Si3226/27 +
Si3208/09
D
U A L
P
RO
SLIC
®
WITH
DC-DC C
O N T R O L L E R
Features
Performs all BORSCHT functions
Ideal for short- or long-loop applications
Internal balanced or unbalanced ringing
Low power consumption
Software-programmable parameters:
Ringing frequency, amplitude,
cadence, and waveshape
Two-wire ac impedance
Transhybrid balance
DC current loop feed (10–45 mA)
Loop closure and ring trip thresholds
Ground key detect threshold
Integrated dc-dc controller
Wideband CODEC (Si3227)
Applications
Customer Premises Equipment (CPE)
Private Branch Exchange (PBX)
Optical Network Terminals (ONT)
Cable EMTAs, ATAs, VoIP
Gateways
Description
The Si3226/27 Dual ProSLIC® chipsets each consist of a low-voltage CMOS
device integrating both SLIC and CODEC functionality in combination with a high-
voltage linefeed IC (LFIC). The chipset provides two complete foreign exchange
station (FXS) telephony interfaces. The Si3226/27 operate from a single 3.3 V
supply and interface to standard PCM/SPI or GCI bus digital interfaces. A built-in
dc-dc controller automatically generates the optimal battery voltage required for
each line-state, optimizing efficiency and minimizing heat generation. Self-testing
and metallic loop testing (MLT), e.g., GR-909, is facilitated by the built-in DSP,
monitor ADC, and test load. The companion Si3208/09 LFICs are available with
voltage ratings up to –135 V to support high power ringing and the Si3227
supports wideband audio for better-than-PSTN voice quality (see Ordering Guide
below). The Si3226/27 are available in a 64-pin thin quad flat package (TQFP);
the LFICs are available in a 40-pin quad, flat, no-lead package (QFN).
Functional Block Diagram
Si3226/27
Si3226
FSYNC
DRX
DTX
CS
SDI
SDO
SCLK
INT
RST
Linefeed
DTMF &
Tone Gen
Caller ID
Programmable
Programmable
AC Impedance
AC Impedance
and Hybrid
Linefeed
PCLK
Rev. 1.2 10/10
Silicon Laboratories Confidential. Information contained herein is covered under non-disclosure agreement (NDA).
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Si3208/09
SLIC
Linefeed
Control
Linefeed
Monitor
Low-power sleep mode
On-hook transmission
Loop or ground start operation
Smooth polarity reversal
DTMF generator/decoder
A-Law/µ-Law companding,
linear PCM
PCM and SPI bus digital interfaces
with programmable interrupts
GCI/IOM-2 mode support
3.3 V operation
GR-909 loop diagnostics
Audio diagnostics with loopback
Pb-free/RoHS-compliant packaging
Ordering Information
See page 38.
Patents pending
PCM/
GCI
Interface
CODEC
ADC
DAC
CODEC
ADC
DAC
TIP
Channel 1
RING
SPI
Control
Interface
Ringing
Generator
DSP
SLIC
Linefeed
Control
Linefeed
Monitor
Line Diagnostics
PLL
DC-DC Controllers
DC-DC Controller
VBAT
VDC
DC-DC BOM
TIP
Channel 2
RING
Copyright © 2010 by Silicon Laboratories
Si3226/27 + Si3208/09
2
Si3226/27 +
Si3208/09
Rev. 1.2
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Si3226/27 +
Si3208/09
T
ABLE O F
C
ONTENTS
Section
Page
1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
2. Typical Application Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3. Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
4.1. DC Feed Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
4.2. Linefeed Operating States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
4.3. Line Voltage and Current Monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
4.4. Power Monitoring and Power Fault Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
4.5. Thermal Overload Shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
4.6. Power Dissipation Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
4.7. Loop Closure Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
4.8. Ground Key Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
4.9. Ringing Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
4.10. Polarity Reversal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
4.11. Two-Wire Impedance Synthesis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
4.12. Transhybrid Balance Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
4.13. Tone Generators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
4.14. DTMF Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
4.15. DC-DC Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
4.16. Wideband Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
4.17. SPI Control Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
4.18. PCM Interface and Companding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
4.19. General Circuit Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
4.20. Metallic Loop Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
5. Pin Descriptions: Si3226/27 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
6. Pin Descriptions: Si3226/27 + Si3208/09 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
7. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
8. Product Identification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
9. Package Outline: 64-Pin TQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
10. Package Outline: 40-Pin QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42
Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45
Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46
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Rev. 1.2
3
Si3226/27 +
Si3208/09
1. Electrical Specifications
Table 1. Absolute Maximum Ratings and Thermal Information
1
Parameter
Operating Temperature Range
Storage Temperature Range
Thermal Resistance,
TQFP-64
Typical
2
Symbol
T
A
T
STG
JA
P
D
T
J
T
A
= 85 °C
Test Condition
Value
–40 to 85
–55 to 150
45
.88
125
32
Unit
°C
°C
°C/W
W
°C
°C/W
W
°C
Continuous Power Dissipation
3
TQFP-64
Maximum Junction Temperature,
Si3226/27
Thermal Resistance, Typical
2
QFN-40
Continuous Power Dissipation
4
QFN-40
Maximum Junction Temperature,
Si3208/09
4
Supply Voltage
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JA
P
D
T
J
T
A
= 85 °C
Continuous
Si3226/27
V
DD
V
DDA
,
V
DDC
, V
DDD
V
IND
V
DD
Si3208
V
BAT
V
TIP
, V
RING
I
TIP
, I
RING
V
DD
Si3209
V
BAT
V
TIP
, V
RING
I
TIP
, I
RING
Rev. 1.2
1.87
145
–0.5 to 4.0
–0.3 to 3.6
–0.5 to 4.0
–130
V
V
V
V
V
mA
V
V
V
mA
Digital Input Voltage
Supply Voltage
Battery Supply Voltage
5
TIP or RING Voltage
6
TIP, RING Current
Supply Voltage
+0.4 to –115
±100
–0.5 to 4.0
–140
±100
High Battery Supply Voltage
5
TIP or RING Voltage
6
TIP, RING Current
+0.4 to –140
Notes:
1.
Permanent device damage may occur if the absolute maximum ratings are exceeded. Functional operation should be
restricted to the conditions as specified in the operational sections of this data sheet.
2.
The thermal resistance of an exposed pad package is assured when the recommended printed circuit board layout
guidelines are followed correctly. The specified performance requires that the exposed pad be soldered to an exposed
copper surface of at least equal size and that multiple vias are added to enable heat transfer between the top-side
copper surface and a large internal/bottom copper plane.
3.
Operation of the Si3226 or Si3227 above 125 °C junction temperature will degrade device reliability.
4.
Si3208 and Si3209 are equipped with on-chip thermal limiting circuitry that shuts down the circuit when the junction
temperature exceeds the thermal shutdown threshold. The thermal shutdown threshold should normally be set to
145 °C; when in the ringing state the thermal shutdown may be set to 200 °C. For optimal reliability long term operation
of the Si3208/Si3209 above 150 °C junction temperature should be avoided.
5.
The dv/dt of the voltage applied to the VBAT pins must be limited to 10 V/µs.
6.
Specification requires protection circuit for surge event as shown in typical application circuit.
4
Si3226/27 +
Si3208/09
Table 2. Recommended Operating Conditions
1
Parameter
Ambient Temperature
Ambient Temperature
Junction Temperature, Si3208/09
Junction Temperature, Si3226/27
Supply Voltage, Si3226/27
Supply Voltage, Si3208/09
Battery Voltage, Si3208
2
Battery Voltage, Si3209
2
Symbol
T
A
T
A
T
J
T
J
V
DDA
,
V
DDC
, V
DDD
V
DD
V
BAT
V
BAT
Test
Condition
F-grade
G-grade
Min
1
0
–40
—
—
3.13
3.13
Typ
1
25
25
—
—
3.3
3.3
—
—
Max
1
70
85
145
125
3.47
3.47
–15
–15
Unit
o
C
o
C
°C
°C
V
V
V
V
Notes:
1.
All minimum and maximum specifications apply across the recommended operating conditions. Typical values apply at
nominal supply voltages and an operating temperature of 25
°
C unless otherwise stated.
2.
Operation at minimum voltage dependent upon loop conditions and dc-dc converter configurations.
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–110
–136
Rev. 1.2
5
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