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HM9-7608-2

Description
IC,PROM,1KX8,TTL,FP,24PIN,CERAMIC
Categorystorage    storage   
File Size146KB,3 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
Download Datasheet Parametric Compare View All

HM9-7608-2 Overview

IC,PROM,1KX8,TTL,FP,24PIN,CERAMIC

HM9-7608-2 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerRenesas Electronics Corporation
Reach Compliance Code_compli
Maximum access time90 ns
JESD-30 codeR-XDFP-F24
JESD-609 codee0
memory density8192 bi
Memory IC TypeOTP ROM
memory width8
Number of terminals24
word count1024 words
character code1000
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize1KX8
Package body materialCERAMIC
encapsulated codeDFP
Encapsulate equivalent codeFL24,.4
Package shapeRECTANGULAR
Package formFLATPACK
Certification statusNot Qualified
Maximum slew rate0.17 mA
surface mountYES
technologyTTL
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formFLAT
Terminal pitch1.27 mm
Terminal locationDUAL

HM9-7608-2 Related Products

HM9-7608-2 HM1-7608-2 HM3-7608-5 HM1-7608-5 HM9-7608-5
Description IC,PROM,1KX8,TTL,FP,24PIN,CERAMIC HM1-7608-2 HM3-7608-5 HM1-7608-5 HM9-7608-5
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible
Maker Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation
Reach Compliance Code _compli not_compliant not_compliant not_compliant _compli
Maximum access time 90 ns 90 ns 70 ns 70 ns 70 ns
JESD-30 code R-XDFP-F24 R-XDIP-T24 R-PDIP-T24 R-XDIP-T24 R-XDFP-F24
JESD-609 code e0 e0 e0 e0 e0
memory density 8192 bi 8192 bit 8192 bit 8192 bit 8192 bi
Memory IC Type OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM
memory width 8 8 8 8 8
Number of terminals 24 24 24 24 24
word count 1024 words 1024 words 1024 words 1024 words 1024 words
character code 1000 1000 1000 1000 1000
Maximum operating temperature 125 °C 125 °C 70 °C 70 °C 70 °C
organize 1KX8 1KX8 1KX8 1KX8 1KX8
Package body material CERAMIC CERAMIC PLASTIC/EPOXY CERAMIC CERAMIC
encapsulated code DFP DIP DIP DIP DFP
Encapsulate equivalent code FL24,.4 DIP24,.6 DIP24,.6 DIP24,.6 FL24,.4
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK IN-LINE IN-LINE IN-LINE FLATPACK
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum slew rate 0.17 mA 0.17 mA 0.17 mA 0.17 mA 0.17 mA
surface mount YES NO NO NO YES
technology TTL TTL TTL TTL TTL
Temperature level MILITARY MILITARY COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form FLAT THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE FLAT
Terminal pitch 1.27 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL
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