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CL21C181FBANNNC

Description
Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, C0G, 30ppm/Cel TC, 0.00018uF, Surface Mount, 0805, CHIP, LEAD FREE
CategoryPassive components    capacitor   
File Size159KB,2 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Environmental Compliance  
Download Datasheet Parametric View All

CL21C181FBANNNC Overview

Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, C0G, 30ppm/Cel TC, 0.00018uF, Surface Mount, 0805, CHIP, LEAD FREE

CL21C181FBANNNC Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerSAMSUNG
package instruction, 0805
Reach Compliance Codecompli
ECCN codeEAR99
capacitance0.00018 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
JESD-609 codee3
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance1%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
method of packingTR, CARDBOARD, 7 INCH
positive tolerance1%
Rated (DC) voltage (URdc)50 V
size code0805
surface mountYES
Temperature characteristic codeC0G
Temperature Coefficient-/+30ppm/Cel ppm/°C
Terminal surfaceTin (Sn) - with Nickel (Ni) barrie
Terminal shapeWRAPAROUND
SPECIFICATION
Supplier : Samsung electro-mechanics
Product : Multi-layer Ceramic Capacitor
A. Samsung Part Number
CL
Series
Size
Dielectric
Capacitance
Capacitance
tolerance
Rated Voltage
Thickness
21
C
181
F
B
A
N
N
N
C
Part Number :
Description :
CL21C181FBANNNC
CAP, 180㎊, 50V, ±1%, C0G, 0805
Samsung Multi-layer Ceramic Capacitor
0805 (inch code)
L: 2.0 ± 0.1
C0G
180
±1
%
50 V
0.65 ± 0.1
mm
W:
1.25 ± 0.1 mm
Ni
Cu
Sn 100%
Normal
Reserved for future use
Cardboard Type, 7" reel
Inner electrode
Termination
Plating
Product
mm
Special
Packaging
(Pb Free)
B. Samsung Reliablility Test and Judgement condition
Capacitance
Q
Insulation
Resistance
Appearance
Withstanding
Voltage
Temperature
Characterisitcs
Adhesive Strength
of Termination
Bending Strength
Solderability
Performance
Within specified tolerance
1000 min
10,000Mohm or 500Mohm⋅㎌
Whichever is Smaller
No abnormal exterior appearance
No dielectric breakdown or
mechanical breakdown
C0G
(From -55℃ to 125℃, Capacitance change shoud be within ±30PPM/℃)
No peeling shall be occur on the
500g⋅F, for 10±1 sec.
terminal electrode
Capacitance change :
Bending to the limit (1mm)
with 1.0mm/sec.
within ±5% or ±0.5㎊ whichever is larger
More than 95% of terminal surface
1) Sn63Pb37 solder
is to be soldered newly
235±5℃, 5±0.5sec.
2) SnAg3.0Cu0.5 solder
245±5℃, 3±0.3sec.
(preheating : 80~120℃ for 10~30sec.)
Resistance to
Soldering heat
Capacitance change :
within ±2.5% or ±0.25㎊ whichever is larger
Tan
δ,
IR : initial spec.
Solder pot : 270±5℃, 10±1sec.
1㎒±10%
Rated Voltage
Test condition
0.5~5Vrms
60~120 sec.
Microscope (×10)
300% of the rated voltage
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