EEWORLDEEWORLDEEWORLD

Part Number

Search

18126C225K4Z4A

Description
CAPACITOR, CERAMIC, MULTILAYER, 100 V, X7R, 0.1 uF, SURFACE MOUNT, 0805
CategoryPassive components   
File Size198KB,5 Pages
ManufacturerAVX
Download Datasheet Parametric View All

18126C225K4Z4A Overview

CAPACITOR, CERAMIC, MULTILAYER, 100 V, X7R, 0.1 uF, SURFACE MOUNT, 0805

18126C225K4Z4A Parametric

Parameter NameAttribute value
Maximum operating temperature125 Cel
Minimum operating temperature-55 Cel
negative deviation10 %
positive deviation10 %
Rated DC voltage urdc100 V
Processing package descriptionChip, ROHS COMPLIANT
Lead-freeYes
EU RoHS regulationsYes
China RoHS regulationsYes
stateACTIVE
terminal coatingMATTE Tin OVER Nickel
Installation featuressurface mount
Manufacturer Series0805
size code0805
capacitance0.1000 uF
packaging shapeRectangular PACKAGE
Capacitor typeceramics
Terminal shapeWRAPAROUND
Temperature Coefficient15%
Temperature characteristic code×7R
multi-layerYes
MLCC with FLEXITERM
®
General Specifications
GENERAL DESCRIPTION
With increased requirements from the automotive industry for additional
component robustness, AVX recognized the need to produce a MLCC with
enhanced mechanical strength. It was noted that many components may be
subject to severe flexing and vibration when used in various under the hood
automotive and other harsh environment applications.
To satisfy the requirement for enhanced mechanical strength, AVX had to
find a way of ensuring electrical integrity is maintained whilst external forces
are being applied to the component. It was found that the structure of the
termination needed to be flexible and after much research and development,
AVX launched FLEXITERM
®
. FLEXITERM
®
is designed to enhance the
mechanical flexure and temperature cycling performance of a standard
ceramic capacitor with an X7R dielectric.
The industry standard for
flexure is 2mm minimum. Using FLEXITERM
®
, AVX provides up to
5mm of flexure without internal cracks. Beyond 5mm, the capacitor
will generally fail “open”.
As well as for automotive applications FLEXITERM
®
will provide Design
Engineers with a satisfactory solution when designing PCB’s which may be
subject to high levels of board flexure.
APPLICATIONS
High Flexure Stress Circuit Boards
• e.g. Depanelization: Components near edges
of board.
Variable Temperature Applications
• Soft termination offers improved reliability per-
formance in applications where there is tem-
perature variation.
• e.g. All kind of engine sensors: Direct
connection to battery rail.
Automotive Applications
• Improved reliability.
• Excellent mechanical performance and
thermo mechanical performance.
PRODUCT ADVANTAGES
• High mechanical performance able to withstand, 5mm bend test
guaranteed.
Increased temperature cycling performance, 3000 cycles and beyond.
Flexible termination system.
Reduction in circuit board flex failures.
Base metal electrode system.
Automotive or commercial grade products available.
HOW TO ORDER
0805
Style
0603
0805
1206
1210
1812
2220
5
Voltage
6 = 6.3V
Z = 10V
Y = 16V
3 = 25V
5 = 50V
1 = 100V
2 = 200V
C
Dielectric
C = X7R
F = X8R
104
Capacitance
Code (In pF)
2 Sig Digits +
Number of Zeros
e.g., 104 = 100nF
K
Capacitance
Tolerance
J = ±5%*
K = ±10%
M = ±20%
*≤1μF only
A
Z
2
Packaging
2 = 7" reel
4 = 13" reel
A
Special Code
A = Std. Product
Failure
Terminations
Rate
Z = FLEXITERM
®
A=Commercial For FLEXITERM
®
4 = Automotive with Tin/Lead
termination see
AVX LD Series
NOTE: Contact factory for availability of Tolerance Options for Specific Part Numbers.
46
AVR MCU Hardware and Software Design Tutorial -ppt.rar
[i=s]This post was last edited by paulhyde on 2014-9-15 03:00[/i]...
liu5013 Electronics Design Contest
What does a "hardware test engineer" mainly do? What are the prospects for development?
I applied for this position in a communications company, but I don't know much about the specific work of this position. If anyone knows, please tell me about it. Thank you in advance!...
pxy94 MCU
USB2.0 and USB3.0 protocol standards
Seeing that a forum member had posted about USB data transmission, I posted the USB protocol standard I have on hand as a supplement.All are official English versions...
wstt FPGA/CPLD
LPC1227 data distribution
Some time ago, many people in the forum applied for NXP boards. I'll post some Chinese information about LPC1227 for everyone as a "New Year's Day" bonus.:)...
ltbytyn NXP MCU
DM9000A network card driver about those parameters ~~ Urgent ~~
I heard that the following parameters are needed in DM9000: ioadress sysintr irqnumber DM9000_DATA_OFFSET. I searched the Internet for the whole morning but could not find any result for the above par...
282767310 Embedded System
The pad type in AD9 cannot be modified, please help? ?
When drawing the chip package, the pad type cannot be modified and the size is always 0. Please help! ! !...
毅梦圜 PCB Design

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 810  935  1561  501  1738  17  19  32  11  35 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号