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S29CL016J1JQAI112

Description
Flash, 512KX32, 54ns, PQFP80, PLASTIC, MO-108CB-1, QFP-80
Categorystorage    storage   
File Size2MB,78 Pages
ManufacturerSPANSION
Websitehttp://www.spansion.com/
Download Datasheet Parametric View All

S29CL016J1JQAI112 Overview

Flash, 512KX32, 54ns, PQFP80, PLASTIC, MO-108CB-1, QFP-80

S29CL016J1JQAI112 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerSPANSION
Parts packaging codeQFP
package instructionQFP,
Contacts80
Reach Compliance Codecompli
ECCN codeEAR99
Maximum access time54 ns
Other featuresBOTTOM BOOT BLOCK
startup blockBOTTOM
JESD-30 codeR-PQFP-G80
JESD-609 codee0
length20 mm
memory density16777216 bi
Memory IC TypeFLASH
memory width32
Humidity sensitivity level3
Number of functions1
Number of terminals80
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize512KX32
Package body materialPLASTIC/EPOXY
encapsulated codeQFP
Package shapeRECTANGULAR
Package formFLATPACK
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)240
Programming voltage3.3 V
Certification statusNot Qualified
Maximum seat height3.35 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30
typeNOR TYPE
width14 mm
S29CD-J & S29CL-J Flash Family
S29CD032J, S29CD016J, S29CL032J, S29CL016J
32/16 Megabit CMOS 2.6 Volt or 3.3 Volt-only
Simultaneous Read/Write, Dual Boot, Burst Mode
Flash Memory with VersatileI/O™
Data Sheet
PRELIMINARY
Notice to Readers:
This document indicates states the current technical
specifications regarding the Spansion product(s) described herein. The
Preliminary status of this document indicates that a product qualification has
been completed, and that initial production has begun. Due to the phases of
the manufacturing process that require maintaining efficiency and quality, this
document may be revised by subsequent versions or modifications due to
changes in technical specifications.
Publication Number
S29CD-J_CL-J_00
Revision
B
Amendment
1
Issue Date
September 27, 2006
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