IS2064B-114SM-TRAY datasheet, PDF

Datasheet> All Categories > Wireless rf/communication> Telecom circuit> IS2064B-114SM-TRAY

IS2064B-114SM-TRAY: DescriptionTelecom Circuit, 1-Func, PBGA61; CategoryWireless rf/communication Telecom circuit; File Size9MB，93 Pages; ManufacturerMicrochip; Websitehttps://www.microchip.com

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IS2064B-114SM-TRAY Overview

Telecom Circuit, 1-Func, PBGA61

IS2064B-114SM-TRAY Parametric

Parameter Name	Attribute value
Maker	Microchip
package instruction	BGA-61
Reach Compliance Code	compli
Factory Lead Time	13 weeks
JESD-30 code	R-PBGA-B61
length	5 mm
Number of functions	1
Number of terminals	61
Maximum operating temperature	70 °C
Minimum operating temperature	-20 °C
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Filter level	TS 16949
Maximum seat height	0.9 mm
Nominal supply voltage	1.2 V
surface mount	YES
Telecom integrated circuit types	TELECOM CIRCUIT
Temperature level	OTHER
Terminal form	BALL
Terminal pitch	0.5 mm
Terminal location	BOTTOM
width	5 mm

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IS2062/64

Bluetooth

Dual Mode Stereo Audio SoC

Introduction

The IS2062/64 products are part of the Bluetooth Dual Mode family of stereo audio System on Chip

(SoC) devices.

• Flash-based devices:

– The IS2062GM and IS2064GM SoCs are offered in LGA packages and contain in-package

Flash, which allows for firmware updates.

• ROM-based devices:

– The IS2064S and IS2064B support Stereo Mode functionality in ROM. This allows for audio

playback on two devices. Some Bluetooth parameters can be customized and stored in an

internal EEPROM. These products are offered in QFN and BGA packages.

Features

• Qualified for Bluetooth v5.0 Specification

• Bluetooth 5.0 Core System Component QDID is 110017

• Bluetooth Audio Profiles:

– A2DP 1.3

– AVRCP 1.6

– HFP 1.6

– HSP 1.2

– SPP 1.2

• Bluetooth Low Energy (BLE):

– Generic access service

– Device information service

– Proprietary services for data communication

– Apple Notification Center Service (ANCS)

• Supports Bluetooth Low Energy data rate up to 1Mbits/s

• Supports 16 kHz High Definition (HD) Voice

• Audio Interfaces:

– I

S digital output (IS2064GM and IS2064S/B)

– Analog output

– Auxiliary input

– Analog microphone input

• Supports Firmware Upgrade (IS2062GM/64GM)

• Integrated Battery Charger (up to 350 mA)

2019 Microchip Technology Inc.

Datasheet

DS60001409G-page 1

IS2062/64

Table of Contents

Introduction......................................................................................................................1

Features.......................................................................................................................... 1

Baseband Features......................................................................................................... 2

Audio Codec....................................................................................................................2

RF Features.....................................................................................................................2

DSP Audio Processing.................................................................................................... 2

Package Details...............................................................................................................2

Peripherals...................................................................................................................... 3

Operating Condition.........................................................................................................3

Applications..................................................................................................................... 3

1. Device Overview........................................................................................................6

1.1.

1.2.

Key Features................................................................................................................................ 7

Pin Details.................................................................................................................................... 9

2. Audio....................................................................................................................... 23

2.1.

2.2.

2.3.

2.4.

Digital Signal Processor............................................................................................................. 23

Codec......................................................................................................................................... 24

Auxiliary Port.............................................................................................................................. 27

Analog Speaker Output.............................................................................................................. 27

3. Transceiver.............................................................................................................. 29

3.1.

3.2.

3.3.

3.4.

3.5.

Transmitter................................................................................................................................. 29

Receiver..................................................................................................................................... 29

Synthesizer.................................................................................................................................29

Modem....................................................................................................................................... 29

Adaptive Frequency Hopping (AFH).......................................................................................... 29

4. Microcontroller......................................................................................................... 30

4.1.

4.2.

4.3.

Memory...................................................................................................................................... 30

External Reset............................................................................................................................30

Reference Clock.........................................................................................................................30

5. Power Management Unit......................................................................................... 32

5.1.

5.2.

5.3.

5.4.

Charging a Battery..................................................................................................................... 32

Voltage Monitoring......................................................................................................................32

Low Dropout Regulator.............................................................................................................. 32

Switching Regulator................................................................................................................... 33

2019 Microchip Technology Inc.

Datasheet

DS60001409G-page 4

IS2062/64

5.5.

5.6.

5.7.

LED Driver..................................................................................................................................33

Under Voltage Protection........................................................................................................... 33

Ambient Detection...................................................................................................................... 33

6. Application Information............................................................................................ 35

6.1.

6.2.

6.3.

6.4.

6.5.

Power Supply............................................................................................................................. 35

Host MCU Interface....................................................................................................................35

Configuration and Firmware Programming................................................................................ 41

General Purpose I/O pins...........................................................................................................41

S Mode Application..................................................................................................................42

7. Antenna Placement Rule.........................................................................................44

8. Electrical Characteristics......................................................................................... 46

8.1.

Timing Specifications..................................................................................................................53

9. Packaging Information.............................................................................................56

9.1.

9.2.

Package Marking Information.....................................................................................................56

Package Details......................................................................................................................... 57

10. Reflow Profile and Storage Condition......................................................................66

10.1. Solder Reflow Recommendation................................................................................................66

10.2. Storage Condition.......................................................................................................................66

11. Ordering Information................................................................................................67

12. Reference Circuit.....................................................................................................68

13. Document Revision History..................................................................................... 88

The Microchip Web Site................................................................................................ 90

Customer Change Notification Service..........................................................................90

Customer Support......................................................................................................... 90

Microchip Devices Code Protection Feature................................................................. 90

Legal Notice...................................................................................................................91

Trademarks................................................................................................................... 91

Quality Management System Certified by DNV.............................................................92

Worldwide Sales and Service........................................................................................93

2019 Microchip Technology Inc.

Datasheet

DS60001409G-page 5

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