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5962-01-252-7944

Description
IC,PROM,1KX4,TTL,DIP,18PIN,CERAMIC
Categorystorage    storage   
File Size167KB,3 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
Download Datasheet Parametric View All

5962-01-252-7944 Overview

IC,PROM,1KX4,TTL,DIP,18PIN,CERAMIC

5962-01-252-7944 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerRenesas Electronics Corporation
package instructionDIP, DIP18,.3
Reach Compliance Code_compli
Maximum access time50 ns
JESD-30 codeR-XDIP-T18
memory density4096 bi
Memory IC TypeOTP ROM
memory width4
Number of terminals18
word count1024 words
character code1000
Maximum operating temperature70 °C
Minimum operating temperature
organize1KX4
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP18,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Certification statusNot Qualified
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyTTL
Temperature levelCOMMERCIAL
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
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