EEWORLDEEWORLDEEWORLD

Part Number

Search

D55342H07B23A4CT5

Description
RESISTOR, THIN FILM, 0.25 W, 0.1 %, 50 ppm, 23.4 ohm, SURFACE MOUNT, 1206, CHIP
CategoryPassive components    The resistor   
File Size111KB,4 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Download Datasheet Parametric View All

D55342H07B23A4CT5 Overview

RESISTOR, THIN FILM, 0.25 W, 0.1 %, 50 ppm, 23.4 ohm, SURFACE MOUNT, 1206, CHIP

D55342H07B23A4CT5 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerVishay
package instructionSMT, 1206
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresNON-INDUCTIIVE, LASER TRIMMABLE
structureRectangular
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package height0.254 mm
Package length3.2 mm
Package formSMT
Package width1.6 mm
method of packingTR
Rated power dissipation(P)0.25 W
Rated temperature70 °C
GuidelineMIL-PRF-55342
resistance23.4 Ω
Resistor typeFIXED RESISTOR
size code1206
surface mountYES
technologyTHIN FILM
Temperature Coefficient50 ppm/°C
Terminal shapeWRAPAROUND
Tolerance0.1%
Operating Voltage100 V
E/H (Military M/D55342)
Vishay Thin Film
QPL MIL-PRF-55342 Qualified Thin Film Resistor Chips
FEATURES
Established reliability, “R” failure rate level (100 ppm), C = 2
High purity alumina substrate 99.6 % purity
Wraparound termination featuring a tenacious adhesion
layer covered with an electroplated nickel barrier layer for
+ 150 °C operating conditions
Very low noise and voltage coefficient
(< - 25 dB, 0.5 ppm/V)
Non-inductive
Laser-trimmed tolerances ± 0.1 %
Wraparound resistance less than 0.010
Ω
typical
In-lot tracking less than 5 ppm/°C
Complete MIL-testing available in-house
Antistatic waffle pack or tape and reel packaging available
Military/aerospace/QPL
SURFACE MOUNT
CHIPS
Actual Size
M55342/02
Thin Film Mil chip resistors feature all sputtered wraparound
termination for excellent adhesion and dimensional
uniformity. They are ideal in applications requiring stringent
performance requirements. Established reliability is assured
through 100 % screening and extensive environmental lot
testing. Wafer is sawed producing exact dimensions and
clean, straight edges.
Note
Specification changed
MIL-PRF-55342
by
DSCC
from
MIL-R-55342
to
CONSTRUCTION
TYPICAL PERFORMANCE
ABS
Passivation
Resistor film
Solder
coating
Nickel barrier
High ourity
alumina substrate
Adhesion layer
TCR
TOL
25
0.1
STANDARD ELECTRICAL SPECIFICATIONS
Test
Material
Absolute TCR
Absolute Tolerance
Stability:
ΔR
Absolute
Voltage Coefficient
Operating Temperature Range
Storage Temperature Range
Noise
Shelf Life Stability
SPECIFICATIONS
Passivated nichrome
± 25 ppm/°C to ± 300 ppm/°C TCR
± 0.1 %
± 0.1 %
± 0.5 ppm/V
- 55 °C to + 125 °C
- 55 °C to + 150 °C
- 25 dB
100 ppm
1 year at + 25 °C
- 55 °C to + 125 °C
+ 25 °C
2000 h at + 70 °C
CONDITIONS
www.vishay.com
50
For technical questions, contact:
thin-film@vishay.com
Document Number: 60018
Revision: 16-Sep-09
OV7670 Image Acquisition Based on FPGA Simple Design Method
[i=s]This post was last edited by goodbey155 on 2018-9-25 11:57[/i] [align=left][font=宋体][size=4][color=#000000][b]Title[/b][/color][/size][/font][/align][align=left][font=宋体][size=4][color=#000000]Re...
goodbey155 FPGA/CPLD
Which interfaces can be used to program MSP430?
Whether it is simulation or burning program, MSP430 can generally be carried out through: JTAG, SBW, BSL interface. 1. JTAG uses boundary scan technology. There is a logic interface for JTAG inside th...
415987607 TI Technology Forum
Has your iPhone 13 arrived? Here comes the real iPhone 13 series disassembly
First, here’s a picture of what might be the first fall of iPhone 13 in the world!The iPhone 13 series will begin arriving to customers on Friday (September 24), a week after pre-orders begin. Usually...
eric_wang Making friends through disassembly
Recruiting embedded software engineers for Microsoft!
HiSoft International Group www.hisoft.com Microsoft Business Unit - MSPD Recruitment: Senior Software Engineer at Microsoft If you want to participate in the development of a product that affects coun...
我再做游客 Embedded System
Tsinghua University Automation Department ARM training materials
[url=http://www.baisi.net/misc.php?action=viewratings&tid=43356&pid=105876][img]http://www.baisi.net/images/default/agree.gif[/img][img]http://www.baisi.net/images/default/agree.gif[/img][img]http://w...
dadat MCU
Reply to the post "How to simulate weak signals?"
[i=s] This post was last edited by maychang on 2018-7-14 12:11 [/i] Original post In biological measurements, such as ECG, EEG, EMG and other signals, these signals not only have extremely small volta...
maychang Analog electronics

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 513  2133  401  787  2079  11  43  9  16  42 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号