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The intelligent driving community has its own rhythm. Some are busy pushing new versions and focusing on R&D, others are busy with publicity and promotion, and still others are immersed in mass pro...[Details]
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Flip-chip and ball grid array (BGA) are two widely used packaging technologies in the electronics industry. Each has its own advantages and limitations, and in some cases, they can complement each ...[Details]
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introduction
Bluetooth technology is a short-range wireless communication technology designed to replace wired cables. It is a wireless communication technology standard developed by the SIG, ...[Details]
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New energy vehicles are increasingly popular with consumers due to policies and energy conservation. Once you've purchased your vehicle, maintenance is essential. However, due to the different powe...[Details]
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1. Introduction
Electronic scales are gradually replacing traditional measuring tools like springs and balances in everyday life, such as electronic price computing scales and electronic weigh...[Details]
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According to foreign media reports, secondary battery materials company POSCO Future M announced that it has successfully developed two experimental (prototype) positive electrode materials for the...[Details]
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According to foreign media reports, BMW has just been granted a patent for a screen that could cover the entire roof. BMW hopes to transform at least a portion of the vehicle's headliner into a dis...[Details]
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This paper proposes a temperature real-time transmission and display solution based on LED optical data transmission, with Jingwei Yager low-power FPGA HR (Yellow River) series as the main controll...[Details]
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The digital TV set-top box consists of a tuner, QAM demodulator, TS demultiplexer, MPEG-2 decoder, PAUNTSC video encoder, embedded CPU system and peripheral interfaces, CA module, and uplink data m...[Details]
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Laird Thermal Systems has introduced the HiTemp ET series Peltier cooler modules, which can operate at high temperatures and provide on-site cooling for sensitive electronic devices.
Dig...[Details]
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According to Nikkei, Japan has performed poorly in responding to China's power semiconductor challenges.
There are five major companies in Japan's power chip market: Mitsubishi Electric,...[Details]
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"We have successfully launched the first version of our dedicated chip for EMB brake-by-wire. Second-generation samples have also been successfully completed, and we are actively planning a third-g...[Details]
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Over the past decade, the narrative surrounding fuel vehicles has been one of decline and replacement. Under the onslaught of new energy vehicles, traditional automakers have been forced to acceler...[Details]
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Tools/Materials
Yitong Chuanglian MODBUS to PROFIBUS Gateway YT-PB-03
Siemens s7-300
This article describes how to configure the YT-PB-03 MODBUS to PROFIBUS gat...[Details]
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Facial recognition, a biometric technology that uses facial features to authenticate identity, has rapidly become a global market hotspot in recent years as the technology has entered practical use...[Details]
Mobile and portable
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