4 BIT SINGLE CHIP MICROCOMPUTER
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Hitachi （Renesas ） |
| Objectid | 100835059 |
| package instruction | SDIP, SDIP64,.75 |
| Reach Compliance Code | unknow |
| compound_id | 182025536 |
| bit size | 4 |
| CPU series | HMCS400 |
| JESD-30 code | R-PDIP-T64 |
| JESD-609 code | e0 |
| Number of terminals | 64 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | -20 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SDIP |
| Encapsulate equivalent code | SDIP64,.75 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE, SHRINK PITCH |
| power supply | 3.3/5 V |
| Certification status | Not Qualified |
| RAM (bytes) | 256 |
| rom(word) | 16384 |
| ROM programmability | EPROM |
| speed | 4.5 MHz |
| Maximum slew rate | 6 mA |
| surface mount | NO |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 1.78 mm |
| Terminal location | DUAL |
| HD404329S | HD404328 | HD404328FS | HD404328S | HD404329 | HD404329C | HD404329FS | |
|---|---|---|---|---|---|---|---|
| Description | 4 BIT SINGLE CHIP MICROCOMPUTER | 4 BIT SINGLE CHIP MICROCOMPUTER | 4 BIT SINGLE CHIP MICROCOMPUTER | 4 BIT SINGLE CHIP MICROCOMPUTER | 4 BIT SINGLE CHIP MICROCOMPUTER | 4 BIT SINGLE CHIP MICROCOMPUTER | 4 BIT SINGLE CHIP MICROCOMPUTER |
| Maker | Hitachi （Renesas ） | - | Hitachi （Renesas ） | Hitachi （Renesas ） | - | Hitachi （Renesas ） | Hitachi （Renesas ） |
| package instruction | SDIP, SDIP64,.75 | - | QFP, QFP64,.7X.95,40 | DIP, SDIP64,.75 | - | SDIP, SDIP64,.75 | QFP, QFP64,.7X.95,40 |
| Reach Compliance Code | unknow | - | unknow | unknown | - | unknow | unknow |
| bit size | 4 | - | 4 | 4 | - | 4 | 4 |
| CPU series | HMCS400 | - | HMCS400 | HMCS400 | - | HMCS400 | HMCS400 |
| JESD-30 code | R-PDIP-T64 | - | R-PQFP-G64 | R-PDIP-T64 | - | R-XDIP-T64 | R-PQFP-G64 |
| Number of terminals | 64 | - | 64 | 64 | - | 64 | 64 |
| Maximum operating temperature | 70 °C | - | 75 °C | 75 °C | - | 70 °C | 70 °C |
| Minimum operating temperature | -20 °C | - | -20 °C | -20 °C | - | -20 °C | -20 °C |
| Package body material | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | CERAMIC | PLASTIC/EPOXY |
| encapsulated code | SDIP | - | QFP | DIP | - | SDIP | QFP |
| Encapsulate equivalent code | SDIP64,.75 | - | QFP64,.7X.95,40 | SDIP64,.75 | - | SDIP64,.75 | QFP64,.7X.95,40 |
| Package shape | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE, SHRINK PITCH | - | FLATPACK | IN-LINE | - | IN-LINE, SHRINK PITCH | FLATPACK |
| power supply | 3.3/5 V | - | 3/5 V | 3/5 V | - | 3.3/5 V | 3.3/5 V |
| Certification status | Not Qualified | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| RAM (bytes) | 256 | - | 140 | 140 | - | 256 | 256 |
| rom(word) | 16384 | - | 8192 | 8192 | - | 16384 | 16384 |
| ROM programmability | EPROM | - | MROM | MROM | - | EPROM | EPROM |
| speed | 4.5 MHz | - | 0.56 MHz | 0.56 MHz | - | 4.5 MHz | 4.5 MHz |
| Maximum slew rate | 6 mA | - | 6 mA | 6 mA | - | 6 mA | 6 mA |
| surface mount | NO | - | YES | NO | - | NO | YES |
| Temperature level | COMMERCIAL | - | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | - | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | - | GULL WING | THROUGH-HOLE | - | THROUGH-HOLE | GULL WING |
| Terminal pitch | 1.78 mm | - | 1 mm | 1.778 mm | - | 1.78 mm | 1 mm |
| Terminal location | DUAL | - | QUAD | DUAL | - | DUAL | QUAD |
京公网安备 11010802033920号
EEWORLD
