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5962R1022902QYC

Description
Synchronous DRAM
Categorystorage    storage   
File Size1MB,69 Pages
ManufacturerCobham Semiconductor Solutions
Download Datasheet Parametric View All

5962R1022902QYC Overview

Synchronous DRAM

5962R1022902QYC Parametric

Parameter NameAttribute value
MakerCobham Semiconductor Solutions
package instruction,
Reach Compliance Codeunknow
Memory IC TypeSYNCHRONOUS DRAM
Certification statusNot Qualified
total dose100k Rad(Si) V
Standard Products
UT8SDMQ64M40 2.5-Gigabit SDRAM MCM
UT8SDMQ64M48 3.0-Gigabit SDRAM MCM
Datasheet
October 18, 2013
FEATURES
Organized as 64M x 40 (16Meg x 40 x 4 banks) and 64M
x 48 (16Meg x 48 x 4 banks)
Single 3.3V power supply
Maximum frequency: 100 MHz
Operation -40
o
C to +105
o
C
LVTTL compatible with multiplexed address
Fully synchronous; all signals registered on positive edge
of system clock
Internal pipelined operation; column address can be
changed every clock cycle
Programmable burst lengths: 1,2,4,8, or full page
Auto-precharge, includes concurrent auto precharge, and
auto-refresh mode
32ms, 8,192-cycle refresh
Operational environment:
- Total dose: 100 krad(Si)
- SEL Immune 111 MeV-cm
2
/mg
- SEU Event Rate: 1.3E-10 events/bit-day assuming
geosynchronous orbit and Adam’s 90% worst-case
environment
Package options:
- 128-lead Ceramic Quad Flatpack, shallow side-braze
- 128-lead Ceramic Quad Flatpack, deep side-braze
Standard Microcircuit Drawing
- UT8SDMQ64M40: 5962-10229
- UT8SDMQ64M48: 5962-10230
- QML Q and Q+
INTRODUCTION
The UT8SDMQ64M40 and UT8SDMQ64M48 are high
performance, highly integrated Synchronous Dynamic Random
Access Memory (SDRAM) multi-chip modules (MCMs). Total
module density is 2,684,354,560 bits for the 2.5G device and
3,221,225,472 bits for the 3G device. Each bit bank is organized
as 8192 rows by 2048 columns.
Read and write accesses to the DRAM are burst oriented;
accesses start at a selected location and continue for a
programmed number of locations in a programmed sequence.
The programmable READ and WRITE burst lengths (BL) are
1, 2, 4, or 8 locations, or the full page, with a burst terminate
option.
Aeroflex’s SDRAMs are designed to operate at 3.3V. An auto-
refresh mode is provided, along with a power-saving, power-
down mode. All inputs and outputs are LVTTL compatible.
SDRAMs offer significant advances in DRAM operating
execution, including the capability to synchronously burst data
at a high data rate with automatic column-address generation,
to interleave between internal banks to mask precharging time,
and to randomly change column addresses on each clock cycle
during a burst access.
40
DQM5
48
U5
U4
U3
U2
8
8
8
DQM4
DQM3
DQM2
DQM1
DQM0
A[12:0]
BA[1:0]
CLK
CKE
RAS#
CAS#
WE#
CS#
15
U4
U3
U2
U1
8
8
DQM4
8
DQ[7:0](5)
DQ[7:0](4)
DQ[7:0](3)
8
DQ[47:40]
DQ[39:32]
DQ[31:24]
DQ[23:16]
DQ[15:8]
DQ[7:0]
DQ[7:0](4)
DQ[7:0](3)
8
DQ[39:32]
DQ[31:24]
DQ[23:16]
DQ[15:8]
DQ[7:0]
DQM3
DQM2
DQM1
DQM0
A[12:0]
BA[1:0]
CLK
CKE
RAS#
CAS#
WE#
CS#
15
DQ[7:0](2)
DQ[7:0](1)
8
U1
U0
SDRAM
16Meg x 8 x4
8
DQ[7:0](2)
8
DQ[7:0](1)
DQ[7:0](0)
U0
SDRAM
16Meg x 8 x4
DQ[7:0](0)
2.5Gigabit (64Mx40)
3.0Gigabit (64Mx48)
Figure 1. Block Diagrams
1

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