Fast-Acting Chip Fuses
Fast-Acting Chip Fuses
Fast-acting chip fuses help provide overcurrent protection
on systems using DC power sources up to 63V
DC
. The
fuse’s monolithic, multilayer design provides the highest
hold current in the smallest footprint, reduces diffusion-
related aging, improves product reliability and resilience,
and enhances high-temperature performance in a wide
range of circuit designs.
These RoHS-compliant surface mount devices offer
strong arc suppression characteristics and facilitate the
development of more reliable, high performance
consumer electronics such as laptops, multimedia
devices, cell phones, and other portable electronics.
Benefits
• Small size with high-current ratings
• Excellent temperature stability
• High reliability and resilience
• Strong arc suppression characteristics
Features
• RoHS compliant
• Halogen free
(refers to: Br 900ppm, Cl 900ppm, Br+Cl 1500ppm)
• Monolithic, multilayer design
• High-temperature performance
• -55°C to +125°C operating range
11
Applications
• Laptops
• Digital cameras
• Cell phones
• Printers
• DVD players
• Portable electronics
• Game systems
• LCD monitors
• Scanners
99
Table FF1
Clear Time Characteristics for Fast-Acting Chip Fuses
Clear time at 25°C
4 hours min.
5 seconds max.
0.05 seconds max.
% of rated current
100%
250%
400%
Table FF2
Typical Electrical Characteristics, Dimensions and Recommended Pad Layout for
Fast-Acting Chip Fuses
0402 (1005mm) Fast-Acting Chip Fuses
Shape and
Dimensions
Inch (mm)
0.020±0.004
(0.51±0.10)
0.039±0.004
(1.00±0.10)
Typical Electrical
Characteristics
Part Number
0402SFF050F/24
0402SFF075F/24
0402SFF100F/24
Rated Current Nominal Cold DCR*
(A)
(Ω)
0.50
0.75
1.00
1.50
2.00
3.00
4.00
0.380
0.210
0.120
0.056
0.035
0.021
0.014
Max.
Interrupt Ratings
Voltage
(V
DC
)
24
24
24
24
24
24
24
Current
(A)
35
35
35
35
35
35
35
0.020±0.004
(0.51±0.10)
0.010±0.004
(0.25±0.10)
Recommended
Pad Layout
Inch (mm)
0.063
(1.60)
0.016
(0.40)
0
0.028
(0.70)
0.024
(0.60)
0402SFF150F/24
0402SFF200F/24
0402SFF300F/24
0402SFF400F/24
0603 (1608mm) Fast-Acting Chip Fuses
Typical Electrical
Characteristics
Shape and
Dimensions
Inch (mm)
0.031±0.006
(0.80±0.15)
0.063±0.006
(1.60±0.15)
Max.
Interrupt Ratings
Voltage
(V
DC
)
32
32
32
32
32
32
32
32
32
32
24
Current
(A)
50
50
50
35
35
35
35
35
35
35
35
Part Number
0603SFF050F/32
0603SFF075F/32
0603SFF100F/32
Rated Current Nominal Cold DCR*
(A)
(Ω)
0.50
0.75
1.00
1.50
2.00
2.50
3.00
3.50
4.00
5.00
6.00
0.485
0.254
0.131
0.059
0.044
0.032
0.025
0.024
0.018
0.013
0.010
0.031±0.006
(0.80±0.15)
0.014±0.006
(0.36±0.15)
0603SFF150F/32
0603SFF200F/32
11
Recommended
Pad Layout
Inch (mm)
0.110
(2.80)
0
0.024
(0.60)
0.039
(1.00)
0.043
(1.09)
0603SFF250F/32
0603SFF300F/32
0603SFF350F/32
0603SFF400F/32
0603SFF500F/32
0603SFF600F/24
1206 (3216mm) Fast-Acting Chip Fuses
Shape and
Dimensions
S
Inch (mm)
0.063±0.008
0
(1.60±0.20)
Typical Electrical
Characteristics
0.126±0.008
(3.20±0.20)
Max.
Interrupt Ratings
Voltage
(V
DC
)
63
63
63
63
63
63
32
32
32
32
24
24
24
Current
(A)
50
50
50
50
50
50
50
50
45
45
45
45
45
Part Number
1206SFF050F/63
1206SFF075F/63
0.043±0.008
(1.10±0.20)
Rated Current Nominal Cold DCR*
(A)
(Ω)
0.50
0.75
1.00
1.50
1.75
2.00
2.50
3.00
4.00
5.00
6.00
7.00
8.00
0.500
0.330
0.220
0.120
0.100
0.050
0.035
0.031
0.022
0.015
0.012
0.011
0.008
1206SFF100F/63
1206SFF150F/63
1206SFF175F/63
0.020±0.010
(0.51±0.25)
1206SFF200F/63
1206SFF250F/32
Recommended
Pad Layout
Inch (mm)
0.173
0
(4.40)
0.059
(1.50)
0.071
(1.80)
0.057
(1.45)
1206SFF300F/32
1206SFF400F/32
1206SFF500F/32
1206SFF600F/24
1206SFF700F/24
1206SFF800F/24
* Measured at
10% of rated current and 25°C ambient temperature.
100
RoHS Compliant, ELV Compliant
HF
Halogen Free
Fast-Acting Chip Fuses
Figure FF1-FF6 Family Performance Curves
Figure FF1
0402SFF Average Time Current Curves
10
Figure FF2
0402SFF I²t vs. t Curves
1000
A = 0.5A
B = 0.75A
C = 1.0A
100
D = 1.5A
E = 2.0A
F = 3.0A
G = 4.0A
10
D
A BC
E
G
F
H
I
A = 0.5A
B = 0.7A
C = 1.0A
D = 1.2A
E = 1.5A
F = 2.0A
G = 2.5A
H = 3.0A
I
= 4.0A
G
F
E
C
B
A
D
1
Clear-Time (s)
0.1
I²t (A²s)
1
0.1
0.01
0.01
0.001
0.1
1
10
100
0.001
0.001
0.01
0.1
1
10
Current (A)
Note:
Curves are nominal
Time (s)
Figure FF3
0603SFF Average Time Current Curves
10
Figure FF4
0603SFF I²t vs. t Curves
10000
A =
B =
C =
D =
E =
F =
G =
H =
I
=
J =
K =
0.5A
0.7A
1.0A
1.5A
2.0A
2.5A
3.0A
3.5A
4.0A
5.0A
6.0A
10
100
1000
A = 0.5A
B = 0.75A
C = 1.0A
D = 1.5A
E = 2.0A
F = 2.5A
G = 3.0A
H = 3.5A
I
= 4.0A
J = 5.0A
A B C D E F GH I J K
1
Clear-Time (s)
K
J
I
H
G
F
E
D
C
B
A
11
0.1
I²t (A²s)
K = 6.0A
1
0.1
0.01
0.01
0.001
0.1
1
10
100
0.001
0.001
0.01
0.1
1
10
Current (A)
Note:
Curves are nominal
Time (s)
RoHS Compliant, ELV Compliant
HF
Halogen Free
101
Figure FF1-FF6
Figure FF5
Family Performance Curves
Figure FF6
... Cont’d
1206SFF Average Time Current Curves
10
A = 0.5A
B = 0.7A
C = 1.0A
D = 1.5A
E = 1.7A
1
F = 2.0A
G = 2.5A
H = 3.0A
I
= 4.0A
10
100
1000
1206SFF I²t vs. t Curves
10000
A =
C =
D =
F =
G =
0.5A
1.0A
1.5A
2.0A
2.5A
H =
I
=
J =
K =
L =
M=
3.0A
4.0A
5.0A
6.0A
7.5A
8.0A
B = 0.75A
A B C D E F G H I JK L M
E = 1.75A
M
L
K
J
I
H
G
F
E
D
C
B
A
Clear-Time (s)
0.1
K = 6.0A
L = 7.0A
M = 8.0A
I²t (A²s)
J = 5.0A
1
0.1
0.01
0.01
0.001
0.1
1
10
100
0.001
0.001
0.01
0.1
1
10
Current (A)
Note:
Curves are nominal
Time (s)
Table FF3 Environmental Specifications for Fast-Acting Chip Fuses
Operating temperature
Mechanical vibration
Mechanical shock
Thermal shock
Resistance to soldering heat
Solderability
Moisture resistance
Salt spray
-55°C to +125°C
Withstands 5-3000 Hz at 30 Gs when evaluated per Method 204 of MIL-STD-202
Withstands 1500 Gs, 0.5 millisecond half-sine pulses when evaluated per Method 213 of MIL-STD-202
Withstands 100 cycles from -65°C to +125°C when evaluated per Method 107 of MIL-STD-202
Withstands 60 seconds at +260°C when evaluated per Method 210 of MIL-STD-202
Meets 95% minimum coverage requirement when evaluated per Method 208 of MIL-STD-202
Withstands 10 cycles when evaluated per Method 106 of MIL-STD-202
Withstands 48-hour exposure when evaluated per Method 101 of MIL-STD-202
11
Table FF4 Material Specifications for Fast-Acting Chip Fuses
Construction body material
Termination material
Fuse element
Ceramic
Silver, Nickel, Tin
Silver
Figure FF7 Thermal Derating Current for Fast-Acting Chip Fuses
Temperature Effect on Current Rating
105
100
95
90
85
80
75
70
65
60
55
50
45
40
35
30
25
20
15
10
5
0
-55
% De-rating
-35
-15
5
25
45
65
85
105
125
145
Maximum Operating Temperature (˚C)
102
RoHS Compliant, ELV Compliant
HF
Halogen Free
Fast-Acting Chip Fuses
Table FF5 Electrical Specifications for Fast-Acting Chip Fuses
Insulation resistance after opening
20,000Ω minimum @ rated voltage. Fuse clearing under low voltage conditions may result in lower -
post-clearing insulation values. Under normal fault conditions values. Under normal fault conditions
Raychem fuses provide sufficient insulation resistance for circuit protection.
Withstands 100% rated current at +25°C ambient for 4 hours when evaluated per MIL-PRF-23419.
Current carrying capacity
Table FF6 Packaging Information for Fast-Acting Chip Fuses
Size
0402 (1005)
0603 (1608)
1206 (3216)
Reel Quantity
(pcs)
10,000
4,000
3,000
Reel Diameter
178mm white plastic
178mm white plastic
178mm white plastic
Reel Width
9.0 ± 0.5mm
9.0 ± 0.5mm
9.0 ± 0.5mm
Carrier
Tape Size
8.00 ± 0.10mm
8.00 ± 0.10mm
8.00 ± 0.10mm
Tape Type
Paper
Plastic
Plastic
Reels per Outside
Shipment Box
5
5
5
Outside Shipment
Boxes per Overpack
5
5
5
Figure FF8 Recommended Soldering Temperature Profile for Fast-Acting Chip Fuses
Soldering
10s Max.
260
Natural
Cooling
Temperature (˚C)
230
40s Max.
150-180
Preheat 60 - 120s Min.
Time (s)
Recommended conditions for hand soldering:
1. Using hot air rework station that can reflow the solder on both terminations at the same time is strongly recommended,
do not directly contact the chip termination with the tip of soldering iron.
2. Preheating: 150°C, 60s (min).
Appropriate temperature (max) of soldering iron tip/soldering time (max): 280°C /10s or 350°C / 3s.
Maximum temperature of soldering iron tip/soldering time: 350°C /9s or 400°C / 8s.
Table FF7 Tape and Reel Material Characteristics for Fast-Acting Chip Fuses
Tolerance X ± 1mm; 0.X ± 0.5mm; 0.XX ± 0.2mm
Range
Performance
MVR
Vicat softening temperature
Elasticity at break
Testing Method
ASTM D1238
ASTM D1525
ASTM D638
Min.
3.60
97.8
50.0
Max.
4.40
-
-
11
Table FF8 Tape and Reel Specifications for Fast-Acting Chip Fuses
Dimension in inches (mm)
Mark
E
1
F
W
P
1
P
0
P
2
D
0
D
1
t
A
0
B
0
K
0
0402 (1005)
0.069±0.004
0.138±0.002
0.318±0.004
0.079±0.004
0.157±0.004
0.040±0.002
0.059±0.004
-
0.009±0.001
0.026±0.004
0.046±0.004
0.025±0.004
(1.75±0.10)
(3.50±0.05)
(8.00±0.10)
(2.00±0.10)
(4.00±0.10)
(1.00±0.05)
(1.50+0.10/-0.00)
-
(0.23±0.02)
(0.67±0.10)
(1.17±0.10)
(0.63±0.10)
0603 (1608)
0.069±0.004
0.138±0.002
0.318±0.004
0.157±0.004
0.157±0.004
0.079±0.002
0.059±0.004
-
0.009±0.001
0.036±0.004
0.071±0.004
0.033±0.004
(1.75±0.10)
(3.50±0.05)
(8.00±0.10)
(4.00±0.10)
(4.00±0.10)
(2.00±0.05)
(1.50+0.10/-0.00)
-
(0.23±0.02)
(0.92±0.10)
(1.80±0.10)
(0.85±0.10)
1206 (3216)
0.069±0.004
0.138±0.002
0.318±0.004
0.157±0.004
0.157±0.004
0.079±0.002
0.059±0.004
0.039 max
0.009±0.001
0.071±0.004
0.138±0.004
0.050±0.004
(1.75±0.10)
(3.50±0.05)
(8.00±0.10)
(4.00±0.10)
(4.00±0.10)
(2.00±0.05)
(1.50+0.10/-0.00)
(1.00 max)
(0.23±0.02)
(1.80±0.10)
(3.50±0.10)
(1.27±0.10)
RoHS Compliant, ELV Compliant
HF
Halogen Free
103
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