This document was generated on 05/14/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
Overview:
Description:
0737825300
Active
hdm
2.00mm (.079") Pitch HDM® Board-to-Board Stacking Header, High Rise Vertical,
SMC, Closed End Option, 144 Circuits
Documents:
3D Model
Drawing (PDF)
Product Specification PS-73780-999 (PDF)
RoHS Certificate of Compliance (PDF)
Series
image - Reference only
LR19980
E29179
EU RoHS
China RoHS
ELV and RoHS
Compliant
REACH SVHC
Contains SVHC: No
Halogen-Free
Status
Not Reviewed
Need more information on product
environmental compliance?
Email productcompliance@molex.com
For a multiple part number RoHS Certificate of
Compliance, click here
Please visit the Contact Us section for any
non-product compliance questions.
Agency Certification
CSA
UL
General
Product Family
Series
Application
Component Type
Overview
Product Name
Style
Backplane Connectors
73782
Backplane, Mezzanine
PCB Header
hdm
HDM®
N/A
Physical
Circuits (Loaded)
Circuits (maximum)
Color - Resin
Durability (mating cycles max)
First Mate / Last Break
Flammability
Guide to Mating Part
Keying to Mating Part
Material - Metal
Material - Plating Mating
Material - Plating Termination
Material - Resin
Number of Columns
Number of Pairs
Number of Rows
Orientation
PC Tail Length (in)
PC Tail Length (mm)
PCB Retention
PCB Thickness Recommended (in)
PCB Thickness Recommended (mm)
Packaging Type
Pitch - Mating Interface (in)
Pitch - Mating Interface (mm)
Plating min: Mating (µin)
Plating min: Mating (µm)
Plating min: Termination (µin)
Plating min: Termination (µm)
Polarized to PCB
Stackable
Surface Mount Compatible (SMC)
Temperature Range - Operating
144
144
Black
200
No
94V-0
No
None
Phosphor Bronze
Gold
Tin-Lead
High Temperature Thermoplastic
24
Open Pin Field
6
Vertical
0.118 In
3.00 mm
None
0.055 In
1.40 mm
Tube
0.079 In
2.00 mm
30
0.75
100
2.5
No
Yes
Yes
-55°C to +105°C
Search Parts in this Series
73782Series
Mates With
73632 HDM PLUS® Board-to-Board
Daughtercard Receptacle. 73780 HDM®
Board-to-Board Daughtercard Receptacle
Termination Interface: Style
Through Hole
Electrical
Current - Maximum per Contact
Data Rate
Real Signals (per 25mm)
Voltage - Maximum
1A
1.0 Gbps
72
100V AC
Solder Process Data
Duration at Max. Process Temperature (seconds)
Lead-free Process Capability
Max. Cycles at Max. Process Temperature
Process Temperature max. C
5
Wave Capable (TH only)
1
260
Material Info
Reference - Drawing Numbers
Packaging Specification
PK-70873-0871
Product Specification
PS-73780-999
Sales Drawing
SD-73782-001
HDM and High Density Metric are trademarks of Amphenol Corporation
This document was generated on 05/14/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
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