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MT9KSF51272PZ-1G4XX

Description
DDR DRAM Module, 512MX72, CMOS, HALOGEN FREE, RDIMM-240
Categorystorage    storage   
File Size452KB,23 Pages
ManufacturerMicron Technology
Websitehttp://www.mdtic.com.tw/
Download Datasheet Parametric View All

MT9KSF51272PZ-1G4XX Overview

DDR DRAM Module, 512MX72, CMOS, HALOGEN FREE, RDIMM-240

MT9KSF51272PZ-1G4XX Parametric

Parameter NameAttribute value
MakerMicron Technology
package instructionDIMM,
Reach Compliance Codecompli
access modeSINGLE BANK PAGE BURST
Other featuresAUTO/SELF REFRESH; WD-MAX; ALSO OPERATES AT 1.5V NOMINAL SUPPLY
JESD-30 codeR-XDMA-N240
length133.35 mm
memory density38654705664 bi
Memory IC TypeDDR DRAM MODULE
memory width72
Number of functions1
Number of ports1
Number of terminals240
word count536870912 words
character code512000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512MX72
Package body materialUNSPECIFIED
encapsulated codeDIMM
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Maximum seat height30.5 mm
self refreshYES
Maximum supply voltage (Vsup)1.45 V
Minimum supply voltage (Vsup)1.283 V
Nominal supply voltage (Vsup)1.35 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal pitch1 mm
Terminal locationDUAL
width4 mm
1GB, 2GB, 4GB (x72, ECC, SR) 240-Pin DDR3L RDIMM
Features
1.35V DDR3L SDRAM RDIMM
MT9KSF12872PZ – 1GB
MT9KSF25672PZ – 2GB
MT9KSF51272PZ – 4GB
Features
• DDR3L functionality and operations supported as
defined in the component data sheet
• 240-pin, registered dual in-line memory module
(RDIMM)
• Fast data transfer rates: PC3-12800, PC3-10600,
PC3-8500, or PC3-6400
• 1GB (128 Meg x72), 2GB (256 Meg x 72), or 4GB (512
Meg x 72)
• V
DD
= 1.35V (1.283–1.45V)
• V
DD
= 1.5V (1.425–1.575V)
• Backward compatible to V
DD
= 1.5V ±0.075V
• V
DDSPD
= 3.0–3.6V
• Supports ECC error detection and correction
• Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
• Single-rank
• On-board I
2
C temperature sensor with integrated
serial presence-detect (SPD) EEPROM
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
• Selectable BC4 or BL8 on-the-fly (OTF)
• Gold edge contacts
• Halogen-free
• Fly-by topology
• Terminated control, command, and address bus
Table 1: Key Timing Parameters
Speed
Grade
-1G6
-1G4
-1G1
-1G0
-80B
Industry
Nomenclature
PC3-12800
PC3-10600
PC3-8500
PC3-8500
PC3-6400
Data Rate (MT/s)
CL = 11 CL = 10
1600
1333
1333
CL = 9
1333
1333
CL = 8
1066
1066
1066
1066
CL = 7
1066
1066
1066
CL = 6
800
800
800
800
800
CL = 5
667
667
667
667
667
t
RCD
t
RP
t
RC
Figure 1: 240-Pin RDIMM (MO-269 R/C A -
PCB 0692)
Module height: 30mm (1.18in)
Figure 2: 240-Pin RDIMM (MO-269 R/C A1 -
PCB 1486)
Module height: 30mm (1.18in)
Options
• Operating temperature
– Commercial (0°C
T
A
+70°C)
• Package
– 240-pin DIMM (halogen-free)
• Frequency/CAS latency
– 1.25ns @ CL = 11 (DDR3-1600)
– 1.5ns @ CL = 9 (DDR3-1333)
– 1.87ns @ CL = 7 (DDR3-1066)
Marking
None
Z
-1G6
-1G4
-1G1
(ns)
13.125
13.125
13.125
15
15
(ns)
13.125
13.125
13.125
15
15
(ns)
48.125
49.125
50.625
52.5
52.5
PDF: 09005aef83b2f73b
ksf9c128_256_512x72pz.pdf - Rev. H 04/13 EN
1
Products and specifications discussed herein are subject to change by Micron without notice.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2009 Micron Technology, Inc. All rights reserved.
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