REVISIONS
LTR
A
B
C
D
E
F
G
H
J
K
DESCRIPTION
Add case outlines T and U. Change limits for V
OUT
, line regulation, load
regulation, standby current drain; with line and with load tests. Change
footnotes 1/, 2/, and 5/. Add vendors CAGE U4637 and 69210
Add case outline 2. Change limit for ripple rejection test. Editorial changes
throughout.
Add device type 02. Add case outline P. Technical and editorial changes
throughout.
Add case outline N. Make changes to 1.2.2, 1.3, table I, figure 1,and
figure 2. - ro
Add radiation hardness requirements. Add CAGE 21845. -rrp
Add radiation hardness requirements. Add CAGE 21845. -rrp
Make change to case outline N. Add case outlines 4 and 5. Make changes to
1.2.3, 1.3, figure 1, and figure 2.
Make change to V
IN
limits to Ripple rejection test and footnote 3/ as specified
in table I. - ro
For case outlines T and U only, add footnote 1/ under 1.2.3 and add note 2
under figure 1. Drawing updated to reflect current requirements. –rrp
Delete figure 3 irradiation exposure circuit. Make change to paragraph 3.2.3.
Update paragraphs to current MIL-PRF-38535 requirements. - ro
DATE (YR-MO-DA)
89-07-24
92-11-16
93-11-09
99-10-20
99-12-17
00-02-01
02-02-11
02-10-09
06-01-11
13-03-21
APPROVED
M. A. FRYE
M. A. FRYE
M. A. FRYE
R. MONNIN
R. MONNIN
R. MONNIN
R. MONNIN
R. MONNIN
R. MONNIN
C. SAFFLE
THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
K
15
K
16
K
17
K
18
REV
SHEET
PREPARED BY
CHARLES E. BESORE
K
1
K
2
K
3
K
4
K
5
K
6
K
7
K
8
K
9
K
10
K
11
K
12
K
13
K
14
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
RAY MONNIN
APPROVED BY
D. A. DiCENZO
DRAWING APPROVAL DATE
88-07-28
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.landandmaritime.dla.mil
MICROCIRCUIT, LINEAR, POSITIVE 12 VOLT
REGULATOR, MONOLITHIC SILICON
AMSC N/A
REVISION LEVEL
K
SIZE
A
CAGE CODE
67268
SHEET
1 OF 18
5962-87776
DSCC FORM 2233
APR 97
5962-E323-13
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962
F
87776
01
P
A
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
Device
type
(see 1.2.2)
Case
outline
(see 1.2.3)
Lead
finish
(see 1.2.4)
\/
Drawing number
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
Generic number
7812A
78M12
Circuit function
Positive regulator, fixed, 12 volt
Positive regulator, fixed, 12 volt
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
M
N
P
T 1/
U 1/
X
Y
Z
2
4
5
Descriptive designator
See figure 1
CBCC2-N3
GDIP1-T8 or CDIP2-T8
See figure 1
See figure 1
See figure 1
See figure 1
MBFM4-P2
CQCC1-N20
See figure 1
CBCC1-N3
Terminals
3
3
8
3
3
3
2
2
20
3
3
Package style
Power surface mount
Bottom terminal chip carrier
Dual-in-line
TO-257 flange mounted and
glass sealed
TO-257 flange mounted with isolated
tab and glass sealed
TO-39 can
TO-3 can
TO-66 can
Square leadless chip carrier
Flange mount, glass sealed, with
gull wings
Bottom terminal chip carrier
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
_____
1/ For outline letters T and U, CAGE 34333 manufacturers the TO-257 package with ceramic seal.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87776
SHEET
K
2
1.3 Absolute maximum ratings.
Input voltage:
Operating or output shorted to ground (Device types 01 and 02) .............
Transient (Device type 01) .......................................................................
Output current (I
O
)
Cases M, N, T, U, Y, Z, 4, and 5 ..............................................................
Cases P, X, and 2 (Device type 01)..........................................................
Power dissipation (P
D
):
T
C
= +25°C:
Device type 01, cases M, N, T, U, Z, 4, and 5 ......................................
Device type 01, cases X and 2 .............................................................
Device type 01, case Y ........................................................................
T
A
= +25°C:
Device type 01, cases M, N, T, U, and Z ..............................................
Device type 01, cases X and 2 .............................................................
Device type 01, case Y ........................................................................
Device type 01, case 4 .........................................................................
Device type 01, case 5 .........................................................................
Device type 02, case P ........................................................................
Device type 02, case 2 .........................................................................
Storage temperature range ..........................................................................
Lead temperature (soldering, 10 seconds) ..................................................
Case temperature, case outline 2 (soldering, 10 seconds):
Device type 02 .........................................................................................
Junction temperature (T
J
) ............................................................................
Thermal resistance, junction-to-case (θ
JC
):
Cases M and U ........................................................................................
Cases N and T .........................................................................................
Cases P and 2 .........................................................................................
Case X .....................................................................................................
Case Y .....................................................................................................
Case Z .....................................................................................................
Case 4 .....................................................................................................
Case 5 .....................................................................................................
Thermal resistance, junction-to-ambient (θ
JA
):
Device type 01, cases M, N, T, U, and Z .................................................
Device type 01, cases X and 2 ................................................................
Device type 01, case Y .............................................................................
Device type 01, case 4 ............................................................................
Device type 01, case 5 ............................................................................
Device type 02, case P ............................................................................
Device type 02, case 2 ............................................................................
35 V dc
50 V dc 2/
1.5 A
0.5 A
15 W
2W
20 W
3.0 W
1.0 W
4.3 W
1.7 W
1.3 W
1050 mW 3/
1375 mW 4/
-65°C to +150°C
+300°C
+260°C
+150°C 5/
4.2°C/W
3.5°C/W
See MIL-STD-1835
15°C/W
3°C/W
6°C/W
5.1°C/W
3.6°C/W
42°C/W
120°C/W
35°C/W
60°C/W
80°C/W
110°C/W
65°C/W
2/
3/
4/
5/
The 50 volt input rating refers to the ability of the regulator to withstand high line or transient conditions without damage.
Since the regulator’s maximum current capability is reduced, the output may fall out of regulation at high input voltages
under nominal loading.
Derate at 8.4 mW/°C above T
A
= +25°C.
Derate at 11.0 mW/°C above T
A
= +25°C.
The device is protected by thermal shutdown circuit which is designed to turn off the output transistor whenever the
device junction temperature is in excess of +150°C.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87776
SHEET
K
3
1.4 Recommended operating conditions.
Input voltage range (V
IN
) ............................................................................ +8 V dc to +25 V dc
Ambient operating temperature range (T
A
) ................................................. -55°C to +125°C
1.5 Radiation features:
Maximum total dose available (dose rate = 50 – 300 rads(Si)/s) ................. 300 krads(Si) 6/
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
https://assist.dla.mil/quicksearch/
or from the Standardization Document
Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
_____
6/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects.
Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in MIL-STD-883,
method 1019, condition A.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87776
SHEET
K
4
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to
MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and
qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management
(QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the
device. These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with
MIL-PRF-38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535, appendix A and herein.
3.2.1 Case outline. The case outline shall be in accordance with 1.2.3 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document
revision level control and shall be made available to the preparing and acquiring activity upon request.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN
listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD
PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device.
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance
to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in
accordance with MIL-PRF-38535 to identify when the QML flow option is used.
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DLA Land and
Maritime -VA prior to listing as an approved source of supply shall affirm that the manufacturer's product meets the
requirements of MIL-PRF-38535, appendix A and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided
with each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DLA Land and Maritime -VA shall be required for any change that
affects this drawing.
3.9 Verification and review. DLA Land and Maritime, DLA Land and Maritime's agent, and the acquiring activity retain the
option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made
available onshore at the option of the reviewer.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87776
SHEET
K
5
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