5.0 mm x 3.2 mm Package Pinout ............................................................................................................................................... 1
Ordering Information .................................................................................................................................................................... 2
Device Configurations and Pin-outs ............................................................................................................................................. 9
Pin-out Top Views................................................................................................................................................................. 9
Test Circuit Diagrams for LVCMOS and Clipped Sinewave Outputs ......................................................................................... 10
Frequency Stability ............................................................................................................................................................. 16
Output Frequency and Format............................................................................................................................................ 16
Output Frequency Tuning ................................................................................................................................................... 16
Pin 1 Configuration (OE, VC, or NC) .................................................................................................................................. 17
Control Voltage Bandwidth ................................................................................................................................................. 20
Pull Range and Average Pull Range .................................................................................................................................. 22
Output Frequency ............................................................................................................................................................... 23
2
I C Control Registers .......................................................................................................................................................... 25
Serial Interface Configuration Description .......................................................................................................................... 28
Serial Signal Format ........................................................................................................................................................... 28
Parallel Signal Format ........................................................................................................................................................ 29
Parallel Data Format ........................................................................................................................................................... 29
2
I C Timing Specification ...................................................................................................................................................... 31
2
I C Device Address Modes ................................................................................................................................................. 32
Schematic Example ............................................................................................................................................................ 33
Dimensions and Patterns ........................................................................................................................................................... 34
Additional Information ................................................................................................................................................................ 36
Revision History ......................................................................................................................................................................... 37
Rev 1.05
Page 3 of 38
www.sitime.com
SiT5156
1 MHz to 60 MHz, ±0.5 to ±2.5 ppm, Elite Platform™ Super-TCXO
Electrical Characteristics
All Min and Max limits are specified over temperature and rated operating voltage with 15 pF output load unless otherwise
stated. Typical values are at 25°C and 3.3V Vdd.
Table 1. Output Characteristics
Parameters
Nominal Output Frequency Range
Operating Temperature Range
Symbol
F_nom
T_use
Min.
1
-20
-40
-40
Frequency Stability over
Temperature
Initial Tolerance
Supply Voltage Sensitivity
F_stab
–
–
–
F_init
F_Vdd
–
–
–
–
Output Load Sensitivity
F_load
–
–
–
Frequency vs. Temperature Slope
ΔF/ΔT
–
–
–
Dynamic Frequency Change during
Temperature Ramp
One-Year Aging
20-Year Aging
F_dynamic
–
–
–
F_1y
F_20y
–
–
Typ.
–
–
–
–
–
–
–
–
±7.10
±11.83
±28.40
±0.81
±1.35
±3.24
±15
±25
±60
±0.13
±0.21
±0.50
±1
±2
Max.
60
+70
+85
+105
±0.5
±1.0
±2.5
±1
±16.25
±32.50
±65.0
±2.75
±5.50
±11.00
±25
±50
±100
±0.21
±0.42
±0.83
–
–
Unit
MHz
°C
°C
°C
ppm
ppm
ppm
ppm
ppb
ppb
ppb
ppb
ppb
ppb
ppb/°C
ppb/°C
ppb/°C
ppb/s
ppb/s
ppb/s
ppm
ppm
Initial frequency at 25°C at 48 hours after 2 reflows
[table=98%,rgb(239, 245, 249)] [tr][td]Has anyone done a project on the STM32 TRF7960 driver for 14443A cards? I have a question. The 430 given on the official website is too messy. It looks like it w...
PCB design considerations 1. Overlapping pads Overlapping pads (except surface mount pads), that is, overlapping holes, will cause drill bits to break and wires to be damaged due to multiple holes in ...
[i=s]This post was last edited by weizhongc on 2015-12-3 13:34[/i] [url=https://bbs.eeworld.com.cn/thread-477418-1-1.html]https://bbs.eeworld.com.cn/thread-477418-1-1.html[/url] Purchase link: [url=ht...
I bought a small network management board for CC2530 and two node boards (both Tinyos and Z_stack data are available) from E-Dave Electronics before. I am trying to sell or exchange them. If you are i...
I am using a WINCE5.0 device. There are two USB ports on the PC. Now one USB port can be connected normally, but when I switch to the other USB port of the PC, it cannot be connected. I reinstall the ...
As more and more consumers purchase new energy vehicles, the safety of electric vehicles has become a major concern. This has been particularly prominent following a series of electric vehicle fire...[Details]
As the number of cars increases, environmental pressures are also increasing. At this time, some people are saying that new energy vehicles are energy-efficient and environmentally friendly, and ar...[Details]
The mass production process of the new generation of cockpit platform has started, and the smart cockpit market has entered a new bonus cycle of technology iteration and platform upgrade.
...[Details]
1. Introduction
Electronic scales are gradually replacing traditional measuring tools like springs and balances in everyday life, such as electronic price computing scales and electronic weigh...[Details]
For healthcare professionals, accurate diagnosis and treatment are crucial for a clear picture of a person's health. However, healthcare professionals often rely on tests at medical facilities, cli...[Details]
Definition of interactive projection system:
Interactive projection systems, also known as multimedia interactive projection, are available in floor, wall, and tabletop interactive projection....[Details]
Gross profit margin jumped from 13.6% in the first half of last year to 25.9%, almost doubling year-on-year.
On August 21, RoboSense released its interim performance report, in which the...[Details]
On August 22, South Korean media Nate reported on the 20th local time that Samsung Electronics is introducing Hyper Cell technology into its most advanced 2nm process technology, striving to improv...[Details]
PowiGaN achieves 95% efficiency at both light and full loads, meeting critical operational and safety requirements.
DARWIN, Australia and SAN JOSE, Calif.,
August 22, 2025 – Powe...[Details]
According to Nikkei, Japan has performed poorly in responding to China's power semiconductor challenges.
There are five major companies in Japan's power chip market: Mitsubishi Electric,...[Details]
Recently, Joyson Electronics has made positive progress in the core technology research and development of the robot's "brain and brain" and key components, and launched the industry's first integr...[Details]
According to foreign media reports, Ford Motor has applied to the U.S. Patent and Social Security Office (USPTO) for a patent for a door anti-collision system that may be used in future Ford vehicl...[Details]
On August 20, Geely announced its focus on "One Cockpit". Through a unified AI OS architecture, a unified AI Agent, and a unified user ID, it will achieve an All-in-One AI cockpit, create the first...[Details]
Shenzhen Baowei Power Supply high frequency pure sine wave power, communication inverter power supply has two communication interfaces, RS232 and R485 interfaces, their functions and characteristic...[Details]
As the electric vehicle industry continues to surge in today's society, while people are concerned about the appearance and interior of new energy vehicles, they are also concerned about the classi...[Details]