Pentium
®
III Processor for the PGA370
Socket at 500 MHz to 1 GHz
Datasheet
Product Features
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Available in 1B GHz, 933, 866, 800EB, 733,
667, 600EB, and 533EB MHz for a
133 MHz system bus
Available in 900, 850, 800, 750, 700, 650,
600E, 550E, and 500E MHz for a 100 MHz
system bus
System bus frequency at 100 MHz and
133 MHz ("E" denotes support for Advanced
Transfer Cache and Advanced system
buffering; "B" denotes support for a
133MHz system bus where both bus
frequencies are available for order per each
given core frequency; See Table 1 for a
summary of features for each line item.)
Available in versions that incorporate
256 KB Advanced Transfer Cache (on-die,
full speed Level 2 (L2) cache with Error
Correcting Code (ECC))
Dual Independent Bus (DIB) architecture:
Separate dedicated external System Bus and
dedicated internal high-speed cache bus
Internet Streaming SIMD Extensions for
enhanced video, sound and 3D performance
Binary compatible with applications running
on previous members of the Intel
microprocessor line
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Dynamic execution micro architecture
Intel Processor Serial Number
Power Management capabilities
System Management mode
Multiple low-power states
Optimized for 32-bit applications running on
advanced 32-bit operating systems
Flip Chip Pin Grid Array (FC-PGA) packaging
technology; FC-PGA processors deliver high
performance with improved handling protection
and socketability
Integrated high performance 16 KB instruction
and 16 KB data, nonblocking, level one cache
256 KB Integrated Full Speed level two cache
allows for low latency on read/store operations
Double Quad Word Wide(256bit) cache data
bus provides extremely high throughput on
read/store operations.
8-way cache associativity provides improved
cache hit rate on reads/store operations.
Error-correcting code for System Bus data
Enables systems which are scaleable for up to
two processors
The Pentium
®
III processor is designed for high-performance desktops and for workstations and
servers. It is binary compatible with previous Intel Architecture processors. The Pentium III processor
provides great performance for applications running on advanced operating systems such as Windows*
98, Windows NT and UNIX*. This is achieved by integrating the best attributes of Intel processors—
the dynamic execution, Dual Independent Bus architecture plus Intel MMX™ technology and Internet
Streaming SIMD Extentions— bringing a new level of performance for systems buyers. The Pentium
®
III processor is scaleable to two processors in a multiprocessor system and extends the power of the
Pentium
®
II processor with performance headroom for business media, communication and internet
capabilities. Systems based on
Pentium
®
III processors also
include the latest features to
simplify system management and
lower the cost of ownership for
large and small business
environments. The Pentium
®
III
processor offers great performance
for today’s and tomorrow’s
applications.
FC-PGA370 Package
October 2000
Order Number:
245264-007
Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual
property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability
whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to
fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not
intended for use in medical, life saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for
future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The Pentium
®
III processor may contain design defects or errors known as errata which may cause the product to deviate from published
specifcations. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling
1-800-548-4725 or by visiting Intel's website at http://www.intel.com.
Copyright © Intel Corporation, 2000
*Third-party brands and names are the property of their respective owners.
Datasheet
Pentium
®
III Processor for the PGA370 Socket at 500 MHz to 1 GHz
Contents
1.0
Introduction......................................................................................................................... 7
1.1
Terminology........................................................................................................... 8
1.1.1 Package and Processor Terminology ...................................................... 8
1.1.2 Processor Naming Convention.................................................................9
Related Documents.............................................................................................10
Processor System Bus and V
REF
........................................................................11
Clock Control and Low Power States..................................................................12
2.2.1 Normal State—State 1 ...........................................................................13
2.2.2 AutoHALT Powerdown State—State 2...................................................13
2.2.3 Stop-Grant State—State 3 .....................................................................13
2.2.4 HALT/Grant Snoop State—State 4 ........................................................14
2.2.5 Sleep State—State 5..............................................................................14
2.2.6 Deep Sleep State—State 6 ....................................................................14
2.2.7 Clock Control..........................................................................................15
Power and Ground Pins ......................................................................................15
2.3.1 Phase Lock Loop (PLL) Power...............................................................16
Decoupling Guidelines .......................................................................................16
2.4.1 Processor VCC
CORE
Decoupling............................................................16
2.4.2 Processor System Bus AGTL+ Decoupling............................................16
Processor System Bus Clock and Processor Clocking .......................................17
2.5.1 Mixing Processors of Differrent Frequencies .........................................17
Voltage Identification ...........................................................................................17
Processor System Bus Unused Pins...................................................................19
Processor System Bus Signal Groups ................................................................19
2.8.1 Asynchronous vs. Synchronous for System Bus Signals .......................20
2.8.2 System Bus Frequency Select Signals (BSEL[1:0]) ...............................21
Test Access Port (TAP) Connection....................................................................22
Maximum Ratings................................................................................................22
Processor DC Specifications...............................................................................23
AGTL+ System Bus Specifications .....................................................................29
System Bus AC Specifications ............................................................................29
2.13.1 I/O Buffer Model .....................................................................................30
BCLK and PICCLK Signal Quality Specifications and Measurement Guidelines 38
AGTL+ Signal Quality Specifications and Measurement Guidelines ..................39
AGTL+ Signal Quality Specifications and Measurement Guidelines ..................40
3.3.1 Overshoot/Undershoot Guidelines .........................................................40
3.3.2 Overshoot/Undershoot Magnitude .........................................................41
3.3.3 Overshoot/Undershoot Pulse Duration...................................................41
3.3.4 Activity Factor .........................................................................................41
3.3.5 Reading Overshoot/Undershoot Specification Tables............................42
3.3.6 Determining if a System meets the Overshoot/Undershoot
Specifications .........................................................................................43
1.2
2.0
2.1
2.2
Electrical Specifications....................................................................................................11
2.3
2.4
2.5
2.6
2.7
2.8
2.9
2.10
2.11
2.12
2.13
3.0
Signal Quality Specifications ............................................................................................38
3.1
3.2
3.3
Datasheet
3
Pentium
®
III Processor for the PGA370 Socket at 500 MHz to 1 GHz
3.4
Non-AGTL+ Signal Quality Specifications and Measurement Guidelines........... 45
3.4.1 Overshoot/Undershoot Guidelines ......................................................... 46
3.4.2 Ringback Specification........................................................................... 46
3.4.3 Settling Limit Guideline .......................................................................... 46
Thermal Specifications........................................................................................ 47
4.1.1 Thermal Diode........................................................................................ 48
FC-PGA Mechanical Specifications .................................................................... 50
Processor Markings ............................................................................................ 52
Processor Signal Listing...................................................................................... 52
Mechanical Specifications for the Boxed Intel
®
Pentium
®
III Processor.............. 64
6.1.1 Boxed Processor Thermal Cooling Solution Dimensions....................... 64
6.1.2 Boxed Processor Heatsink Weight......................................................... 67
6.1.3 Boxed Processor Thermal Cooling Solution Clip ................................... 67
Thermal Specifications........................................................................................ 68
6.2.1 Boxed Processor Cooling Requirements ............................................... 68
Electrical Requirements for the Boxed Intel
®
Pentium
®
III Processor................. 69
6.3.1 Fan Heatsink Power Supply ................................................................... 69
Alphabetical Signals Reference .......................................................................... 71
Signal Summaries ............................................................................................... 78
4.0
Thermal Specifications and Design Considerations......................................................... 47
4.1
5.0
Mechanical Specifications............................................................................................... 50
5.1
5.2
5.3
6.0
Boxed Processor Specifications....................................................................................... 64
6.1
6.2
6.3
7.0
Processor Signal Description ........................................................................................... 71
7.1
7.2
4
Datasheet
Pentium
®
III Processor for the PGA370 Socket at 500 MHz to 1 GHz
List of Figures
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Second Level (L2) Cache Implementation ........................................................... 7
AGTL+ Bus Topology in a Uniprocessor Configuration ......................................12
AGTL+ Bus Topology in a Dual-Processor Configuration ...................................12
Stop Clock State Machine ...................................................................................12
Processor VccCMOS Package Routing ..............................................................16
BSEL[1:0] Example for a 100/133 MHz or 100 MHz Only System Design .........21
BCLK, PICCLK, and TCK Generic Clock Waveform...........................................35
System Bus Valid Delay Timings ........................................................................35
System Bus Setup and Hold Timings..................................................................35
System Bus Reset and Configuration Timings....................................................36
Power-On Reset and Configuration Timings.......................................................36
Test Timings (TAP Connection) ..........................................................................37
Test Reset Timings .............................................................................................37
BCLK, PICCLK Generic Clock Waveform at the Processor Pins........................39
Low to High AGTL+ Receiver Ringback Tolerance.............................................40
Maximum Acceptable AGTL+ Overshoot/Undershoot Waveform .......................45
Non-AGTL+ Overshoot/Undershoot, Settling Limit, and Ringback 1 ..................45
Processor Functional Die Layout for CPUIDs up to and including 0683h ...........48
Package Dimensions...........................................................................................50
Top Side Processor Markings .............................................................................52
Intel® Pentium® III Processor Pinout..................................................................53
Conceptual Boxed Intel® Pentium® III Processor for the PGA370 Socket.........64
Space Requirements for the Boxed Processor to 850MHz.................................65
Space Requirements for the Boxed Processor from 866 to 933MHz..................65
Space Requirements for the Boxed Processor at 1 GHz ....................................66
Dimensions of Mechanical Step Feature in Heatsink Base.................................66
Dimensions of Notches in Heatsink Base ..........................................................67
Clip Keepout Requirements for the PGA370 (Top View) ....................................68
Thermal Airspace Requirement for all Boxed Intel® Pentium® III Processor
Fan Heatsinks in the PGA370 Socket .................................................................69
Boxed Processor Fan Heatsink Power Cable Connector Description.................70
Motherboard Power Header Placement Relative to the Boxed
Intel® Pentium® III Processor .............................................................................70
Datasheet
5
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