REVISIONS
LTR
A
B
C
D
E
F
DESCRIPTION
Added changes in accordance with NOR 5962-R116-94.
Added 03 device, removed CAGE number 01295, and made editorial
changes throughout.
Added changes in accordance with NOR 5962-R059-97.
Added changes in accordance with NOR 5962-R193-97.
Corrected radiation circuit. Updated boilerplate. ksr
Add 04 and 05 devices, change case outlines from CQCC2-F172 to
figure 4. Page 3, section 1.3 changed T
J
from 175°C to 150°C.
Added appendix A for die. Added CQFP package option case U, and
binning circuitry delay for 04 and 05 in Table IA. ksr
Change the generic number for the 01 and 02 devices as well as the
bin speed. Update the binning circuit delay on table IA. Update the
bin speed for the 01 device in section 10.2.2. ksr
Replaced figure 1, case outline Y with new graphic art work. ksr
DATE
(YR-MO-DA)
94-03-03
96-07-09
96-11-12
97-03-03
98-03-31
APPROVED
M. A. Frye
M. A. Frye
Raymond Monnin
Raymond Monnin
Raymond Monnin
98-09-18
Raymond Monnin
G
98-11-15
Raymond Monnin
H
00-04-28
Raymond Monnin
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
H
15
H
16
H
17
H
18
REV
SHEET
PMIC N/A
PREPARED BY
Rajesh Pithadia
CHECKED BY
Jeff Bowling
MICROCIRCUIT, MEMORY, DIGITAL, CMOS, FIELD
PROGRAMMABLE GATE ARRAY, 8000 GATES, MONOLITHIC
SILICON
H
19
H
20
H
21
H
1
H
22
H
2
H
23
H
3
H
24
H
4
H
25
H
5
H
26
H
6
H
27
H
7
H
28
H
8
H
29
H
9
H
30
H
10
H
31
H
11
H
32
H
12
H
33
H
13
H
34
H
14
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 42316
http://www.dscc.dla.mil
APPROVED BY
Michael A. Frye
DRAWING APPROVAL DATE
93-04-07
SIZE
REVISION LEVEL
H
SHEET
1
OF
33
CAGE CODE
A
67268
5962-92156
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E231-00
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and
M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the
Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the
PIN.
1.2 PIN. The PIN shall be as shown in the following example:
5962
H
92156
01
V
X
X
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and
are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) shall identify the circuit function as follows:
Device type
01
02
03
04
05
Generic number
1280A
1280A-1
RH1280
1280XL
1280XL-1
Circuit function
8000 gate field programmable gate array
8000 gate field programmable gate array
8000 gate field programmable gate array
8000 gate field programmable gate array
8000 gate field programmable gate array
Bin speed
200 ns
170 ns
160 ns
120 ns
102 ns
1.2.3 Device class designator. The device class designator shall be a single letter identifying the product assurance level as
follows:
Device class
M
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant,
non-JAN class level B microcircuits in accordance with MIL-PRF-38535,
appendix A
Certification and qualification to MIL-PRF-38535
Q or V
1.2.4 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter
X
Y
Z
U
Descriptive designator
CMGA7 - P176
See figure 1
CMGA7 - P176
See figure 1
Terminals
176
172
177
172
Package style
Pin grid array
Quad flat pack
Pin grid array with orientation pin
Quad flat pack
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix
A for device class M.
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 42316
DSCC FORM 2234
APR 97
A
REVISION LEVEL
5962-92156
SHEET
H
2
1.3 Absolute maximum ratings. 1/
DC supply voltage range (V
CC
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range (V
I
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage range (V
O
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current (I
IC
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current (I
OC
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current (I
O
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range (T
STG
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature (soldering, 10 seconds) . . . . . . . . . . . . . . . . . . . . . . . .
Thermal resistance, junction-to-case (
JC
) :
Case X and Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Case Y and U . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum junction temperature (T
J
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.4 Recommended operating conditions.
Supply voltage (V
CC
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +4.5 V dc to +5.5 V dc
Case operating temperature range (T
C
) . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C
Radiation: Total dose . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300K rads (maximum) 3/
1.5 Digital logic testing for device classes Q and V.
Fault coverage measurement of manufacturing
logic tests (MIL-STD-883, test method 5012) . . . . . . . . . . . . . . . . . . . . . . 100 percent 4/
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in
the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-973 - Configuration Management.
MIL-STD-1835 - Interface Standard For Microcircuit Case Outlines.
-0.5 V dc to +7.0 V dc
-0.5 V dc to V
CC
+ 0.5 V dc
-0.5 V dc to V
CC
+ 0.5 V dc
±20 mA
±20 mA
±25 mA
-65°C to +150°C
300°C
See MIL-STD-1835
10°C/W 2/
+150°C
1/
2/
3/
4/
Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
When the thermal resistance for this case is specified in MIL-STD-1835, that value shall supersede the value indicated
herein.
Device electrical characteristics are guaranteed for post irradiation levels at 25°C, in low dose rate environment (post 168
hours, 100°C, biased anneal).
100 percent test coverage of blank programmable logic devices.
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 42316
DSCC FORM 2234
APR 97
A
REVISION LEVEL
5962-92156
SHEET
H
3
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 - List of Standard Microcircuit Drawings (SMD's).
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein.
Unless otherwise specified, the issues of the documents which are DoD adopted are those listed in the issue of the DODISS
cited in the solicitation. Unless otherwise specified, the issues of documents not listed in the DODISS are the issues of the
documents cited in the solicitation.
AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM)
ASTM Standard F1192M-95
-
Standard Guide for the Measurement of Single Event Phenomena from
Heavy Ion Irradiation of Semiconductor Devices.
(Applications for copies of ASTM publications should be addressed to the American Society for Testing and Materials,
1916 Race Street, Philadelphia, PA 19103.)
ELECTRONICS INDUSTRIES ASSOCIATION (EIA)
JEDEC Standard EIA/JESD 78
-
IC Latch-Up Test.
(Applications for copies should be addressed to the Electronics Industries Association, 2500 Wilson Boulevard, Arlington,
VA 22201.)
(Non-Government standards and other publications are normally available from the organizations that prepare or distribute
the documents. These documents also may be available in or through libraries or other informational services.)
2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the
text of this drawing shall take precedence. Nothing in this document, however, supersedes applicable laws and regulations
unless a specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-
38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification
in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class
M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as
specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device
class M.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 and figure 1herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Truth table(s).
3.2.3.1 Unprogrammed devices. The truth table or test vectors for unprogrammed devices for contracts involving no
altered item drawing is not part of this drawing. When required in screening (see 4.2 herein) or quality conformance
inspection group A, B, C, D, or E (see 4.4 herein), the devices shall be programmed by the manufacturer prior to test. A
minimum of 50 percent of the total number of logic modules shall be utilized or at least 25 percent of the total logic modules
shall be utilized for any altered item drawing pattern.
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 42316
DSCC FORM 2234
APR 97
A
REVISION LEVEL
5962-92156
SHEET
H
4
3.2.3.2 Programmed devices. The truth table or test vectors for programmed devices shall be as specified by an attached
altered item drawing.
3.2.4 Switching test circuit and waveforms . The switching test circuit and waveforms diagram shall be as specified on
figure 3.
3.2.5 Radiation exposure circuit. The radiation exposure circuit shall be as specified on figure 4.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table IA and shall apply over
the full case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The
electrical tests for each subgroup are defined in table IA.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space
limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the
RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535.
Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as
required in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535,
appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a
QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M,
a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in
MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved
source of supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the
requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and
herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in
MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits
delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2
herein) involving devices acquired to this drawing is required for any change as defined in MIL-STD-973.
3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain
the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be
made available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 42 (see MIL-PRF-38535, appendix A).
3.11 Processing options. Since the device is capable of being programmed by either the manufacturer or the user to
result in a wide variety of configurations; two processing options are provided for selection in the contract, using an altered
item drawing.
3.11.1 Unprogrammed device delivered to the user. All testing shall be verified through group A testing as defined in 4.4.1
and table IIA. It is recommended that users perform subgroups 7 and 9 after programming to verify the specific program
configuration.
3.11.2 Manufacturer-programmed device delivered to the user. All testing requirements and quality assurance provisions
herein, including the requirements of the altered item drawing, shall be satisfied by the manufacturer prior to delivery.
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 42316
DSCC FORM 2234
APR 97
A
REVISION LEVEL
5962-92156
SHEET
H
5
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