2.1 General ...................................................................................................................................................................1
2.2 Government documents ..........................................................................................................................................2
2.2.1 Specifications, standards, and handbooks ...........................................................................................................2
2.2.2 Other Government documents, drawings, and publications .................................................................................2
2.4 Order of precedence ...............................................................................................................................................3
3.1 General ...................................................................................................................................................................3
3.1.1 Reference to applicable device specification........................................................................................................3
3.3.1 Manufacturer's review system ..............................................................................................................................5
3.3.3 Self-assessment program ....................................................................................................................................5
3.3.4 Change control procedures ..................................................................................................................................5
3.3.4.1 Discontinuation of products ...............................................................................................................................5
3.4 Requirements for listing on a QML ..........................................................................................................................5
3.4.1.1 Process capability demonstration......................................................................................................................6
3.4.1.1.1 New technology insertion ...............................................................................................................................6
3.4.1.2 Management and technology validation ............................................................................................................7
3.4.1.3.1 Second and third party validations .................................................................................................................7
3.4.1.3.2 Radiation source of supply (RSS) validations ................................................................................................7
3.4.1.6 Change management system ...........................................................................................................................9
3.4.1.7 Deficiencies and concerns ................................................................................................................................9
3.4.1.8 Letter of certification ..........................................................................................................................................9
3.4.5 Maintenance and retention of QML .................................................................................................................... 10
3.4.6 QML line shutdown ............................................................................................................................................ 10
3.4.8 Performance requirements for class T devices .................................................................................................. 10
3.4.8.1 Class T radiation requirements ....................................................................................................................... 11
3.6 Marking of microcircuits ........................................................................................................................................ 11
3.6.1 Index point.......................................................................................................................................................... 11
3.6.2 Part or identification number (PIN) ..................................................................................................................... 12
3.6.2.2.1 Military designator ........................................................................................................................................ 13
3.6.2.3 Device class designator .................................................................................................................................. 13
3.6.2.4 Case outline .................................................................................................................................................... 13
3.6.2.5 Lead finish ....................................................................................................................................................... 13
3.6.3 Certification mark ............................................................................................................................................... 13
3.6.3.1 QD certification mark ....................................................................................................................................... 13
ii
MIL-PRF-38535K
CONTENTS
PARAGRAPH
PAGE
3.6.3.2 JAN or J mark ................................................................................................................................................. 14
3.6.4.1 Code for assembly sites .................................................................................................................................. 14
3.6.5 Country of origin ................................................................................................................................................. 14
3.6.6 Date code ........................................................................................................................................................... 14
3.6.7 Marking location and sequence.......................................................................................................................... 14
3.6.9 Marking on container.......................................................................................................................................... 15
3.8 Screening and test ................................................................................................................................................ 15
3.12 ESD control ......................................................................................................................................................... 15
3.13 Recycled, recovered, or environmentally preferable materials ............................................................................ 15
3.14 Alternate test requirements ................................................................................................................................. 16
3.15 Passive elements ................................................................................................................................................ 16
6.1 Intended use ......................................................................................................................................................... 34
6.1.1 Class T ............................................................................................................................................................... 34
6.4.2 Element (of a microcircuit or integrated circuit) .................................................................................................. 34
6.4.3 Substrate (of a microcircuit or integrated circuit) ................................................................................................ 35
6.4.5 Production lot ..................................................................................................................................................... 35
6.4.6 Inspection lot ...................................................................................................................................................... 35
6.4.7 Wafer lot ............................................................................................................................................................. 35
6.4.11 Final seal .......................................................................................................................................................... 35
6.4.13 Qualifying activity (QA) ..................................................................................................................................... 36
6.4.14 Parts per million (PPM) .................................................................................................................................... 36
6.4.15 Device type ...................................................................................................................................................... 36
iii
MIL-PRF-38535K
CONTENTS
PARAGRAPH
PAGE
6.4.16 Die type ............................................................................................................................................................ 36
6.4.19 Package family ................................................................................................................................................. 36
6.4.22 Third party design center.................................................................................................................................. 36
6.4.23 Radiation source of supply (RSS) .................................................................................................................... 36
6.4.24 Form ................................................................................................................................................................. 36
6.4.25 Fit ..................................................................................................................................................................... 36
6.4.26 Function ........................................................................................................................................................... 36
6.4.27 Class M ............................................................................................................................................................ 37
6.4.28 Class N............................................................................................................................................................. 37
6.4.29 Class Q ............................................................................................................................................................ 37
6.4.30 Class V ............................................................................................................................................................. 37
6.4.31 Class Y ............................................................................................................................................................. 37
6.4.32 Class B ............................................................................................................................................................. 37
6.4.33 Class S ............................................................................................................................................................. 37
6.4.34 Class T ............................................................................................................................................................. 37
6.4.35 Qualified manufacturer’s line ............................................................................................................................ 37
6.4.36 Test optimization .............................................................................................................................................. 37
6.4.37 Audit team ........................................................................................................................................................ 37
6.4.38 Class level B .................................................................................................................................................... 37
6.4.39 Class level S .................................................................................................................................................... 37
6.4.40 Class level vs Class ......................................................................................................................................... 38
6.4.41 Second party facility ......................................................................................................................................... 38
6.4.42 Third party facility ............................................................................................................................................. 38
6.4.43 New technology................................................................................................................................................ 38
6.4.45 Lot date code ................................................................................................................................................... 38
6.4.46 Storage temperature ........................................................................................................................................ 38
6.7 Subject term (key word) listing .............................................................................................................................. 42
6.8 List of acronyms .................................................................................................................................................... 43
6.9 Environmentally preferable material ...................................................................................................................... 45
6.10 Changes from previous issue .............................................................................................................................. 45
A.2.1 General .............................................................................................................................................................. 46
A.2.2 Government documents..................................................................................................................................... 46
A.2.2.1 Specifications, standards, and handbooks...................................................................................................... 46
A.2.2.2 Other Government documents, drawings, and publications............................................................................ 47
A.2.4 Order of precedence .......................................................................................................................................... 48
A.3.1 General .............................................................................................................................................................. 48
A.3.1.1 Reference to device specification or drawing.................................................................................................. 48
A.3.1.3.2 Element (of a microcircuit or integrated circuit) ............................................................................................ 49
iv
MIL-PRF-38535K
CONTENTS
PARAGRAPH
PAGE
A.3.1.3.3 Substrate (of a microcircuit or integrated circuit).......................................................................................... 49
A.3.1.3.4.4 Film microcircuit (or film integrated circuit)................................................................................................ 49
A.3.1.3.6 Production lot ............................................................................................................................................... 50
A.3.1.3.7 Inspection lot - class level S......................................................................................................................... 50
A.3.1.3.8 Inspection lot - class level B......................................................................................................................... 50
A.3.1.3.9 Inspection sublot - class level S ................................................................................................................... 50
A.3.1.3.10 Inspection lot split - class level B ............................................................................................................... 50
A.3.1.3.11 Wafer lot .................................................................................................................................................... 50
A.3.1.3.12 Package type ............................................................................................................................................. 50
A.3.1.3.13 Microcircuit group ...................................................................................................................................... 50
A.3.1.3.17 Final seal ................................................................................................................................................... 51
A.3.1.3.19 Qualifying activity ....................................................................................................................................... 51
A.3.1.3.20 Device type ................................................................................................................................................ 51
A.3.1.3.21 Die type...................................................................................................................................................... 51
A.3.1.3.29 Die family ................................................................................................................................................... 52
A.3.1.3.30 Package family .......................................................................................................................................... 52
A.3.1.3.31 Military operating temperature range ......................................................................................................... 52
A.3.1.3.32 Process monitor ......................................................................................................................................... 52
A.3.1.3.34 Class level B .............................................................................................................................................. 52
A.3.1.3.35 Class level S .............................................................................................................................................. 52
A.3.2.1 Electrical test requirements............................................................................................................................. 52
A.3.2.2.1 Example C of C............................................................................................................................................ 53
A.3.2.2.2 Die evaluation requirements ........................................................................................................................ 54
A.3.3 Classification of requirements ............................................................................................................................ 54
A.3.3.1 Certification of conformance and acquisition traceability ................................................................................ 55
A.3.4.1.2.3 Die attachment.......................................................................................................................................... 56
A.3.4.1.2.4 Lid seal ..................................................................................................................................................... 56
A.3.4.1.2.6 Lead trimming and final lead finish thickness............................................................................................ 57
A.3.4.1.3 Qualification to RHA levels .......................................................................................................................... 57
[size=4]Description[/size] [size=4]This reference design is an excitation amplifier and analog front end for resolver sensors. The design implements discrete components and standard op amps on a print...
Can anyone send me the IAR library for G2553 and G2452? I downloaded one, but it may be too old. The library does not have these two chips. Launchpad needs these two chips. If anyone has them, can you...
[size=4] On June 7, 2018, the State Administration for Market Regulation and the National Standardization Administration issued the 2018 China National Standards Announcement No. 9, approving the rele...
There are a lot of things, so I won’t post them directly. You can find them in the bloghttp://blog.eeworld.com.cn/user1/5817/archives/2009/63307.html...
The customer requires that we add PDA wireless ordering function to our existing catering management system. Please help us. Cash reward!!! Requirements: Read the contents of the specified table and w...
Magnetic resonance imaging (MRI) systems can take high-resolution cross-sectional perspective images of the human body, providing very useful information for medical diagnosis. The radio frequency pro...[Details]
1 Introduction
The integration of sensor technology and RFID has just started. As one of the world's major manufacturing and consumer countries, China should seize this opportunit...[Details]
PCI (Perip heral Component Interconnect) is an advanced high-performance 32/64-bit local bus that supports linear burst transmission and has a maximum data transmission rate of 132MB/s. At the same...[Details]
As mobile phones have evolved from simple voice communication tools to multimedia devices that integrate communication, imaging, and gaming, application processors are replacing baseband chips as t...[Details]
Many MEMS devices, such as accelerometers and mechanical resonance devices, require a vacuum environment to realize their designed functions. However, verifying whether the package cavity has reach...[Details]
Wireless personal area networks (or WPANs) are particularly useful for sensing, monitoring, and control applications. Cost-effective WPANs have the unique potential to implement wireless connectivi...[Details]
Preface
In the analog era, due to the unchanged specifications and relatively simple device connections, as well as users' low requirements for image quality, the relatively simple environment...[Details]
Abstract:
This paper
introduces a data acquisition system based on USB and DSP, which takes advantage of the high-speed transmission characteristics of USB2.0. The overall structure of the ...[Details]
Abstract: This paper introduces the origin and new features of MP4, and introduces the core audio compression technology MPEG-2 AAC (Advanced Audio Coding) based on MP4. Finally, it briefly summari...[Details]
Multimedia communication terminal equipment has a wide range of application prospects and can be applied to various fields such as video conferencing, videophone, PDA, digital television, etc. Therefo...[Details]
With the continuous development of digital television, the demand for high-definition is imperative. H.264, as a new generation of compression standard, has a more complete algorithm than MPEG-2, ...[Details]
1 Introduction
With the rise of my country's automobile industry, the demand for related in-vehicle electronic products is growing, and has become a research and development hotspot in the...[Details]
1 Introduction
Bandgap reference sources are widely used in various integrated circuits. With the increasing development of modern integrated circuits, bandgap reference sources play ...[Details]
After being widely adopted in applications such as backlighting of portable products with small and medium-sized screens, light-emitting diodes (LEDs) have entered the field of general lighting in ...[Details]
In view of the fact that a single ordinary type of fire detection alarm can no longer meet the demand, the use of multiple sensors to comprehensively collect various abnormal information before a f...[Details]
Microcontroller MCU
京公网安备 11010802033920号
EEWORLD
