27HC641L-70/SP datasheet, PDF - EEWORLD Datasheet

27HC641L-70/SP: Description8K X 8 OTPROM, 70 ns, PDIP24, 0.300 INCH, SKINNY, PLASTIC, DIP-24; Categorystorage storage; File Size224KB，8 Pages; ManufacturerMicrochip; Websitehttps://www.microchip.com

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27HC641L-70/SP Overview

8K X 8 OTPROM, 70 ns, PDIP24, 0.300 INCH, SKINNY, PLASTIC, DIP-24

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	DIP
package instruction	0.300 INCH, SKINNY, PLASTIC, DIP-24
Contacts	24
Reach Compliance Code	_compli
ECCN code	EAR99
Maximum access time	70 ns
I/O type	COMMON
JESD-30 code	R-PDIP-T24
JESD-609 code	e0
length	34.67 mm
memory density	65536 bi
Memory IC Type	OTP ROM
memory width	8
Number of functions	1
Number of terminals	24
word count	8192 words
character code	8000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	8KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	4.06 mm
Maximum standby current	0.0001 A
Maximum slew rate	0.082 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm
Base Number Matches	1

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