LD08JA390JAB1A datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Passive components> capacitor> LD08JA390JAB1A

LD08JA390JAB1A: DescriptionCeramic Capacitor, Multilayer, Ceramic, 4000V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.000039uF, Surface Mount, 1808, CHIP; CategoryPassive components capacitor; File Size56KB，2 Pages; ManufacturerAVX

Download Datasheet Parametric View All

LD08JA390JAB1A Overview

Ceramic Capacitor, Multilayer, Ceramic, 4000V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.000039uF, Surface Mount, 1808, CHIP

LD08JA390JAB1A Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	AVX
package instruction	, 1808
Reach Compliance Code	_compli
ECCN code	EAR99
capacitance	0.000039 µF
Capacitor type	CERAMIC CAPACITOR
dielectric materials	CERAMIC
high	2.03 mm
JESD-609 code	e0
length	4.57 mm
Manufacturer's serial number	LD08
Installation features	SURFACE MOUNT
multi-layer	Yes
negative tolerance	5%
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package shape	RECTANGULAR PACKAGE
Package form	SMT
method of packing	TR, 7 INCH
positive tolerance	5%
Rated (DC) voltage (URdc)	4000 V
series	LD08(4KV,C0G)HV
size code	1808
surface mount	YES
Temperature characteristic code	C0G
Temperature Coefficient	-/+30ppm/Cel ppm/°C
Terminal surface	Tin/Lead (Sn/Pb) - with Nickel (Ni) barrie
Terminal shape	WRAPAROUND
width	2.03 mm

Preview

Download Datasheet

View All

High Voltage MLC Chips

Tin/Lead Termination “B”

For 600V to 5000V Application

AVX Corporation will support those customers for commercial and

military Multilayer Ceramic Capacitors with a termination consisting of

5% minimum lead. This termination is indicated by the use of a “B” in

the 12th position of the AVX Catalog Part Number. This fulfills AVX’s

commitment to providing a full range of products to our customers. AVX

has provided in the following pages, a full range of values that we are

offering in this “B” termination.

Larger physical sizes than normally encountered chips are used to make

high voltage MLC chip product. Special precautions must be taken in

applying these chips in surface mount assemblies. The temperature

gradient during heating or cooling cycles should not exceed 4ºC per

second. The preheat temperature must be within 50ºC of the peak

temperature reached by the ceramic bodies through the soldering

process. Chip sizes 1210 and larger should be reflow soldered only.

Capacitors may require protective surface coating to prevent external

arcing.

NEW 630V RANGE

HOW TO ORDER

LD08

AVX

Style

LD05 - 0805

LD06 - 1206

LD10 - 1210

LD08 - 1808

LD12 - 1812

LD13 - 1825

LD20 - 2220

LD14 - 2225

LD40 - 3640

Voltage

600V/630V = C

1000V = A

1500V = S

2000V = G

2500V = W

3000V = H

4000V = J

5000V = K

Temperature

Coefficient

C0G = A

X7R = C

271

Capacitance Code

(2 significant digits

+ no. of zeros)

Examples:

10 pF = 100

100 pF = 101

1,000 pF = 102

22,000 pF = 223

220,000 pF = 224

1 µF = 105

Capacitance

Tolerance

C0G: J = ±5%

K = ±10%

M = ±20%

X7R: K = ±10%

M = ±20%

Z = +80%, -20%

Test

Level

A = Standard

Termination

B = 5% Min Pb

Packaging

1 = 7" Reel

3 = 13" Reel

9 = Bulk

Special Code

A = Standard

Notes: Capacitors with X7R dielectrics are not intended for applications across AC supply mains or AC line filtering with polarity reversal. Contact plant for recommendations.

Contact factory for availability of Termination and Tolerance options for Specific Part Numbers.

DIMENSIONS

SIZE

(L) Length

millimeters (inches)

LD05 (0805)

LD06 (1206)

LD10* (1210) LD08* (1808) LD12* (1812) LD13* (1825) LD20* (2220) LD25* (2225) LD40* (3640)

2.01 ± 0.20

3.20 ± 0.20

4.57 ± 0.25

4.50 ± 0.30

5.70 ± 0.40

5.72 ± 0.25

9.14 ± 0.25

(0.079 ± 0.008) (0.126 ± 0.008) (0.126 ± 0.008) (0.180 ± 0.010) (0.177 ± 0.012) (0.177 ± 0.012) (0.224 ± 0.016) (0.225 ± 0.010) (0.360 ± 0.010)

(W) Width

1.25 ± 0.20

1.60 ± 0.20

2.50 ± 0.20

2.03 ± 0.25

3.20 ± 0.20

6.40 ± 0.30

5.00 ± 0.40

6.35 ± 0.25

10.2 ± 0.25

(0.049 ±0.008) (0.063 ± 0.008) (0.098 ± 0.008) (0.080 ± 0.010) (0.126 ± 0.008) (0.252 ± 0.012) (0.197 ± 0.016) (0.250 ± 0.010) (0.400 ± 0.010)

(T) Thickness

1.30

1.52

1.70

2.03

2.54

3.30

2.54

Max.

(0.051)

(0.060)

(0.067)

(0.080)

(0.100)

(0.130)

(0.100)

(t) terminal min. 0.50 ± 0.25

0.25 (0.010)

0.76 (0.030)

max. (0.020 ± 0.010) 0.75 (0.030)

0.75 (0.030)

1.02 (0.040)

1.52 (0.060)

* Reflow soldering only.

Recommended Resources

3-digit digital display circuit structurea

Thyristor controlled AC stabilized power supply circuit 3

Use HFC3040 to make a six-way lantern controller

Novel bicycle charger principle and circuit

Basic usage circuit diagram of LT1074

Two types of single tone multiharmonic generating circuits

What happens when I get the message "access violation at address in module" when generating PCB?: After I finished drawing the schematic, when I imported it into PCB, an access violation at address in module appeared. I already knew that the problem should be with the component schematic and packa...; 扶摇- PCB Design

I am a beginner at ARM and I don't understand this instruction. I have no choice but to ask for help from you experts!: NMI_Handler PROC EXPORT NMI_Handler [WEAK] B . ENDP comes from the STM32F10X startup file startup_stm32f10x_hd.s of MDK. The "B ." here is very strange. I couldn't find out what it means when I search...; xmaxbox stm32/stm8

Digital Microphone DMIC Solution: Does anyone know any company that sells digital microphones (DMIC)? Can you provide the model, contact information, brand, and other information? Thanks: loveliness:...; 一战到底 Mobile and portable

I will comment on solar photovoltaic power generation solutions: The layout of ADI's AD7606 scalable multi-channel synchronous sampling data acquisition system is very comprehensive. ADI's chips are widely used in the electric energy industry and can provide stable...; mxj1005071012 ADI Reference Circuit

Help, the USB download method of CH554T is always not recognized: I bought a few CH554T chips for testing, and soldered the chips according to the following circuit diagram (modified from the CH554T evaluation board)But after plugging it into the computer with a USB...; qhuaz 51mcu

About S3C6410 "boot settings" and "operation" from SD: Regarding the "boot settings" and "operations" of S3C6410 from SD, it seems that Samsung has not said that NOR FLASH and NAND FLASH can be omitted when booting from SD card, nor has it mentioned how t...; dianjixue Embedded System

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components