L7C162DM25 datasheet, PDF - EEWORLD Datasheet

L7C162DM25: DescriptionStandard SRAM, 16KX4, 25ns, CMOS, CDIP28, 0.300 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-28; Categorystorage storage; File Size261KB，6 Pages; ManufacturerLOGIC Devices; Websitehttp://www.logicdevices.com/

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L7C162DM25 Overview

Standard SRAM, 16KX4, 25ns, CMOS, CDIP28, 0.300 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-28

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	LOGIC Devices
Parts packaging code	DIP
package instruction	0.300 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-28
Contacts	28
Reach Compliance Code	unknow
ECCN code	3A001.A.2.C
Maximum access time	25 ns
Other features	AUTOMATIC POWER-DOWN; HIGH IMPEDANCE WRITE
I/O type	SEPARATE
JESD-30 code	R-CDIP-T28
JESD-609 code	e0
length	35.56 mm
memory density	65536 bi
Memory IC Type	STANDARD SRAM
memory width	4
Humidity sensitivity level	3
Number of functions	1
Number of ports	1
Number of terminals	28
word count	16384 words
character code	16000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	16KX4
Output characteristics	3-STATE
Exportable	YES
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	225
power supply	5 V
Certification status	Not Qualified
Maximum seat height	4.953 mm
Maximum standby current	0.00025 A
Minimum standby current	2 V
Maximum slew rate	0.075 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm

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