SG1503/SG2503/SG3503
Precision 2.5-Volt Reference
Description
The SG1503 is a monolithic integrated circuit
implementing a self-contained precision voltage
reference generator. It is internally trimmed for ±1%
accuracy and requires less than 2mA quiescent
current. SG1503 can deliver greater than 10mA output
current while achieving total load and line induced
tolerances of less than 0.5%.
In addition to voltage accuracy, internal trimming
achieves a temperature coefficient of output voltage of
typically 10 ppm/°C. As a result, these references are
excellent choices for applications in critical
instrumentation and D-to-A converter systems. The
SG1503 is specified for operation over the full military
ambient temperature range of -55°C to 125°C, while
the SG2503 is designed for -25°C to 85°C and the
SG3503 for commercial applications of 0°C to 70°C.
Features
Output Voltage Trimmed to ±1%
Input Voltage Range of 4.5V to 40V
Temperature Coefficient of 10ppm/°C
Quiescent Current Typically 1.5mA
Output Current in excess of 10mA
Interchangeable with MC1503 and AD580
Application
Available to MIL-STD-883, ¶ 1.2.1
Available to DSCC
Standard Microcircuit Drawing (SMD)
®
Microsemi Level “S” Processing Available
Functional Diagram
V
IN
I
1
= I
2
V
O
1.25V
GND
Figure 1 ·
Functional Block Diagram
December 2014 Rev. 1.3a
www.microsemi.com
© 2014 Microsemi Corporation
1
Precision 2.5-Volt Reference
Connection Diagrams and Ordering Information
Ambient
Temperature
-55°C to 125°C
Y
-25°C to 85°C
0°C to 70°C
-25°C to 85°C
M
0°C to 70°C
Type
Package
Part Number
SG1503Y-883B
8-PIN
ceramic
DIP
8-PIN
plastic DIP
Pb-free /
RoHS
Transition
DC: 0503*
8-PIN
plastic
SOIC
Pb-free /
RoHS
Transition
DC: 0440*
SG1503Y-DESC
SG1503Y
SG2503Y
SG3503Y
SG2503M
PDIP
SG3503M
CERDIP
V
IN
V
out
GND
N.C.
1
2
3
4
8
7
6
5
N.C.
N.C.
N.C.
N.C.
Packaging
Type
Connection Diagram
Y Package: PbSn Lead Finish
M Package: Pb-free / RoHS 100%
Matte Tin Lead Finish
-25°C to 85°C
DM
0°C to 70°C
SG2503DM
SOIC
SG3503DM
V
IN
V
OUT
GND
N.C.
1
2
3
4
8
7
6
5
N.C.
N.C.
N.C.
N.C.
DM Package: Pb-free / RoHS
100% Matte Tin Lead Finish
V
OUT
2
SG1503T-883B
-55°C to 125°C
T
-25°C to 85°C
0°C to 70°C
3-PIN
METAL
CAN
SG1503T-DESC
SG1503T
SG2503T
SG3503T
TO-39
GND
3
1
V
IN
T Package: PbSn Lead Finish
Notes:
1. Contact factory for JAN and DESC product availability.
2. All packages are viewed from the top.
*RoHS compliant
2
Absolute Maximum Ratings
Absolute Maximum Ratings
Parameter
Input Voltage
Storage Temperature Range
Operating Junction Temperature
Hermetic (T, Y Packages)
Plastic (M, DM Packages)
Lead Temperature (Soldering, 10 seconds)
Pb-free / RoHS Peak Solder Reflow Temp (40s max. exp.)
Note:
Exceeding these ratings could cause damage to the device.
Value
40
-65 to 150
150
150
300
260 (+0, -5)
Units
V
°C
°C
°C
°C
°C
Thermal Data
Parameter
T Package
Thermal Resistance-Junction to Case,
θ
JC
Thermal Resistance-Junction to Ambient,
θ
JA
Y Package
Thermal Resistance-Junction to Case,
θ
JC
Thermal Resistance-Junction to Ambient,
θ
JA
M Package
Thermal Resistance-Junction to Case,
θ
JC
Thermal Resistance-Junction to Ambient,
θ
JA
DM Package
15
120
50
130
60
95
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Value
Units
Thermal Resistance-Junction to Case,
θ
JC
55
°C/W
Thermal Resistance-Junction to Ambient,
θ
JA
165
°C/W
Notes:
1. Junction Temperature Calculation: T
J
= T
A
+ (P
D
×
θ
JA
).
2.
The above numbers for θ
JC
are maximums for the limiting thermal resistance of the package in a standard mounting
configuration. The θ
JA
numbers are meant to be guidelines for the thermal performance of the device/pc-board system. All of
the above assume no ambient airflow.
3
Precision 2.5-Volt Reference
Recommended Operating Conditions
Parameter
Input Voltage
Operating Ambient Temperature Range
SG1503
SG2503
SG3503
Note:
Range over which the device is functional.
-55 to 125
-25 to 85
0 to 70
°C
°C
°C
Value
4.5 to 40
Units
V
Electrical Characteristics
(Unless otherwise specified, these specifications apply over the operating ambient temperatures for SG1503 with
-55°C
≤ T
A
≤ 125°C,
SG2503/SG3503 with 0°C
≤ T
A
≤
70°C, V
IN
= 15V
,
and I
L
= 0mA. Low duty cycle pulse testing
techniques are used that maintains junction and case temperatures equal to the ambient temperature.)
SG1503/2503
Min
2.485
4.7
4.5
1
3
3
4
15
2.5
15
1.5
20
76
100
250
Typ
2.500
Max
2.515
40
40
3
5
5
8
20
5
2.0
30
15
Min
2.475
4.7
4.5
1
3
3
4
5
1.5
20
76
100
250
SG3503
Typ
2.500
Max
2.525
40
40
3
10
10
15
10
2.0
30
Parameter
Output Voltage
Input Voltage
Line Regulation
Load Regulation
Temperature Regulation
Quiescent Current
Short Circuit Current
Ripple Rejection
Output Noise
Voltage Stability
Test Conditions
T
A
= 25°C
T
A
= 25°C
V
IN
= 5V TO 15V
V
IN
= 15V TO 40V
I
L
= 10mA
I
L
= 10mA, V
IN
= 30V
(SG1503 only)
(SG2503/SG3503 only)
V
IN
= 40V
T
A
= 25°C
f = 120Hz, T
A
= 25°C
BW = 10kHz, T
A
= 25°C
Units
V
V
V
mV
mV
mV
mV
mV
mV
mA
mA
dB
µV
rms
µV/khr
Characteristics Curves
Ripple Rejection – (dB)
Output Voltage – (V)
2.52
V
IN
= 15V
I
O
= 0
-20
V
IN
= 15V
V
IN
= 10V
I
O
= 0
T
A
= 25
o
C
2.50
-40
2.48
-60
-80
-50
0
50
100
150
0
10
100
1k
10k
100k
1M
Junction Temperature – (
o
C)
Frequency – (Hz)
Figure 2 ·
Output Voltage versus Temperature
Figure 3.
Ripple Rejection
4
Package Outline Dimensions
Package Outline Dimensions
Controlling dimensions are in inches; metric equivalents are shown for general information.
Y 8-Pin CERDIP Package Dimensions
Dim
D
8
5
E
1
1
4
MILLIMETERS
MIN
MAX
4.32
0.38
1.04
0.20
9.52
5.59
7.37
0.63
3.18
-
0.51
5.08
0.51
1.65
0.38
10.29
7.11
7.87
1.78
4.06
15°
1.02
INCHES
MIN
MAX
0.170
0.015
0.045
0.008
0.375
0.220
0.290
0.025
0.125
-
0.020
0.200
0.020
0.065
0.015
0.405
0.280
0.310
0.070
0.160
15°
0.040
A
b
b2
c
D
E
eA
b2
A
e
eA
H
L
α
Q
2.54 BSC
0.100 BSC
Q
H
e
b
L
c
SEATING
PLANE
α
Note:
Dimensions do not include protrusions; these shall not
exceed 0.155mm (.006”) on any side. Lead dimension shall
not include solder coverage.
Figure 4 · Y
8-Pin CERDIP Package Dimensions
M 8-Pin PDIP Package Dimensions
D
Dim
A
A2
b
b2
c
D
E
e
E1
L
θ
c
θ
b
8
E1
1
1
b2
E
A2
A
MILLIMETERS
MIN
MAX
-
5.08
3.30 Typ.
0.38
0.51
0.76
1.65
0.20
0.38
-
10.16
7.62 BSC
2.54 BSC
6.10
6.86
3.05
-
0°
15°
INCHES
MIN
MAX
-
0.200
1.30 Typ.
0.145
0.020
0.030
0.065
0.008
0.015
-
0.400
0.300 BSC
0.100 BSC
0.240
0.270
0.120
-
0°
15°
L
H
e
Dimensions do not include mold flash or protrusions; these
shall not exceed 0.155mm (.006”) on any side. Lead
dimension shall not include solder coverage.
Note:
Figure 5 · M
8-Pin PDIP Package Dimensions
5
Embedded System
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