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MT18JDF1G72PDZ-1G6D1

Description
DDR DRAM Module, 1GX72, CMOS, HALOGEN FREE, MO-269R/CL, RDIMM-240
Categorystorage    storage   
File Size400KB,18 Pages
ManufacturerMicron Technology
Websitehttp://www.mdtic.com.tw/
Environmental Compliance
Download Datasheet Parametric View All

MT18JDF1G72PDZ-1G6D1 Overview

DDR DRAM Module, 1GX72, CMOS, HALOGEN FREE, MO-269R/CL, RDIMM-240

MT18JDF1G72PDZ-1G6D1 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicron Technology
Parts packaging codeDIMM
package instructionDIMM,
Contacts240
Reach Compliance Codeunknow
ECCN codeEAR99
access modeDUAL BANK PAGE BURST
Other featuresAUTO/SELF REFRESH
JESD-30 codeR-XDMA-N240
length133.35 mm
memory density77309411328 bi
Memory IC TypeDDR DRAM MODULE
memory width72
Number of functions1
Number of ports1
Number of terminals240
word count1073741824 words
character code1000000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize1GX72
Package body materialUNSPECIFIED
encapsulated codeDIMM
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Maximum seat height18.9 mm
self refreshYES
Maximum supply voltage (Vsup)1.575 V
Minimum supply voltage (Vsup)1.425 V
Nominal supply voltage (Vsup)1.5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal pitch1 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
8GB (x72, ECC, DR) 240-Pin DDR3 VLP RDIMM
Features
DDR3 SDRAM VLP RDIMM
MT18JDF1G72PDZ – 8GB
Features
• DDR3 functionality and operations supported as de-
fined in the component data sheet
• 240-pin, very low profile registered dual in-line
memory module (VLP RDIMM)
• Fast data transfer rates: PC3-12800, PC3-10600,
PC3-8500, or PC3-6400
• 8GB (1 Gig x 72)
• V
DD
= 1.5V ±0.075V
• V
DDSPD
= 3.0–3.6V
• Supports ECC error detection and correction
• Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
• Dual rank
• On-board I
2
C temperature sensor with integrated
serial presence-detect (SPD) EEPROM
• 8 internal device banks
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
• Selectable BC4 or BL8 on-the-fly (OTF)
• Gold edge contacts
• Halogen-free
• Fly-by topology
• Terminated control, command, and address bus
Table 1: Key Timing Parameters
Speed
Grade
-1G6
-1G4
-1G1
-1G0
-80B
Industry
Nomenclature
PC3-12800
PC3-10600
PC3-8500
PC3-8500
PC3-6400
Data Rate (MT/s)
CL = 11 CL = 10
1600
1333
1333
CL = 9
1333
1333
CL = 8
1066
1066
1066
1066
CL = 7
1066
1066
1066
CL = 6
800
800
800
800
800
CL = 5
667
667
667
667
667
t
RCD
t
RP
t
RC
Figure 1: 240-Pin VLP RDIMM (MO-269 R/C L)
Module Height: 18.75mm (0.738in)
Options
• Operating temperature
– Commercial (0°C
T
A
+70°C)
• Package
– 240-pin DIMM (halogen-free)
• Frequency/CAS latency
– 1.25ns @ CL = 11 (DDR3-1600)
– 1.5ns @ CL = 9 (DDR3-1333)
– 1.87ns @ CL = 7 (DDR3-1066)
Marking
None
Z
-1G6
-1G4
-1G1
(ns)
13.125
13.125
13.125
15
15
(ns)
13.125
13.125
13.125
15
15
(ns)
48.125
49.125
50.625
52.5
52.5
PDF: 09005aef8482a8a7
jdf18c1gx72pdz.pdf – Rev. A 9/11 EN
1
Products and specifications discussed herein are subject to change by Micron without notice.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2011 Micron Technology, Inc. All rights reserved.
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