choose? How to design the simulation interface...
kata Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 457  621  2147  760  2268  10  13  44  16  46 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号