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Datasheet> All Categories > storage> storage> Z21014-10
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Z21014-10

Description
Fast Page DRAM, 256KX4, 100ns, CMOS, PZIP19, PLASTIC, ZIP-20/19
Categorystorage    storage   
File Size498KB，16 Pages
ManufacturerIntel
Websitehttp://www.intel.com/
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Z21014-10 Overview

Fast Page DRAM, 256KX4, 100ns, CMOS, PZIP19, PLASTIC, ZIP-20/19

Z21014-10 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIntel
Parts packaging codeZIP
package instructionZIP, ZIP20,.1
Contacts20
Reach Compliance Codecompli
ECCN codeEAR99
access modeFAST PAGE
Maximum access time100 ns
Other featuresRAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O typeCOMMON
JESD-30 codeR-PZIP-T19
JESD-609 codee0
length26.162 mm
memory density1048576 bi
Memory IC TypeFAST PAGE DRAM
memory width4
Number of functions1
Number of ports1
Number of terminals19
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX4
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeZIP
Encapsulate equivalent codeZIP20,.1
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
refresh cycle512
Maximum seat height10.16 mm
Maximum standby current0.001 A
Maximum slew rate0.06 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch1.27 mm
Terminal locationZIG-ZAG
Maximum time at peak reflow temperatureNOT SPECIFIED
width3 mm

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Z21014-10 Related Products

Z21014-10 PE21014-07 PE21014-06 P21014-10 Z21014-08 PE21014-08 Z21014-06 Z21014-07 PE21014-10 P21014-06
Description Fast Page DRAM, 256KX4, 100ns, CMOS, PZIP19, PLASTIC, ZIP-20/19 Fast Page DRAM, 256KX4, 70ns, CMOS, PDSO20, PLASTIC, SOJ-20 Fast Page DRAM, 256KX4, 60ns, CMOS, PDSO20, PLASTIC, SOJ-20 Fast Page DRAM, 256KX4, 100ns, CMOS, PDIP20, PLASTIC, DIP-20 Fast Page DRAM, 256KX4, 80ns, CMOS, PZIP19, PLASTIC, ZIP-20/19 Fast Page DRAM, 256KX4, 80ns, CMOS, PDSO20, PLASTIC, SOJ-20 Fast Page DRAM, 256KX4, 60ns, CMOS, PZIP19, PLASTIC, ZIP-20/19 Fast Page DRAM, 256KX4, 70ns, CMOS, PZIP19, PLASTIC, ZIP-20/19 Fast Page DRAM, 256KX4, 100ns, CMOS, PDSO20, PLASTIC, SOJ-20 Fast Page DRAM, 256KX4, 60ns, CMOS, PDIP20, PLASTIC, DIP-20
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Maker Intel Intel Intel Intel Intel Intel Intel Intel Intel Intel
Parts packaging code ZIP SOJ SOJ DIP ZIP SOJ ZIP ZIP SOJ DIP
package instruction ZIP, ZIP20,.1 SOJ, SOJ20/26,.34 SOJ, SOJ20/26,.34 DIP, DIP20,.3 ZIP, ZIP20,.1 SOJ, SOJ20/26,.34 ZIP, ZIP20,.1 ZIP, ZIP20,.1 SOJ, SOJ20/26,.34 DIP, DIP20,.3
Contacts 20 20 20 20 20 20 20 20 20 20
Reach Compliance Code compli unknown unknown unknown compliant unknown unknown unknown unknown unknow
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
access mode FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE
Maximum access time 100 ns 70 ns 60 ns 100 ns 80 ns 80 ns 60 ns 70 ns 100 ns 60 ns
Other features RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O type COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-PZIP-T19 R-PDSO-J20 R-PDSO-J20 R-PDIP-T20 R-PZIP-T19 R-PDSO-J20 R-PZIP-T19 R-PZIP-T19 R-PDSO-J20 R-PDIP-T20
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0 e0
length 26.162 mm 17.145 mm 17.145 mm 24.56 mm 26.162 mm 17.145 mm 26.162 mm 26.162 mm 17.145 mm 24.56 mm
memory density 1048576 bi 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bi
Memory IC Type FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM
memory width 4 4 4 4 4 4 4 4 4 4
Number of functions 1 1 1 1 1 1 1 1 1 1
Number of ports 1 1 1 1 1 1 1 1 1 1
Number of terminals 19 20 20 20 19 20 19 19 20 20
word count 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words
character code 256000 256000 256000 256000 256000 256000 256000 256000 256000 256000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 256KX4 256KX4 256KX4 256KX4 256KX4 256KX4 256KX4 256KX4 256KX4 256KX4
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code ZIP SOJ SOJ DIP ZIP SOJ ZIP ZIP SOJ DIP
Encapsulate equivalent code ZIP20,.1 SOJ20/26,.34 SOJ20/26,.34 DIP20,.3 ZIP20,.1 SOJ20/26,.34 ZIP20,.1 ZIP20,.1 SOJ20/26,.34 DIP20,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE SMALL OUTLINE SMALL OUTLINE IN-LINE IN-LINE SMALL OUTLINE IN-LINE IN-LINE SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
refresh cycle 512 512 512 512 512 512 512 512 512 512
Maximum seat height 10.16 mm 3.56 mm 3.56 mm 5 mm 10.16 mm 3.56 mm 10.16 mm 10.16 mm 3.56 mm 5 mm
Maximum standby current 0.001 A 0.001 A 0.001 A 0.001 A 0.001 A 0.001 A 0.001 A 0.001 A 0.001 A 0.001 A
Maximum slew rate 0.06 mA 0.08 mA 0.09 mA 0.06 mA 0.07 mA 0.07 mA 0.09 mA 0.08 mA 0.06 mA 0.09 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO YES YES NO NO YES NO NO YES NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE J BEND J BEND THROUGH-HOLE THROUGH-HOLE J BEND THROUGH-HOLE THROUGH-HOLE J BEND THROUGH-HOLE
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 2.54 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 2.54 mm
Terminal location ZIG-ZAG DUAL DUAL DUAL ZIG-ZAG DUAL ZIG-ZAG ZIG-ZAG DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 3 mm 7.62 mm 7.62 mm 7.62 mm 3 mm 7.62 mm 3 mm 3 mm 7.62 mm 7.62 mm

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