2.1 General ...................................................................................................................................................................1
2.2 Government documents ..........................................................................................................................................2
2.2.1 Specifications, standards, and handbooks ...........................................................................................................2
2.2.2 Other Government documents, drawings, and publications .................................................................................2
2.4 Order of precedence ...............................................................................................................................................3
3.1 General ...................................................................................................................................................................3
3.1.1 Reference to applicable device specification........................................................................................................3
3.3.1 Manufacturer's review system ..............................................................................................................................5
3.3.3 Self-assessment program ....................................................................................................................................5
3.3.4 Change control procedures ..................................................................................................................................5
3.3.4.1 Discontinuation of products ...............................................................................................................................5
3.4 Requirements for listing on a QML ..........................................................................................................................5
3.4.1.1 Process capability demonstration......................................................................................................................6
3.4.1.1.1 New technology insertion ...............................................................................................................................6
3.4.1.2 Management and technology validation ............................................................................................................7
3.4.1.3.1 Second and third party validations .................................................................................................................7
3.4.1.3.2 Radiation source of supply (RSS) validations ................................................................................................7
3.4.1.6 Change management system ...........................................................................................................................9
3.4.1.7 Deficiencies and concerns ................................................................................................................................9
3.4.1.8 Letter of certification ..........................................................................................................................................9
3.4.5 Maintenance and retention of QML .................................................................................................................... 10
3.4.6 QML line shutdown ............................................................................................................................................ 10
3.4.8 Performance requirements for class T devices .................................................................................................. 10
3.4.8.1 Class T radiation requirements ....................................................................................................................... 11
3.6 Marking of microcircuits ........................................................................................................................................ 11
3.6.1 Index point.......................................................................................................................................................... 11
3.6.2 Part or identification number (PIN) ..................................................................................................................... 12
3.6.2.2.1 Military designator ........................................................................................................................................ 13
3.6.2.3 Device class designator .................................................................................................................................. 13
3.6.2.4 Case outline .................................................................................................................................................... 13
3.6.2.5 Lead finish ....................................................................................................................................................... 13
3.6.3 Certification mark ............................................................................................................................................... 13
3.6.3.1 QD certification mark ....................................................................................................................................... 13
ii
MIL-PRF-38535K
CONTENTS
PARAGRAPH
PAGE
3.6.3.2 JAN or J mark ................................................................................................................................................. 14
3.6.4.1 Code for assembly sites .................................................................................................................................. 14
3.6.5 Country of origin ................................................................................................................................................. 14
3.6.6 Date code ........................................................................................................................................................... 14
3.6.7 Marking location and sequence.......................................................................................................................... 14
3.6.9 Marking on container.......................................................................................................................................... 15
3.8 Screening and test ................................................................................................................................................ 15
3.12 ESD control ......................................................................................................................................................... 15
3.13 Recycled, recovered, or environmentally preferable materials ............................................................................ 15
3.14 Alternate test requirements ................................................................................................................................. 16
3.15 Passive elements ................................................................................................................................................ 16
6.1 Intended use ......................................................................................................................................................... 34
6.1.1 Class T ............................................................................................................................................................... 34
6.4.2 Element (of a microcircuit or integrated circuit) .................................................................................................. 34
6.4.3 Substrate (of a microcircuit or integrated circuit) ................................................................................................ 35
6.4.5 Production lot ..................................................................................................................................................... 35
6.4.6 Inspection lot ...................................................................................................................................................... 35
6.4.7 Wafer lot ............................................................................................................................................................. 35
6.4.11 Final seal .......................................................................................................................................................... 35
6.4.13 Qualifying activity (QA) ..................................................................................................................................... 36
6.4.14 Parts per million (PPM) .................................................................................................................................... 36
6.4.15 Device type ...................................................................................................................................................... 36
iii
MIL-PRF-38535K
CONTENTS
PARAGRAPH
PAGE
6.4.16 Die type ............................................................................................................................................................ 36
6.4.19 Package family ................................................................................................................................................. 36
6.4.22 Third party design center.................................................................................................................................. 36
6.4.23 Radiation source of supply (RSS) .................................................................................................................... 36
6.4.24 Form ................................................................................................................................................................. 36
6.4.25 Fit ..................................................................................................................................................................... 36
6.4.26 Function ........................................................................................................................................................... 36
6.4.27 Class M ............................................................................................................................................................ 37
6.4.28 Class N............................................................................................................................................................. 37
6.4.29 Class Q ............................................................................................................................................................ 37
6.4.30 Class V ............................................................................................................................................................. 37
6.4.31 Class Y ............................................................................................................................................................. 37
6.4.32 Class B ............................................................................................................................................................. 37
6.4.33 Class S ............................................................................................................................................................. 37
6.4.34 Class T ............................................................................................................................................................. 37
6.4.35 Qualified manufacturer’s line ............................................................................................................................ 37
6.4.36 Test optimization .............................................................................................................................................. 37
6.4.37 Audit team ........................................................................................................................................................ 37
6.4.38 Class level B .................................................................................................................................................... 37
6.4.39 Class level S .................................................................................................................................................... 37
6.4.40 Class level vs Class ......................................................................................................................................... 38
6.4.41 Second party facility ......................................................................................................................................... 38
6.4.42 Third party facility ............................................................................................................................................. 38
6.4.43 New technology................................................................................................................................................ 38
6.4.45 Lot date code ................................................................................................................................................... 38
6.4.46 Storage temperature ........................................................................................................................................ 38
6.7 Subject term (key word) listing .............................................................................................................................. 42
6.8 List of acronyms .................................................................................................................................................... 43
6.9 Environmentally preferable material ...................................................................................................................... 45
6.10 Changes from previous issue .............................................................................................................................. 45
A.2.1 General .............................................................................................................................................................. 46
A.2.2 Government documents..................................................................................................................................... 46
A.2.2.1 Specifications, standards, and handbooks...................................................................................................... 46
A.2.2.2 Other Government documents, drawings, and publications............................................................................ 47
A.2.4 Order of precedence .......................................................................................................................................... 48
A.3.1 General .............................................................................................................................................................. 48
A.3.1.1 Reference to device specification or drawing.................................................................................................. 48
A.3.1.3.2 Element (of a microcircuit or integrated circuit) ............................................................................................ 49
iv
MIL-PRF-38535K
CONTENTS
PARAGRAPH
PAGE
A.3.1.3.3 Substrate (of a microcircuit or integrated circuit).......................................................................................... 49
A.3.1.3.4.4 Film microcircuit (or film integrated circuit)................................................................................................ 49
A.3.1.3.6 Production lot ............................................................................................................................................... 50
A.3.1.3.7 Inspection lot - class level S......................................................................................................................... 50
A.3.1.3.8 Inspection lot - class level B......................................................................................................................... 50
A.3.1.3.9 Inspection sublot - class level S ................................................................................................................... 50
A.3.1.3.10 Inspection lot split - class level B ............................................................................................................... 50
A.3.1.3.11 Wafer lot .................................................................................................................................................... 50
A.3.1.3.12 Package type ............................................................................................................................................. 50
A.3.1.3.13 Microcircuit group ...................................................................................................................................... 50
A.3.1.3.17 Final seal ................................................................................................................................................... 51
A.3.1.3.19 Qualifying activity ....................................................................................................................................... 51
A.3.1.3.20 Device type ................................................................................................................................................ 51
A.3.1.3.21 Die type...................................................................................................................................................... 51
A.3.1.3.29 Die family ................................................................................................................................................... 52
A.3.1.3.30 Package family .......................................................................................................................................... 52
A.3.1.3.31 Military operating temperature range ......................................................................................................... 52
A.3.1.3.32 Process monitor ......................................................................................................................................... 52
A.3.1.3.34 Class level B .............................................................................................................................................. 52
A.3.1.3.35 Class level S .............................................................................................................................................. 52
A.3.2.1 Electrical test requirements............................................................................................................................. 52
A.3.2.2.1 Example C of C............................................................................................................................................ 53
A.3.2.2.2 Die evaluation requirements ........................................................................................................................ 54
A.3.3 Classification of requirements ............................................................................................................................ 54
A.3.3.1 Certification of conformance and acquisition traceability ................................................................................ 55
A.3.4.1.2.3 Die attachment.......................................................................................................................................... 56
A.3.4.1.2.4 Lid seal ..................................................................................................................................................... 56
A.3.4.1.2.6 Lead trimming and final lead finish thickness............................................................................................ 57
A.3.4.1.3 Qualification to RHA levels .......................................................................................................................... 57
The 16th China Auto Accessories and Modified Cars ExhibitionExhibition venue: China International Exhibition Center (New Hall), No. 88 Yuxiang Road, Tianzhu, Shunyi, BeijingDate: March 1, 2013 to Marc...
[i=s] This post was last edited by Wuxia Amon on 2015-2-17 17:36 [/i] Error (10500): VHDL syntax error at bell.vhd(80) near text "process"; expecting "if" I have just started learning cpld, and the fo...
[i=s] This post was last edited by paulhyde on 2014-9-15 03:56 [/i] How can I connect the external circuit of mc145162 and mc1648 to generate a sinusoidal signal with a stepping frequency of 50khz fro...
question:
Wireless communication technology is the transmission basis of the Internet of Things. As smart city applications become a hot development, various technologies are constantly being innovate...
【EEWORLD University】Play with LaunchPad and TI MSP430G2XX series of super-value microcontrollers! ! ! https://bbs.eeworld.com.cn/TI/TI_study20111008/index.htmlThe event is still going on and will end ...
On August 22, Lantu Motors officially launched its Lanhai Intelligent Hybrid technology via an online livestream. This intelligent hybrid technology, which integrates a full-range 800V high-voltage...[Details]
Robotics
has become
LiDAR
's "second growth curve."
While LiDAR was still battling with its "pure vision" rivals in the automotive field, another field ignited the demand f...[Details]
The all-new MG4 was recently officially announced on the Ministry of Industry and Information Technology's (MIIT) new vehicle announcement. The all-new MG4's semi-solid-state battery version addres...[Details]
On August 20, Geely announced its focus on "One Cockpit". Through a unified AI OS architecture, a unified AI Agent, and a unified user ID, it will achieve an All-in-One AI cockpit, create the first...[Details]
On August 21st, BYD announced the launch of its next-generation "Little White Pile" product, the "Lingchong"
charging
pile
, which is now available for general sale. This charging pile feat...[Details]
Wearable technology is taking off, with applications evolving rapidly, from smartwatches to fitness trackers and even smart wigs! Bluetooth Smart is at the center of this revolution. This is the se...[Details]
As the electric vehicle industry continues to surge in today's society, while people are concerned about the appearance and interior of new energy vehicles, they are also concerned about the classi...[Details]
In industrial production, many different controllers are often used, such as those for pressure, flow, electrical parameters, temperature, and sound. However, due to the limitations of the on-site ...[Details]
In machine vision systems, light sources play a crucial role. Choosing the right light source is a key factor in determining the success or failure of the entire system. The main purpose of the lig...[Details]
The number of new energy vehicles in use is increasing, and there are multiple choices available. New energy vehicles can be divided into hybrid and pure electric, and the types of hybrid include m...[Details]
1. Introduction to power amplifier circuit
1. Generally speaking, the main function of a power amplifier circuit is to allow the load to obtain maximum power without distorting the signal or c...[Details]
We often notice that some safety light curtains have EDM function. What does EDM mean here? What is its function?
The full name of EDM is External Device Monitor, which means external device m...[Details]
Robots are rapidly being deployed in diverse scenarios. Flexible, easy-to-use, and fast-to-deploy robots can be quickly adapted to diverse application scenarios across various industries, making th...[Details]
Hesai Technology (Nasdaq: HSAI), a leading global lidar developer and manufacturer, today announced it has been awarded a production contract for lidar systems for a Toyota Motor joint venture. Toy...[Details]
The reducer is a crucial mechanical device. If you know anything about industrial machinery, you've undoubtedly heard of it. As a transmission device, it plays a crucial role in many industrial app...[Details]
Industrial Control Electronics
京公网安备 11010802033920号
EEWORLD
