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1MD10-049-08

Description
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
File Size2MB,8 Pages
ManufacturerRMT Ltd.
Websitehttp://www.rmtltd.ru/
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1MD10-049-08 Overview

Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper

Thermoelectric Cooling Solutions
Performance Parameters
Type
ΔT
max
K
69
70
72
72
1MD10-049-XX
I
max
A
5.4
4.4
3.0
2.3
6.1
Q
max
W
19.44
16.09
11.23
8.62
U
max
V
AC R
Ohm
0.83
1.0
1.5
2.0
H
mm
1.9
2.1
2.6
3.1
1MD10-049-XX (N=49)
1MD10-049-08
1MD10-049-10
1MD10-049-15
1MD10-049-20
Performance data are given for 300K, vacuum
Dimensions
Manufacturing options
A. TEC Assembly:
* 1. Solder SnSb (T
melt
=230°C)
2. Solder AuSn (T
melt
=280°C)
B. Ceramics:
C. Ceramics Surface Options:
1. Blank ceramics (not metallized)
2. Metallized (Au plating)
3. Metallized and pre-tinned with:
3.1 Solder 117 (In-Sn, T
melt
=117°C)
3.2 Solder 138 (Sn-Bi, T
melt
= 138°C)
3.3 Solder 143 (In-Ag, T
melt
= 143°C)
3.4 Solder 157 (In, T
melt
= 157°C)
3.5 Solder 183 (Pb-Sn, T
melt
=183°C)
3.6 Optional (specified by Customer)
46 Warshavskoe shosse. Moscow 115230
 Russia,
ph: +7-499-678-2082, fax: +7-499-678-2083, web:
www.rmtltd.ru
Copyright 2012. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.
D. Thermistor (optional)
Can be mounted to cold side
ceramics edge. Calibration is
available by request.
E. Terminal contacts
1. Blank, tinned Copper
2. Insulated Wires
3. Insulated, color coded
*
1.Pure Al
2
O
3
(100%)
2.Alumina (Al
2
O
3
- 96%)
3.Aluminum Nitride (AlN)
* - used by default
Page 1 of 8

1MD10-049-08 Related Products

1MD10-049-08 1MD10049 1MD10-049-10 1MD10-049-15 1MD10-049-20
Description Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper Blank ceramics (not metallized) Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
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