Ordering Information .................................................................................................................................................................... 2
7.1. User Programming Interface .................................................................................................................................... 19
7.2. Start-up output frequency and signaling types ......................................................................................................... 19
8.1. Any-frequency function ............................................................................................................................................ 20
9 I C/SPI Control Registers ..................................................................................................................................................... 29
9.1. Register Address: 0x00. DCO Frequency Control Least Significant Word (LSW) ................................................... 29
9.2. Register Address: 0x01. OE Control, DCO Frequency Control Most Significant Word (MSW) ................................ 30
9.3. Register Address: 0x02. DCO PULL RANGE CONTROL........................................................................................ 31
9.4. Register Address: 0x03. Flac-N PLL Integer Value and Flac-N PLL Fraction MSW ................................................ 32
9.6. Register Address: 0x05. PostDiv, Driver Control ..................................................................................................... 33
9.7. Register Address: 0x06. mDriver, Driver Control ..................................................................................................... 34
2
10 I C Operation ........................................................................................................................................................................ 35
10.1. I
2
C protocol .............................................................................................................................................................. 35
10.2. I
2
C Timing Specification ........................................................................................................................................... 37
Dimensions and Patterns ........................................................................................................................................................... 45
Additional Information ................................................................................................................................................................ 46
Revision History ......................................................................................................................................................................... 47
Rev 0.5
Page 3 of 47
www.sitime.com
SiT3542
340 to 725 MHz Endura Series I
2
C/SPI Programmable Oscillator
1 Electrical Characteristics
All Min and Max limits in the Electrical Characteristics tables are specified over temperature and rated operating voltage with
standard output terminations shown in the termination diagrams. Typical values are at 25°C and nominal supply voltage.
Table 1. Electrical Characteristics – Common to LVPECL, LVDS and HCSL
Parameter
Output Frequency Range
Frequency Stability
Symbol
f
F_stab
Min.
340.000001
-20
-20
-25
-50
First Year Aging
10 Year Aging
20 Year Aging
Operating Temperature Range
F_1y
F_10y
F_20y
T_use
-0.7
-1.4
-1.6
-20
-40
Typ.
–
–
–
–
–
±0.4
±0.8
±1.0
–
–
Max.
725.000000
+20
+20
+25
+50
+0.7
+1.4
+1.6
+70
+85
Unit
MHz
ppm
ppm
ppm
ppm
ppm
ppm
ppm
°C
°C
At 85°C
At 85°C
At 85°C
Extended Commercial
Industrial.
Contact SiTime
for higher temperature range options
Low sensitivity grade; total gamma over 3 axes; 15 Hz to
2 kHz; MIL-PRF-55310, computed per section 4.8.18.3.1
Condition
Factory or user programmable, accurate to 6 decimal places
Inclusive of initial tolerance, operating temperature, rated
power supply voltage and load variations.
Frequency Range
Frequency Stability
Temperature Range
Rugged Characteristics
Acceleration (g) sensitivity,
Gamma Vector
Supply Voltage
F_g
–
–
0.1
Supply Voltage
Vdd
2.97
2.7
2.52
2.25
Input Voltage High
Input Voltage Low
Input Pull-up Impedance
Duty Cycle
Start-up Time
Output Enable/Disable Time –
Hardware control vis OE pin
Output Enable/Disable Time –
Software control vis I
2
C/SPI
T_oe_sw
11.8
µs
VIH
VIL
Z_in
DC
T_start
T_oe_hw
70%
–
–
45
–
–
3.3
3.0
2.8
2.5
–
–
100
–
–
–
3.63
3.3
3.08
2.75
–
30%
–
55
3.0
9.1
V
V
V
V
Vdd
Vdd
kΩ
%
ms
µs
Measured from the time Vdd reaches its rated minimum value
Measured from the time OE pin reaches rated VIH and VIL to
the time clock pins reach 90% of swing and high-Z.
See
Figure 9
and
Figure 10
Measured from the time the last byte of command is
transmitted via I
2
C/SPI (reg1) to the time clock pins reach 90%
of swing and high-Z. See
Figure 31
and
Figure 32
OE pin
OE pin
OE pin, logic high or logic low
ppb/g
Input Characteristics – OE Pin
Output Characteristics
Startup and Output Enable/Disable Timing
Rev 0.5
Page 4 of 47
www.sitime.com
SiT3542
340 to 725 MHz Endura Series I
2
C/SPI Programmable Oscillator
Table 2. Electrical Characteristics – LVPECL Specific
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
Current Consumption
Current Consumption
OE Disable Supply Current
Output Disable Leakage Current
Maximum Output Current
Idd
I_OE
I_leak
I_driver
–
–
–
–
–
–
0.10
–
94
63
–
30
mA
mA
A
mA
Excluding Load Termination Current, Vdd = 3.3V or 2.5V
OE = Low
OE = Low
Maximum average current drawn from OUT+ or OUT-
Output Characteristics
Output High Voltage
Output Low Voltage
Output Differential Voltage Swing
Rise/Fall Time
VOH
VOL
V_Swing
Tr, Tf
Vdd - 1.1V
Vdd - 1.9V
1.2
–
–
–
1.6
225
Vdd - 0.7V
Vdd - 1.5V
2.0
290
Jitter
RMS Phase Jitter (random) –
DCO Mode Only
T_phj
–
–
RMS Phase Jitter (random) –
Any-frequency Mode Only
T_phj
–
–
RMS Period Jitter
[3]
Note:
3. Measured according to JESD65B
T_jitt
–
0.22
0.075
0.23
0.09
1
0.260
0.085
0.325
0.095
1.6
ps
ps
ps
ps
ps
f = 622.08 MHz, Integration bandwidth = 12 kHz to 20 MHz,
all Vdds
f = 622.08, IEEE802.3-2005 10GbE jitter mask integration
bandwidth = 1.875 MHz to 20 MHz, all Vdds
f = 622.08 MHz, Integration bandwidth = 12 kHz to 20 MHz,
all Vdd levels
f = 622.08, IEEE802.3-2005 10GbE jitter mask integration
bandwidth = 1.875 MHz to 20 MHz, all Vdd levels
f = 622.08 MHz, Vdd = 3.3V or 2.5V
V
V
V
ps
See
Figure 5
See
Figure 5
See
Figure 6
20% to 80%, see
Figure 6
Table 3. Electrical Characteristics – LVDS Specific
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
Current Consumption
Current Consumption
OE Disable Supply Current
Output Disable Leakage Current
Idd
I_OE
I_leak
–
–
–
–
–
0.15
89
67
–
mA
mA
A
Excluding Load Termination Current, Vdd = 3.3V or 2.5V
OE = Low
OE = Low
Output Characteristics
Differential Output Voltage
VOD Magnitude Change
Offset Voltage
VOS Magnitude Change
Rise/Fall Time
VOD
ΔVOD
VOS
ΔVOS
Tr, Tf
250
–
1.125
–
–
–
–
–
–
340
530
50
1.375
50
460
Jitter
RMS Phase Jitter (random) –
DCO Mode Only
T_phj
–
–
RMS Phase Jitter (random) –
Any-frequency Mode Only
T_phj
–
–
RMS Period Jitter
[4]
Note:
4. Measured according to JESD65B
T_jitt
–
0.21
0.060
0.21
0.070
1
0.255
0.070
0.320
0.80
1.6
ps
ps
ps
ps
ps
f = 622.08 MHz, Integration bandwidth = 12 kHz to 20 MHz,
all Vdds
f = 622.08 MHz, IEEE802.3-2005 10GbE jitter mask
integration bandwidth = 1.875 MHz to 20 MHz, all Vdd levels
f = 622.08 MHz, Integration bandwidth = 12 kHz to 20 MHz,
all Vdd levels
f = 622.08 MHz, IEEE802.3-2005 10GbE jitter mask
integration bandwidth = 1.875 MHz to 20 MHz, all Vdd levels
f = 622.08 MHz, Vdd = 3.3V or 2.5V
mV
mV
V
mV
ps
f = 622.08 MHz. See
Figure 7
See
Figure 7
See
Figure 7
See
Figure 7
Measured with 2 pF capacitive loading to GND, 20% to 80%,
IP is a connectionless protocol. It is mainly responsible for addressing between hosts and setting up routes for data packets. It does not establish a session before exchanging data. Because it does n...
Recruitment position: RD, senior RF engineer (any direction of WIFI/BT/GPS)Work location: Shenzhen/Dongguan/ShanghaiCompany: Leading domestic mobile phone manufacturerEducation: Bachelor degree or abo...
Is the onboard emulator on TI's new C2000 Piccolo LaunchPad only usable under CCS5? Looking at the schematic, the onboard emulator part of the C2000 Piccolo LaunchPad looks very similar to the simplif...
Chip STM903, LCD screen 12864B-v2.0, using C language programming, I want to display the value represented by a variable on the LCD screen, how to achieve it? Thank you for your advice....
The TIA Portal software's shift instructions shift the contents of an accumulator bit by bit to the left or right. The number of bits shifted is determined by N. A left shift of N bits multiplies t...[Details]
ISP devices, such as field programmable devices (FPGAs and CPLDs), do not require a programmer. Using programming kits provided by the device manufacturer, they employ a top-down modular design app...[Details]
On August 25th, Apple's expansion in India encountered new troubles. According to Bloomberg, Foxconn Technology Group has recalled approximately 300 Chinese engineers from India, further hindering ...[Details]
For healthcare professionals, accurate diagnosis and treatment are crucial for a clear picture of a person's health. However, healthcare professionals often rely on tests at medical facilities, cli...[Details]
White light LEDs are voltage-sensitive devices. In actual operation, their upper limit is 20mA. However, the current often increases due to various reasons during use. If no protective measures are...[Details]
On August 22, Lantu Motors officially launched its Lanhai Intelligent Hybrid technology via an online livestream. This intelligent hybrid technology, which integrates a full-range 800V high-voltage...[Details]
Gross profit margin jumped from 13.6% in the first half of last year to 25.9%, almost doubling year-on-year.
On August 21, RoboSense released its interim performance report, in which the...[Details]
The Automotive Testing and Quality Assurance Expo (ATE 2025) will open on August 27th. At the expo, Rohde & Schwarz (R&S) will showcase six automotive testing solutions, themed "Intelligently Drivi...[Details]
On August 22, South Korean media Nate reported on the 20th local time that Samsung Electronics is introducing Hyper Cell technology into its most advanced 2nm process technology, striving to improv...[Details]
PowiGaN achieves 95% efficiency at both light and full loads, meeting critical operational and safety requirements.
DARWIN, Australia and SAN JOSE, Calif.,
August 22, 2025 – Powe...[Details]
On August 22, the Wall Street Journal reported on the 21st local time that the new US government does not plan to acquire equity in semiconductor wafer foundry giant TSMC and Micron, one of the thr...[Details]
According to Nikkei, a survey found that global electric vehicle battery supply is expected to reach more than three times the required quantity due to
cooling
demand for electric vehicles,...[Details]
Tiantai Robot's official Weibo account announced on the evening of August 20 that Tiantai Robot Co., Ltd., together with strategic partners including Shandong Future Robot Technology Co., Ltd., Sha...[Details]
Batteries, at the core of new energy vehicles, are crucial to vehicle performance and range. Existing automotive batteries are categorized into lead-acid and lithium batteries. Currently, new energ...[Details]
Civilian internal combustion engines operate in the range of approximately 1000-4000 rpm. This results in the engine's kinetic energy being ineffective at low or high rpm, making starting difficult...[Details]