IC 32K X 8 UVPROM, 150 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | National Semiconductor（TI ） |
| package instruction | WDIP, DIP28,.6 |
| Reach Compliance Code | unknow |
| ECCN code | EAR99 |
| Maximum access time | 150 ns |
| Other features | TTL/CMOS COMPATIBLE INPUT & OUTPUT LEVELS |
| I/O type | COMMON |
| JESD-30 code | R-GDIP-T28 |
| JESD-609 code | e0 |
| memory density | 262144 bi |
| Memory IC Type | UVPROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 28 |
| word count | 32768 words |
| character code | 32000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 32KX8 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | WDIP |
| Encapsulate equivalent code | DIP28,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE, WINDOW |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.0001 A |
| Maximum slew rate | 0.03 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| NMC87C257QE150 | NMC87C257QE200 | NMC87C257V200 | NMC87C257V150 | NMC87C257VE150 | NMC87C257VE200 | |
|---|---|---|---|---|---|---|
| Description | IC 32K X 8 UVPROM, 150 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM | IC 32K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM | IC 32K X 8 OTPROM, 200 ns, PQCC32, PLASTIC, LCC-32, Programmable ROM | IC 32K X 8 OTPROM, 150 ns, PQCC32, PLASTIC, LCC-32, Programmable ROM | IC,EPROM,32KX8,CMOS,LDCC,32PIN,PLASTIC | IC,EPROM,32KX8,CMOS,LDCC,32PIN,PLASTIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | WDIP, DIP28,.6 | WDIP, DIP28,.6 | QCCJ, LDCC32,.5X.6 | QCCJ, LDCC32,.5X.6 | QCCJ, LDCC32,.5X.6 | QCCJ, LDCC32,.5X.6 |
| Reach Compliance Code | unknow | unknown | unknown | unknow | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 150 ns | 200 ns | 200 ns | 150 ns | 150 ns | 200 ns |
| I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | R-GDIP-T28 | R-GDIP-T28 | R-PQCC-J32 | R-PQCC-J32 | R-PQCC-J32 | R-PQCC-J32 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| memory density | 262144 bi | 262144 bit | 262144 bit | 262144 bi | 262144 bit | 262144 bit |
| Memory IC Type | UVPROM | UVPROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of terminals | 28 | 28 | 32 | 32 | 32 | 32 |
| word count | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
| character code | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
| Maximum operating temperature | 85 °C | 85 °C | 70 °C | 70 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | - | - | -40 °C | -40 °C |
| organize | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | WDIP | WDIP | QCCJ | QCCJ | QCCJ | QCCJ |
| Encapsulate equivalent code | DIP28,.6 | DIP28,.6 | LDCC32,.5X.6 | LDCC32,.5X.6 | LDCC32,.5X.6 | LDCC32,.5X.6 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE, WINDOW | IN-LINE, WINDOW | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum standby current | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
| Maximum slew rate | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND | J BEND | J BEND |
| Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | QUAD | QUAD | QUAD | QUAD |
| Maker | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | - | - |
| Other features | TTL/CMOS COMPATIBLE INPUT & OUTPUT LEVELS | TTL/CMOS COMPATIBLE INPUT & OUTPUT LEVELS | TTL/CMOS COMPATIBLE INPUT & OUTPUT LEVELS | TTL/CMOS COMPATIBLE INPUT & OUTPUT LEVELS | - | - |
| Number of functions | 1 | 1 | 1 | 1 | - | - |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - | - |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | - | - |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - | - |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - | - |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
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