5962-01-146-2023 datasheet, PDF

5962-01-146-2023: DescriptionIC,PROM,1KX4,TTL,DIP,18PIN,CERAMIC; Categorystorage storage; File Size167KB，3 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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5962-01-146-2023 Overview

IC,PROM,1KX4,TTL,DIP,18PIN,CERAMIC

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Renesas Electronics Corporation
package instruction	DIP, DIP18,.3
Reach Compliance Code	_compli
Maximum access time	85 ns
JESD-30 code	R-XDIP-T18
memory density	4096 bi
Memory IC Type	OTP ROM
memory width	4
Number of terminals	18
word count	1024 words
character code	1000
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	1KX4
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP18,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	TTL
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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