L8C402KME35 datasheet, PDF - EEWORLD Datasheet

L8C402KME35: DescriptionFIFO, 64X5, 25ns, Asynchronous, CMOS, CQCC20, 0.350 X 0.350 INCH, CERAMIC, LCC-20; Categorystorage storage; File Size400KB，9 Pages; ManufacturerLOGIC Devices; Websitehttp://www.logicdevices.com/

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L8C402KME35 Overview

FIFO, 64X5, 25ns, Asynchronous, CMOS, CQCC20, 0.350 X 0.350 INCH, CERAMIC, LCC-20

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	LOGIC Devices
Parts packaging code	QLCC
package instruction	QCCN,
Contacts	20
Reach Compliance Code	unknow
ECCN code	EAR99
Maximum access time	25 ns
period time	28.6 ns
JESD-30 code	S-CQCC-N20
length	8.89 mm
memory density	320 bi
memory width	5
Humidity sensitivity level	3
Number of functions	1
Number of terminals	20
word count	64 words
character code	64
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	64X5
Output characteristics	TOTEM POLE
Exportable	NO
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN
Package shape	SQUARE
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	3.048 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
width	8.89 mm

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