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24LC02B-E/MCG

Description
256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 2 X 3 MM, 0.90 MM HEIGHT, LEAD FREE, PLASTIC, MO-229, DFN-8
Categorystorage    storage   
File Size425KB,26 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Environmental Compliance
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24LC02B-E/MCG Overview

256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 2 X 3 MM, 0.90 MM HEIGHT, LEAD FREE, PLASTIC, MO-229, DFN-8

24LC02B-E/MCG Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Parts packaging codeSON
package instruction2 X 3 MM, 0.90 MM HEIGHT, LEAD FREE, PLASTIC, MO-229, DFN-8
Contacts8
Reach Compliance Codecompli
ECCN codeEAR99
Maximum clock frequency (fCLK)0.4 MHz
Data retention time - minimum200
Durability1000000 Write/Erase Cycles
I2C control byte1010XXXR
JESD-30 codeR-PDSO-N8
JESD-609 codee3
length3 mm
memory density2048 bi
Memory IC TypeEEPROM
memory width8
Humidity sensitivity level1
Number of functions1
Number of terminals8
word count256 words
character code256
Operating modeSYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
organize256X8
Package body materialPLASTIC/EPOXY
encapsulated codeHVSSON
Encapsulate equivalent codeSOLCC8,.11,20
Package shapeRECTANGULAR
Package formSMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)260
power supply3/5 V
Certification statusNot Qualified
Maximum seat height1 mm
Serial bus typeI2C
Maximum standby current0.000005 A
Maximum slew rate0.003 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)2.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceMatte Tin (Sn)
Terminal formNO LEAD
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
width2 mm
Maximum write cycle time (tWC)5 ms
write protectHARDWARE
Base Number Matches1
24AA02/24LC02B
2K I
2
C
Serial EEPROM
Device Selection Table
Part
Number
24AA02
24LC02B
Note 1:
V
CC
Range
1.8-5.5
2.5-5.5
Max. Clock
Frequency
400 kHz
(1)
400 kHz
Temp.
Ranges
I
I, E
Description:
The Microchip Technology Inc. 24AA02/24LC02B
(24XX02*) is a 2 Kbit Electrically Erasable PROM. The
device is organized as one block of 256 x 8-bit memory
with a 2-wire serial interface. Low-voltage design
permits operation down to 1.8V, with standby and
active currents of only 1
μA
and 1 mA, respectively.
The 24XX02 also has a page write capability for up to
8 bytes of data. The 24XX02 is available in the
standard 8-pin PDIP, surface mount SOIC, TSSOP, 2x3
DFN and MSOP packages and is also available in the
5-lead SOT-23 package.
100 kHz for V
CC
<2.5V
Features:
• Single supply with operation down to 1.8V
• Low-power CMOS technology:
- 1 mA active current, typical
- 1
μA
standby current, typical (I-temp)
• Organized as 1 block of 256 bytes (1 x 256 x 8)
• 2-wire serial interface bus, I
2
C™ compatible
• Schmitt Trigger inputs for noise suppression
• Output slope control to eliminate ground bounce
• 100 kHz (24AA02) and 400 kHz (24LC02B)
compatibility
• Self-timed write cycle (including auto-erase)
• Page write buffer for up to 8 bytes
• Hardware write-protect for entire memory
• Can be operated as a serial ROM
• Factory programming (QTP) available
• ESD protection > 4,000V
• 1,000,000 erase/write cycles
• Data retention > 200 years
• 8-lead PDIP, SOIC, TSSOP, DFN and MSOP
packages
• 5-lead SOT-23 package
• Pb-free finish available
• Available for extended temperature ranges:
- Industrial (I): -40°C to +85°C
- Automotive (E): -40°C to +125°C
Package Types
PDIP, MSOP
A0
A1
A2
V
SS
1
2
3
4
SOT-23-5
SCL
Vss
SDA
Note:
1
2
3
4
Vcc
5
WP
A0 1
A1 2
A2 3
V
SS
4
8
7
6
5
V
CC
WP
SCL
A0
A1
A2
SOIC, TSSOP
1
2
3
4
DFN
8 V
CC
7 WP
6 SCL
5 SDA
8
7
6
5
V
CC
WP
SCL
SDA
SDA V
SS
Pins A0, A1 and A2 are not used by the 24XX02. (No
internal connections).
Block Diagram
WP
HV
Generator
I/O
Control
Logic
Memory
Control
Logic
XDEC
EEPROM
Array
Page
Latches
I/O
SCL
YDEC
SDA
V
CC
V
SS
Sense Amp.
R/W Control
©
2005 Microchip Technology Inc.
DS21709E-page 1

24LC02B-E/MCG Related Products

24LC02B-E/MCG 24LC02B-I/MCG 24LC02BT-E/MCG 24AA02-I/MCG
Description 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 2 X 3 MM, 0.90 MM HEIGHT, LEAD FREE, PLASTIC, MO-229, DFN-8 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 2 X 3 MM, 0.90 MM HEIGHT, LEAD FREE, PLASTIC, MO-229, DFN-8 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 2 X 3 MM, 0.90 MM HEIGHT, LEAD FREE, PLASTIC, MO-229, DFN-8 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 2 X 3 MM, 0.90 MM HEIGHT, LEAD FREE, PLASTIC, MO-229, DFN-8
Is it lead-free? Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to
Parts packaging code SON SON SON SON
package instruction 2 X 3 MM, 0.90 MM HEIGHT, LEAD FREE, PLASTIC, MO-229, DFN-8 2 X 3 MM, 0.90 MM HEIGHT, LEAD FREE, PLASTIC, MO-229, DFN-8 2 X 3 MM, 0.90 MM HEIGHT, LEAD FREE, PLASTIC, MO-229, DFN-8 HVSSON, SOLCC8,.11,20
Contacts 8 8 8 8
Reach Compliance Code compli compli compli compli
ECCN code EAR99 EAR99 EAR99 EAR99
Maximum clock frequency (fCLK) 0.4 MHz 0.4 MHz 0.4 MHz 0.4 MHz
Data retention time - minimum 200 200 200 200
Durability 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles
I2C control byte 1010XXXR 1010XXXR 1010XXXR 1010XXXR
JESD-30 code R-PDSO-N8 R-PDSO-N8 R-PDSO-N8 R-PDSO-N8
JESD-609 code e3 e3 e3 e3
length 3 mm 3 mm 3 mm 3 mm
memory density 2048 bi 2048 bi 2048 bi 2048 bi
Memory IC Type EEPROM EEPROM EEPROM EEPROM
memory width 8 8 8 8
Humidity sensitivity level 1 1 1 1
Number of functions 1 1 1 1
Number of terminals 8 8 8 8
word count 256 words 256 words 256 words 256 words
character code 256 256 256 256
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 125 °C 85 °C 125 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
organize 256X8 256X8 256X8 256X8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code HVSSON HVSSON HVSSON HVSSON
Encapsulate equivalent code SOLCC8,.11,20 SOLCC8,.11,20 SOLCC8,.11,20 SOLCC8,.11,20
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH
Parallel/Serial SERIAL SERIAL SERIAL SERIAL
Peak Reflow Temperature (Celsius) 260 260 260 260
power supply 3/5 V 3/5 V 3/5 V 2/5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1 mm 1 mm 1 mm 1 mm
Serial bus type I2C I2C I2C I2C
Maximum standby current 0.000005 A 0.000001 A 0.000005 A 0.000001 A
Maximum slew rate 0.003 mA 0.003 mA 0.003 mA 0.003 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 2.5 V 2.5 V 2.5 V 1.8 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 2.5 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level AUTOMOTIVE INDUSTRIAL AUTOMOTIVE INDUSTRIAL
Terminal surface Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn)
Terminal form NO LEAD NO LEAD NO LEAD NO LEAD
Terminal pitch 0.5 mm 0.5 mm 0.5 mm 0.5 mm
Terminal location DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 40 40 40 40
width 2 mm 2 mm 2 mm 2 mm
Maximum write cycle time (tWC) 5 ms 5 ms 5 ms 5 ms
write protect HARDWARE HARDWARE HARDWARE HARDWARE
Base Number Matches 1 1 1 1

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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