|
LMP2232_0812 |
LMP2232AMA |
LMP2232BMAE |
LMP2232BMAX |
| Description |
DUAL OP-AMP, 275 uV OFFSET-MAX, 0.128 MHz BAND WIDTH, PDSO8 |
DUAL OP-AMP, 275 uV OFFSET-MAX, 0.128 MHz BAND WIDTH, PDSO8 |
DUAL OP-AMP, 275 uV OFFSET-MAX, 0.128 MHz BAND WIDTH, PDSO8 |
DUAL OP-AMP, 275 uV OFFSET-MAX, 0.128 MHz BAND WIDTH, PDSO8 |
| Number of functions |
2 |
2 |
2 |
2 |
| Number of terminals |
8 |
8 |
8 |
8 |
| Maximum operating temperature |
125 Cel |
125 °C |
125 °C |
125 °C |
| Minimum operating temperature |
-40 Cel |
-40 °C |
-40 °C |
-40 °C |
| Maximum input offset voltage |
275 mV |
275 µV |
275 µV |
275 µV |
| surface mount |
Yes |
YES |
YES |
YES |
| Terminal form |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
| Terminal location |
pair |
DUAL |
DUAL |
DUAL |
| Temperature level |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
| Amplifier type |
Operational Amplifier |
OPERATIONAL AMPLIFIER |
OPERATIONAL AMPLIFIER |
OPERATIONAL AMPLIFIER |
| Is it Rohs certified? |
- |
incompatible |
incompatible |
incompatible |
| Maker |
- |
National Semiconductor(TI ) |
National Semiconductor(TI ) |
National Semiconductor(TI ) |
| Parts packaging code |
- |
SOIC |
SOIC |
SOIC |
| package instruction |
- |
SOIC-8 |
SOIC-8 |
SOIC-8 |
| Contacts |
- |
8 |
8 |
8 |
| Reach Compliance Code |
- |
_compli |
_compli |
_compli |
| ECCN code |
- |
EAR99 |
EAR99 |
EAR99 |
| Architecture |
- |
VOLTAGE-FEEDBACK |
VOLTAGE-FEEDBACK |
VOLTAGE-FEEDBACK |
| Maximum average bias current (IIB) |
- |
0.000125 µA |
0.000125 µA |
0.000125 µA |
| Maximum bias current (IIB) at 25C |
- |
0.000003 µA |
0.000003 µA |
0.000003 µA |
| Nominal Common Mode Rejection Ratio |
- |
91 dB |
91 dB |
91 dB |
| frequency compensation |
- |
YES |
YES |
YES |
| JESD-30 code |
- |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
| JESD-609 code |
- |
e0 |
e0 |
e0 |
| length |
- |
4.9 mm |
4.9 mm |
4.9 mm |
| low-bias |
- |
YES |
YES |
YES |
| low-dissonance |
- |
YES |
YES |
YES |
| micropower |
- |
YES |
YES |
YES |
| Humidity sensitivity level |
- |
1 |
1 |
1 |
| Package body material |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
- |
SOP |
SOP |
SOP |
| Encapsulate equivalent code |
- |
SOP8,.25 |
SOP8,.25 |
SOP8,.25 |
| Package shape |
- |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
- |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE |
| method of packing |
- |
RAIL |
TAPE AND REEL |
TAPE AND REEL |
| power supply |
- |
1.8/5 V |
1.8/5 V |
1.8/5 V |
| Certification status |
- |
Not Qualified |
Not Qualified |
Not Qualified |
| minimum slew rate |
- |
32 V/us |
32 V/us |
32 V/us |
| Nominal slew rate |
- |
0.058 V/us |
0.058 V/us |
0.058 V/us |
| Maximum slew rate |
- |
0.028 mA |
0.028 mA |
0.028 mA |
| Supply voltage upper limit |
- |
6 V |
6 V |
6 V |
| Nominal supply voltage (Vsup) |
- |
2.5 V |
2.5 V |
2.5 V |
| technology |
- |
CMOS |
CMOS |
CMOS |
| Terminal surface |
- |
Tin/Lead (Sn85Pb15) |
Tin/Lead (Sn85Pb15) |
Tin/Lead (Sn85Pb15) |
| Terminal pitch |
- |
1.27 mm |
1.27 mm |
1.27 mm |
| Nominal Uniform Gain Bandwidth |
- |
128 kHz |
128 kHz |
128 kHz |
| Minimum voltage gain |
- |
141000 |
141000 |
141000 |
| width |
- |
3.9 mm |
3.9 mm |
3.9 mm |