EEWORLDEEWORLDEEWORLD

Part Number

Search

1812HC160KA19A

Description
Ceramic Capacitor, Multilayer, Ceramic, 3000V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.000016uF, Surface Mount, 1812, CHIP, ROHS COMPLIANT
CategoryPassive components    capacitor   
File Size70KB,2 Pages
ManufacturerAVX
Environmental Compliance
Related ProductsFound17parts with similar functions to 1812HC160KA19A
Download Datasheet Parametric View All

1812HC160KA19A Overview

Ceramic Capacitor, Multilayer, Ceramic, 3000V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.000016uF, Surface Mount, 1812, CHIP, ROHS COMPLIANT

1812HC160KA19A Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
package instruction, 1812
Reach Compliance Codecompli
ECCN codeEAR99
capacitance0.000016 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
high2.54 mm
JESD-609 codee4
length4.5 mm
Manufacturer's serial number1812
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance10%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
Package formSMT
method of packingBULK
positive tolerance10%
Rated (DC) voltage (URdc)3000 V
seriesSIZE(HIGH VOLTAGE)
size code1812
surface mountYES
Temperature characteristic codeX7R
Temperature Coefficient15% ppm/°C
Terminal surfacePalladium/Silver (Pd/Ag)
Terminal shapeWRAPAROUND
width3.2 mm
Base Number Matches1
High Voltage MLC Chips
For 600V to 5000V Applications
High value, low leakage and small size are difficult parameters to obtain
in capacitors for high voltage systems. AVX special high voltage MLC
chip capacitors meet these performance characteristics and are
designed for applications such as snubbers in high frequency power
converters, resonators in SMPS, and high voltage coupling/dc blocking.
These high voltage chip designs exhibit low ESRs at high frequencies.
Larger physical sizes than normally encountered chips are used to make
high voltage MLC chip products. Special precautions must be taken in
applying these chips in surface mount assemblies. The temperature
gradient during heating or cooling cycles should not exceed 4ºC per
second. The preheat temperature must be within 50ºC of the peak tem-
perature reached by the ceramic bodies through the soldering process.
Chip sizes 1210 and larger should be reflow soldered only. Capacitors
may require protective surface coating to prevent external arcing.
For 1825, 2225 and 3640 sizes, AVX offers leaded version in either
thru-hole or SMT configurations (for details see section on high voltage
leaded MLC chips).
NEW 630V RANGE
HOW TO ORDER
1808
AVX
Style
0805
1206
1210
1808
1812
1825
2220
2225
3640
***
A
Voltage
600V/630V =
1000V =
1500V =
2000V =
2500V =
3000V =
4000V =
5000V =
C
A
S
G
W
H
J
K
A
271
K
A
1
1
A
Temperature Capacitance Code Capacitance
Test Level
Termination*
Coefficient
(2 significant digits
Tolerance
A = Standard 1 = Pd/Ag
C0G = A
+ no. of zeros)
C0G:J = ±5%
T = Plated
X7R = C
Examples:
K = ±10%
Ni and Sn
(RoHS Compliant)
10 pF = 100
M = ±20%
100 pF = 101 X7R:K = ±10%
1,000 pF = 102
M = ±20%
22,000 pF = 223
Z = +80%,
220,000 pF = 224
-20%
1 μF = 105
Packaging
Special
1 = 7" Reel
Code
3 = 13" Reel A = Standard
9 = Bulk
*Note:
Terminations with 5% minimum lead (Pb) is available, see pages 84 and 85 for LD style.
Leaded terminations are available, see pages 88 and 89.
Notes: Capacitors with X7R dielectrics are not intended for applications across AC supply mains or AC line filtering with polarity reversal. Contact plant for recommendations.
Contact factory for availability of Termination and Tolerance options for Specific Part Numbers.
***
AVX offers nonstandard chip sizes. Contact factory for details.
W
L
T
t
DIMENSIONS
SIZE
(L) Length
millimeters (inches)
0805
1206
1210*
1808*
1812*
1825*
2220*
2225*
3640*
2.01 ± 0.20
3.20 ± 0.20
3.20 ± 0.20
4.57 ± 0.25
4.50 ± 0.30
4.50 ± 0.30
5.70 ± 0.40
5.72 ± 0.25
9.14 ± 0.25
(0.079 ± 0.008) (0.126 ± 0.008) (0.126 ± 0.008) (0.180 ± 0.010) (0.177 ± 0.012) (0.177 ± 0.012) (0.224 ± 0.016) (0.225 ± 0.010) (0.360 ± 0.010)
(W) Width
1.25 ± 0.20
1.60 ± 0.20
2.50 ± 0.20
2.03 ± 0.25
3.20 ± 0.20
6.40 ± 0.30
5.00 ± 0.40
6.35 ± 0.25
10.2 ± 0.25
(0.049 ±0.008) (0.063 ± 0.008) (0.098 ± 0.008) (0.080 ± 0.010) (0.126 ± 0.008) (0.252 ± 0.012) (0.197 ± 0.016) (0.250 ± 0.010) (0.400 ± 0.010)
(T) Thickness
1.30
1.52
1.70
2.03
2.54
2.54
3.30
2.54
2.54
Max.
(0.051)
(0.060)
(0.067)
(0.080)
(0.100)
(0.100)
(0.130)
(0.100)
(0.100)
(t) terminal min. 0.50 ± 0.25
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.76 (0.030)
max. (0.020 ± 0.010) 0.75 (0.030)
0.75 (0.030)
1.02 (0.040)
1.02 (0.040)
1.02 (0.040)
1.02 (0.040)
1.02 (0.040)
1.52 (0.060)
*Reflow Soldering Only
82

1812HC160KA19A Similar Products

Part Number Manufacturer Description
1812HC160KAT1A AVX Ceramic Capacitor, Multilayer, Ceramic, 3000V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.000016uF, Surface Mount, 1812, CHIP, ROHS COMPLIANT
1812HC160KAT3A AVX Ceramic Capacitor, Multilayer, Ceramic, 3000V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.000016uF, Surface Mount, 1812, CHIP, ROHS COMPLIANT
1812HC160KAZ1A AVX Ceramic Capacitor, Multilayer, Ceramic, 3000V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.000016uF, Surface Mount, 1812, CHIP, ROHS COMPLIANT
1812HC160KAZ3A AVX Ceramic Capacitor, Multilayer, Ceramic, 3000V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.000016uF, Surface Mount, 1812, CHIP, ROHS COMPLIANT
1812HC160KA13A AVX Ceramic Capacitor, Multilayer, Ceramic, 3000V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.000016uF, Surface Mount, 1812, CHIP, ROHS COMPLIANT
1812HC160KA11A AVX Ceramic Capacitor, Multilayer, Ceramic, 3000V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.000016uF, Surface Mount, 1812, CHIP, ROHS COMPLIANT
1812HC160KAX1A AVX Ceramic Capacitor, Multilayer, Ceramic, 3000V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.000016uF, Surface Mount, 1812, CHIP
1812HC160KAX3A AVX Ceramic Capacitor, Multilayer, Ceramic, 3000V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.000016uF, Surface Mount, 1812, CHIP
LD12HC160KAX1A AVX Ceramic Capacitor, Multilayer, Ceramic, 3000V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.000016uF, Surface Mount, 1812, CHIP
LD12HC160KAX3A AVX Ceramic Capacitor, Multilayer, Ceramic, 3000V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.000016uF, Surface Mount, 1812, CHIP
LD12HC160KAB3A AVX Ceramic Capacitor, Multilayer, Ceramic, 3000V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.000016uF, Surface Mount, 1812, CHIP
LD12HC160KAB1A AVX Ceramic Capacitor, Multilayer, Ceramic, 3000V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.000016uF, Surface Mount, 1812, CHIP
LD12HC160KAB9A AVX Ceramic Capacitor, Multilayer, Ceramic, 3000V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.000016uF, Surface Mount, 1812, CHIP
1812HC160KAT9A AVX Ceramic Capacitor, Multilayer, Ceramic, 3000V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.000016uF, Surface Mount, 1812, CHIP, ROHS COMPLIANT
1812HC160KAZ9A AVX Ceramic Capacitor, Multilayer, Ceramic, 3000V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.000016uF, Surface Mount, 1812, CHIP, ROHS COMPLIANT
1812HC160KAX9A AVX CAPACITOR, CERAMIC, MULTILAYER, 3000V, X7R, 0.000016uF, SURFACE MOUNT, 1812, CHIP
LD12HC160KAX9A AVX Ceramic Capacitor, Multilayer, Ceramic, 3000V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.000016uF, Surface Mount, 1812, CHIP
Some Problems in Drawing PCB
I'm making a single-chip microcomputer board recently, but due to the limitations of the laboratory conditions, it seems that I can only make a single-sided board. Then I want to mix the surface mount...
奔跑的蜗牛 51mcu
Stack reuse in GD32VF103 multi-tasking applications
When developing applications using FreeRTOS, after the multi-task scheduler is started, since each task has its own stack space, the C startup stack is no longer used, reducing the amount of RAM avail...
MamoYU Domestic Chip Exchange
[ATmega4809 Curiosity Nano Review] Wifi Controlled Lighting (IoT Led Part 2)
1. Introduction In the previous article, we completed the IoT LED functions (the green part in the figure below) except for the communication protocol and communication module according to the system ...
Ansersion MCU
STM8 BUG for Code (0x8B)
When accessing the code area in the program, the data read out is wrong! ! ! ! The test code is as follows (0x72 of 0x81C7 is read as 0x8B): long OffsetList[20]; long AddrList[20]; unsigned char index...
hansenw stm32/stm8
【Meet friends by demolishing】ICBC password device
Go to the bank to apply for a bank card, and the customer service will issue you a password device or U shield, saying it is safer. I still did it with some doubts. Is such a small thing really safe? ...
DavidZH Making friends through disassembly
Serial port reading and writing questions
I wrote a function to write to the serial port under LInux. It keeps writing the string "this is a test" to the serial port. Then I use the serial port debugging tool to check the output. It is correc...
4543464 Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2214  2858  2548  2385  1821  45  58  52  49  37 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号