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5962R0722902VZA

Description
Adjustable Positive Standard Regulator, 1.2V Min, 57V Max, BIPolar, CDSO16, CERAMIC, SOIC-16
CategoryPower/power management    The power supply circuit   
File Size386KB,6 Pages
ManufacturerDefense Logistics Agency
Download Datasheet Parametric View All

5962R0722902VZA Overview

Adjustable Positive Standard Regulator, 1.2V Min, 57V Max, BIPolar, CDSO16, CERAMIC, SOIC-16

5962R0722902VZA Parametric

Parameter NameAttribute value
MakerDefense Logistics Agency
Parts packaging codeSOIC
package instructionSOP,
Contacts16
Reach Compliance Codeunknow
ECCN codeEAR99
Maximum Differential Input-Output Voltage40 V
Minimum Differential Input-Output Voltage3 V
JESD-30 codeR-CDSO-G16
Number of functions1
Number of terminals16
Working temperatureTJ-Max150 °C
Maximum output voltage 157 V
Minimum output voltage 11.2 V
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Certification statusQualified
Regulator typeADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR
Filter levelMIL-PRF-38535 Class V
Maximum seat height2.33 mm
surface mountYES
technologyBIPOLAR
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
total dose100k Rad(Si) V
width6.35 mm
www.ti.com
Table of Contents
Application Report
Hermetic Package Reflow Profiles, Termination
Finishes, and Lead Trim and Form
ABSTRACT
Hermetic microcircuits are still widely used in mission-critical aerospace, defense, and industrial applications.
Customers occasionally have questions regarding board-level assembly of these packages. A general set of
guidelines are addressed in this application note.
Table of Contents
1 Reflow Profiles........................................................................................................................................................................2
2 Critical Considerations for Gold-Plated Termination-Finishes..........................................................................................
3
3 Considerations for Leadless Ceramic Chip Carrier Packages...........................................................................................3
4 Lead Forming..........................................................................................................................................................................
4
5 Ceramic Packaging.................................................................................................................................................................4
6 References..............................................................................................................................................................................
5
List of Figures
Figure 1-1. Starting Profile for Typical Pb/Sn Solder Paste.........................................................................................................
2
List of Tables
Table 2-1. MIL-PRF-38535 TABLE A-III Composition and Coating Thickness Requirements.....................................................3
Trademarks
All other trademarks are the property of their respective owners.
SLVAEU0 – SEPTEMBER 2020
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Hermetic Package Reflow Profiles, Termination Finishes, and Lead Trim and
Form
Copyright © 2020 Texas Instruments Incorporated
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