Ordering Information .................................................................................................................................................................... 2
7.1. User Programming Interface ..................................................................................................................................... 19
7.2. Start-up output frequency and signaling types .......................................................................................................... 19
8.1. Any-frequency function ............................................................................................................................................. 20
9 I C/SPI Control Registers...................................................................................................................................................... 30
9.1. Register Address: 0x00. DCO Frequency Control Least Significant Word (LSW) .................................................... 30
9.2. Register Address: 0x01. OE Control, DCO Frequency Control Most Significant Word (MSW) ................................. 31
9.3. Register Address: 0x02. DCO PULL RANGE CONTROL ........................................................................................ 32
9.4. Register Address: 0x03. Flac-N PLL Integer Value and Flac-N PLL Fraction MSW ................................................. 33
9.6. Register Address: 0x05. PostDiv, Driver Control ...................................................................................................... 34
9.7. Register Address: 0x06. mDriver, Driver Control ...................................................................................................... 35
2
10 I C Operation ........................................................................................................................................................................ 36
2
10.1. I C protocol ............................................................................................................................................................... 36
2
10.2. I C Timing Specification ............................................................................................................................................ 38
2
10.3. I C Device Address Modes ....................................................................................................................................... 39
Dimensions and Patterns ........................................................................................................................................................... 46
Additional Information ................................................................................................................................................................ 47
Revision History ......................................................................................................................................................................... 48
Rev 0.91
Page 3 of 48
www.sitime.com
SiT3522
340 to 725 MHz Elite™ I
2
C/SPI Programmable Oscillator
1 Electrical Characteristics
PRELIMINARY
All Min and Max limits in the Electrical Characteristics tables are specified over temperature and rated operating voltage with
standard output terminations shown in the termination diagrams. Typical values are at 25°C and nominal supply voltage.
Table 1. Electrical Characteristics – Common to LVPECL, LVDS and HCSL
Parameter
Output Frequency Range
Symbol
f
Min.
340.000001
340.000001
Typ.
–
–
Max.
725.000000
500.000000
Unit
MHz
MHz
Condition
LVDS and LVPECL output driver, factory or user
programmable, accurate to 6 decimal places
HCSL output driver, factory or user programmable, accurate to
6 decimal places
Inclusive of initial tolerance, operating temperature, rated
power supply voltage and load variations
Frequency Range
Frequency Stability
Frequency Stability
F_stab
-20
-20
-25
-50
First Year Aging
Operating Temperature Range
F_1y
T_use
–
-20
-40
-40
Supply Voltage
Vdd
2.97
2.7
2.52
2.25
Input Voltage High
Input Voltage Low
Input Pull-up Impedance
Duty Cycle
Start-up Time
Output Enable/Disable Time –
Hardware control via OE pin
Output Enable/Disable Time –
Software control via I
2
C/SPI
VIH
VIL
Z_in
DC
T_start
T_oe_hw
70%
–
–
45
–
–
–
–
–
–
±1
–
–
–
3.3
3.0
2.8
2.5
–
–
100
–
–
–
+20
+20
+25
+50
–
+70
+85
+105
Supply Voltage
3.63
3.3
3.08
2.75
–
30%
–
55
3.0
9.1
V
V
V
V
Vdd
Vdd
kΩ
%
ms
µs
Measured from the time Vdd reaches its rated minimum value
Measured from the time OE pin reaches rated VIH and VIL to
the time clock pins reach 90% of swing and high-Z.
See
Figure 9
and
Figure 10
Measured from the time the last byte of command is
transmitted via I
2
C/SPI (reg1) to the time clock pins reach 90%
of swing and high-Z. See
Figure 30
and
Figure 31
OE pin
OE pin
OE pin, logic high or logic low
ppm
ppm
ppm
ppm
ppm
°C
°C
°C
1 -year aging at 25°C
Extended Commercial
Industrial
Extended Industrial. Available only for I C operation, not SPI.
2
st
Temperature Range
Input Characteristics – OE Pin
Output Characteristics
Startup and Output Enable/Disable Timing
T_oe_sw
–
–
11.8
µs
Rev 0.91
Page 4 of 48
www.sitime.com
SiT3522
340 to 725 MHz Elite™ I
2
C/SPI Programmable Oscillator
Table 2. Electrical Characteristics – LVPECL Specific
Parameter
Symbol
Min.
Typ.
Max.
Unit
PRELIMINARY
Condition
Current Consumption
Current Consumption
OE Disable Supply Current
Output Disable Leakage Current
Maximum Output Current
Idd
I_OE
I_leak
I_driver
–
–
–
–
–
–
0.10
–
94
63
–
30
mA
mA
A
mA
Excluding Load Termination Current, Vdd = 3.3V or 2.5V
OE = Low
OE = Low
Maximum average current drawn from OUT+ or OUT-
Output Characteristics
Output High Voltage
Output Low Voltage
Output Differential Voltage Swing
Rise/Fall Time
VOH
VOL
V_Swing
Tr, Tf
Vdd - 1.1V
Vdd - 1.9V
1.2
–
–
–
1.6
225
Vdd - 0.7V
Vdd - 1.5V
2.0
290
Jitter
RMS Phase Jitter (random) –
DCO Mode Only
T_phj
–
–
RMS Phase Jitter (random) –
Any-frequency Mode Only
T_phj
–
–
RMS Period Jitter
[3]
Note:
3. Measured according to JESD65B
T_jitt
–
0.22
0.075
0.23
0.09
1
0.260
0.085
0.325
0.095
1.6
ps
ps
ps
ps
ps
f = 622.08 MHz, Integration bandwidth = 12 kHz to 20 MHz,
all Vdd levels
f = 622.08, IEEE802.3-2005 10 GbE jitter mask integration
bandwidth = 1.875 MHz to 20 MHz, all Vdd levels
f = 622.08 MHz, Integration bandwidth = 12 kHz to 20 MHz,
all Vdd levels
f = 622.08, IEEE802.3-2005 10 GbE jitter mask integration
bandwidth = 1.875 MHz to 20 MHz, all Vdd levels
f = 622.08 MHz, Vdd = 3.3V or 2.5V
V
V
V
ps
See
Figure 5
See
Figure 5
See
Figure 6
20% to 80%, see
Figure 6
Table 3. Electrical Characteristics – LVDS Specific
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
Current Consumption
Current Consumption
OE Disable Supply Current
Output Disable Leakage Current
Idd
I_OE
I_leak
–
–
–
–
–
0.15
89
67
–
mA
mA
A
Excluding Load Termination Current, Vdd = 3.3V or 2.5V
OE = Low
OE = Low
Output Characteristics
Differential Output Voltage
Delta VOD
Offset Voltage
Delta VOS
Rise/Fall Time
VOD
ΔVOD
VOS
ΔVOS
Tr, Tf
250
–
1.125
–
–
–
–
–
–
340
530
50
1.375
50
460
Jitter
RMS Phase Jitter (random) –
DCO Mode Only
T_phj
–
–
RMS Phase Jitter (random) –
Any-frequency Mode Only
T_phj
–
–
RMS Period Jitter
[4]
Note:
4. Measured according to JESD65B.
T_jitt
–
0.21
0.060
0.21
0.070
1
0.255
0.070
0.320
0.80
1.6
ps
ps
ps
ps
ps
f = 622.08 MHz, Integration bandwidth = 12 kHz to 20 MHz,
all Vdd levels
f = 622.08 MHz, IEEE802.3-2005 10 GbE jitter mask
integration bandwidth = 1.875 MHz to 20 MHz, all Vdd levels
f = 622.08 MHz, Integration bandwidth = 12 kHz to 20 MHz,
all Vdd levels
f = 622.08 MHz, IEEE802.3-2005 10 GbE jitter mask
integration bandwidth = 1.875 MHz to 20 MHz, all Vdd levels
f = 622.08 MHz, Vdd = 3.3V or 2.5V
mV
mV
V
mV
ps
f = 622.08 MHz. See
Figure 7
See
Figure 7
See
Figure 7
See
Figure 7
Measured with 2 pF capacitive loading to GND, 20% to 80%,
The goods that were shipped overseas finally arrived today. Here is a record of the unboxing.
1. Overall unpacking
The package I received was quite large, and it was filled with a lot of vacuum filler...
[i=s]This post was last edited by ohahaha on 2019-3-29 15:44[/i] [align=left][size=4][color=rgb(51, 51, 51)]Electroplated copper is the most widely used pre-plating layer to improve the bonding streng...
[p=26, null, left][color=#000][font=Arial]Currently, we have tested CCSv5/v6 versions, which are 5.2 and 6.0 respectively. For detailed introduction of CCS, please refer to TI's official documents or ...
I set a timer with a one-minute interval: SetTimer(3, 60000, NULL) as follows, but the actual time is only about 10 seconds. Can anyone tell me what's going on?...
Can CCS directly call out images? Just like in the VC environment, you can directly call out a picture to process. Can CCS do this? I don't have a front-end video acquisition, so it would be best if I...
Hardware designers have begun to adopt FPGA technology in high-performance DSP designs because it can provide 10-100 times faster computing than PC-based or microcontroller-based solutions. Previou...[Details]
A single-chip microcomputer is also called a single-chip microcontroller. It is not a chip that completes a certain logical function, but a computer system integrated into one chip. In general, a c...[Details]
1 Introduction
A wide variety of communication cables and control cables are widely used in various instruments and control equipment. Whether the cable is well-conducted and
whether
th...[Details]
The Mobile Industry Processor Interface (MIPI) Alliance is an organization responsible for promoting the standardization of software and hardware in mobile devices. It has released the D-PHY specif...[Details]
With the rapid development of urban economy, elevators are increasingly used as a vertical transportation tool. However, elevator fault detection and maintenance, especially the role of elevator remot...[Details]
1 Introduction
Ultrasonic waves have strong directivity, slow energy consumption, and can propagate over long distances in a medium, so they are used for distance measurement. Ultrasonic detec...[Details]
MediaTek (2454) announced the acquisition of F-MStar (3697) and attracted the attention of IC design industry. This morning, Gartner Semiconductor Industry Research Director Hong Cenwei analyzed ...[Details]
LED is the abbreviation of light emitting diode, which is an electric light source made of semiconductor technology. The core part of LED is a chip composed of P-type semiconductor and N-type semi...[Details]
It is well known to automotive suppliers that automakers are demanding more from their supply base. For connector suppliers, this means stricter requirements for product performance, stability and ...[Details]
The era of mobile access to the Internet has arrived, and it will rapidly change the business and infrastructure needs of mobile operators under a whole new trend of requirements. We need 4G LTE to...[Details]
Introduction
X1226 has the functions of clock and calendar. The clock relies on hour, minute and second registers to track, and the calendar relies on date, week, month and year registers to tr...[Details]
In order to develop lighting LED technology, developed countries attach great importance to the research of LED testing methods and standards. For example, the National Institute of Standards and T...[Details]
introduction
Belt drive is a common transmission device used in industrial production. Its commonly used speed detection device is a photoelectric encoder installed at the rotating end of th...[Details]
Synchronous buck designs are becoming increasingly difficult, and the selection of suitable ICs is becoming quite narrow. This Design Idea combines a current-mode PWM IC used in a flyback regulator...[Details]