|
MIC4422AF |
MIC4421AF |
MIC4422AJB |
| Description |
Buffer/Inverter Based MOSFET Driver, 9A, BICMOS, CDFP10, CERPACK-10 |
Buffer/Inverter Based MOSFET Driver, 9A, BICMOS, CDFP10, CERPACK-10 |
Buffer/Inverter Based MOSFET Driver, 9A, BICMOS, CDIP8, CERDIP-8 |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
| Parts packaging code |
DFP |
DFP |
DIP |
| package instruction |
DFP, FL10,.24 |
DFP, FL10,.24 |
DIP, DIP8,.3 |
| Contacts |
10 |
10 |
8 |
| Reach Compliance Code |
compli |
compliant |
compliant |
| ECCN code |
EAR99 |
EAR99 |
EAR99 |
| high side driver |
NO |
NO |
NO |
| Input properties |
STANDARD |
STANDARD |
STANDARD |
| Interface integrated circuit type |
BUFFER OR INVERTER BASED MOSFET DRIVER |
BUFFER OR INVERTER BASED MOSFET DRIVER |
BUFFER OR INVERTER BASED MOSFET DRIVER |
| JESD-30 code |
S-GDFP-F10 |
S-GDFP-F10 |
R-GDIP-T8 |
| JESD-609 code |
e0 |
e0 |
e0 |
| length |
6.12 mm |
6.12 mm |
9.652 mm |
| Number of functions |
1 |
1 |
1 |
| Number of terminals |
10 |
10 |
8 |
| Maximum operating temperature |
125 °C |
125 °C |
125 °C |
| Minimum operating temperature |
-55 °C |
-55 °C |
-55 °C |
| Output characteristics |
TOTEM-POLE |
TOTEM-POLE |
TOTEM-POLE |
| Nominal output peak current |
9 A |
9 A |
9 A |
| Output polarity |
TRUE |
INVERTED |
TRUE |
| Package body material |
CERAMIC, GLASS-SEALED |
CERAMIC, GLASS-SEALED |
CERAMIC, GLASS-SEALED |
| encapsulated code |
DFP |
DFP |
DIP |
| Encapsulate equivalent code |
FL10,.24 |
FL10,.24 |
DIP8,.3 |
| Package shape |
SQUARE |
SQUARE |
RECTANGULAR |
| Package form |
FLATPACK |
FLATPACK |
IN-LINE |
| Peak Reflow Temperature (Celsius) |
240 |
240 |
NOT SPECIFIED |
| power supply |
4.5/18 V |
4.5/18 V |
4.5/18 V |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum seat height |
2.032 mm |
2.032 mm |
5.08 mm |
| Maximum slew rate |
3 mA |
3 mA |
3 mA |
| Maximum supply voltage |
18 V |
18 V |
18 V |
| Minimum supply voltage |
4.5 V |
4.5 V |
4.5 V |
| Nominal supply voltage |
5 V |
5 V |
5 V |
| surface mount |
YES |
YES |
NO |
| technology |
BICMOS |
BICMOS |
BICMOS |
| Temperature level |
MILITARY |
MILITARY |
MILITARY |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
FLAT |
FLAT |
THROUGH-HOLE |
| Terminal pitch |
1.27 mm |
1.27 mm |
2.54 mm |
| Terminal location |
DUAL |
DUAL |
DUAL |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| Disconnect time |
0.08 µs |
0.08 µs |
0.08 µs |
| connection time |
0.08 µs |
0.08 µs |
0.08 µs |
| width |
6.12 mm |
6.12 mm |
7.62 mm |
| Maker |
Micrel ( Microchip ) |
- |
Micrel ( Microchip ) |