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WF2M32U-150G2UC5

Description
Flash Module, 2MX32, 150ns, CQFP68, 22.40 X 22.40 MM, 3.56 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68
File Size1MB,11 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

WF2M32U-150G2UC5 Overview

Flash Module, 2MX32, 150ns, CQFP68, 22.40 X 22.40 MM, 3.56 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68

WF2M32U-150G2UC5 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Objectid1820321034
Parts packaging codeQFP
package instruction22.40 X 22.40 MM, 3.56 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68
Contacts68
Reach Compliance Codeunknown
ECCN codeEAR99
YTEOL0
Maximum access time150 ns
Other featuresCAN BE CONFIGURED AS 8M X 8
Spare memory width16
JESD-30 codeS-CQFP-G68
JESD-609 codee4
length22.36 mm
memory density67108864 bit
Memory IC TypeFLASH MODULE
memory width32
Number of functions1
Number of terminals68
word count2097152 words
character code2000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize2MX32
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQFP
Package shapeSQUARE
Package formFLATPACK
Parallel/SerialPARALLEL
Programming voltage5 V
Certification statusNot Qualified
Maximum seat height3.51 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceGOLD
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationQUAD
typeNOR TYPE
width22.36 mm
WF2M32-XXX5
2Mx32 5V NOR FLASH MODULE
FEATURES

Access Time of 90, 120, 150ns

Packaging:
• 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP
(Package 401).
• 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880") square
(Package 510) 3.56mm (0.140") height. Designed to fit
JEDEC 68 lead 0.990" CQFJ footprint (FIGURE 3)

Sector Architecture
• 32 equal size sectors of 64KBytes per each 2Mx8 chip
• Any combination of sectors can be erased. Also supports
full chip erase.

Minimum 100,000 Write/Erase Cycles Minimum

Organized as 2Mx32

Commercial, Industrial, and Military Temperature Ranges

5 Volt Read and Write

Low Power CMOS

Data# Polling and Toggle Bit feature for detection of
program or erase cycle completion.

Supports reading or programming data to a sector not being
erased.

RESET# pin resets internal state machine to the read
mode.

Built in Decoupling Caps and Multiple Ground Pins for Low
Noise Operation, Separate Power and Ground Planes to
improve noise immunity
* This product is subject to change without notice.
Note: For programming information and waveforms refer to Flash Programming 16M5 Application
Note AN0038. RESET# and RY/BY# function and timings don't apply to this device.
FIGURE 1 – PIN CONFIGURATION FOR WF2M32-XHX5
Top View
1
I/O8
I/O9
I/O10
A14
A16
A11
A0
A18
I/O0
I/O1
I/O2
11
22
12
WE2#
CS2#
GND
I/O11
A10
A9
A15
V
CC
CS1#
A19
I/O3
33
23
I/O15
I/O14
I/O13
I/O12
OE#
A17
WE1#
I/O7
I/O6
I/O5
I/O4
I/O24
I/O25
I/O26
A7
A12
A20
A13
A8
I/O16
I/O17
I/O18
44
34
V
CC
CS4#
WE4#
I/O27
A4
A5
A6
WE3#
CS3#
GND
I/O19
55
45
I/O31
I/O30
I/O29
I/O28
A1
A2
A3
I/O23
I/O22
I/O21
I/O20
66
I/O0-7
I/O8-15
I/O16-23
I/O24-31
WE1# CS1#
OE#
A0-20
2M x 8
2M x 8
2M x 8
2M x 8
WE2# CS2#
WE3# CS3#
WE4# CS4#
Pin Description
56
I/O0-31
A0-20
WE1-4#
CS1-4#
OE#
V
CC
GND
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Block Diagram
8
8
8
8
RESET# internally tied to V
CC
in the HIP package for this pin configuration. See
Alternate Pin Configuration with RESET# tied to pin 12 for system control of reset
(FIGURE 10, page 11).
Microsemi Corporation reserves the right to change products or specifications without notice.
June 2012
Rev. 9
© 2012 Microsemi Corporation. All rights reserved.
1
Microsemi Corporation • (602) 437-1520 • www.microsemi.com
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