5962-01-383-9271 datasheet, PDF

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5962-01-383-9271: DescriptionUV PLD, 30ns, 10-Cell, CMOS, CDIP24; CategoryProgrammable logic devices Programmable logic; File Size804KB，15 Pages; ManufacturerAtmel (Microchip)

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5962-01-383-9271 Overview

UV PLD, 30ns, 10-Cell, CMOS, CDIP24

5962-01-383-9271 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Atmel (Microchip)
package instruction	DIP, DIP24,.3
Reach Compliance Code	compli
ECCN code	3A001.A.2.C
Other features	NO
In-system programmable	NO
JESD-30 code	R-XDIP-T24
JTAG BST	NO
Number of macro cells	10
Number of terminals	24
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Programmable logic type	UV PLD
propagation delay	30 ns
Certification status	Not Qualified
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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5962-01-383-9271 Related Products

	5962-01-383-9271	5962-01-393-3097	5962-01-423-3917	5962-01-424-5671	5962-01-383-9189
Description	UV PLD, 30ns, 10-Cell, CMOS, CDIP24	UV PLD, 35ns, 10-Cell, CMOS, CDIP24	UV PLD, 30ns, 10-Cell, CMOS, CDIP24	UV PLD, 35ns, 10-Cell, CMOS, CQCC28	OT PLD, 30ns, 10-Cell, CMOS, PDIP24
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)
package instruction	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.3	QCCN, LCC28,.45SQ	DIP, DIP24,.3
Reach Compliance Code	compli	compliant	compliant	compli	compli
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
Other features	NO	NO	NO	NO	NO
In-system programmable	NO	NO	NO	NO	NO
JESD-30 code	R-XDIP-T24	R-XDIP-T24	R-XDIP-T24	S-XQCC-N28	R-PDIP-T24
JTAG BST	NO	NO	NO	NO	NO
Number of macro cells	10	10	10	10	10
Number of terminals	24	24	24	28	24
Maximum operating temperature	70 °C	125 °C	125 °C	125 °C	70 °C
Minimum operating temperature	-	-55 °C	-55 °C	-55 °C	-
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	QCCN	DIP
Encapsulate equivalent code	DIP24,.3	DIP24,.3	DIP24,.3	LCC28,.45SQ	DIP24,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	CHIP CARRIER	IN-LINE
power supply	5 V	5 V	5 V	5 V	5 V
Programmable logic type	UV PLD	UV PLD	UV PLD	UV PLD	OT PLD
propagation delay	30 ns	35 ns	30 ns	35 ns	30 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	MILITARY	MILITARY	MILITARY	COMMERCIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	QUAD	DUAL

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