1W, 1 CHANNEL, AUDIO AMPLIFIER, PBGA8, MICRO, SMD-8
| Parameter Name | Attribute value |
| Maker | Texas Instruments |
| Parts packaging code | BGA |
| package instruction | VFBGA, |
| Contacts | 8 |
| Reach Compliance Code | unknow |
| ECCN code | EAR99 |
| Commercial integrated circuit types | AUDIO AMPLIFIER |
| harmonic distortion | 2% |
| JESD-30 code | S-PBGA-B8 |
| length | 1.361 mm |
| Number of channels | 1 |
| Number of functions | 1 |
| Number of terminals | 8 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Nominal output power | 1 W |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | VFBGA |
| Package shape | SQUARE |
| Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Maximum seat height | 0.95 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 2.2 V |
| surface mount | YES |
| Temperature level | INDUSTRIAL |
| Terminal form | BALL |
| Terminal pitch | 0.5 mm |
| Terminal location | BOTTOM |
| width | 1.361 mm |
| LM4890IBPX | LM4890LD/NOPB | LM4890ITLX/NOPB | LM4890IBP | |
|---|---|---|---|---|
| Description | 1W, 1 CHANNEL, AUDIO AMPLIFIER, PBGA8, MICRO, SMD-8 | 1W, 1 CHANNEL, AUDIO AMPLIFIER, DSO10, LLP-10 | 1W, 1 CHANNEL, AUDIO AMPLIFIER, PBGA9, MICRO, SMD-9 | 1W, 1 CHANNEL, AUDIO AMPLIFIER, PBGA8, MICRO, SMD-8 |
| Maker | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Parts packaging code | BGA | SON | BGA | BGA |
| package instruction | VFBGA, | HVSON, SOLCC10,.16,20 | FBGA, BGA9,3X3,20 | VFBGA, |
| Contacts | 8 | 10 | 9 | 8 |
| Reach Compliance Code | unknow | compliant | compliant | unknow |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
| Commercial integrated circuit types | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER |
| JESD-30 code | S-PBGA-B8 | R-XDSO-N10 | S-PBGA-B9 | S-PBGA-B8 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of terminals | 8 | 10 | 9 | 8 |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C |
| Package body material | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | VFBGA | HVSON | FBGA | VFBGA |
| Package shape | SQUARE | RECTANGULAR | SQUARE | SQUARE |
| Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | GRID ARRAY, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| surface mount | YES | YES | YES | YES |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal form | BALL | NO LEAD | BALL | BALL |
| Terminal pitch | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| Terminal location | BOTTOM | DUAL | BOTTOM | BOTTOM |
| harmonic distortion | 2% | 2% | - | 2% |
| length | 1.361 mm | 4 mm | - | 1.361 mm |
| Number of channels | 1 | 1 | - | 1 |
| Nominal output power | 1 W | 1 W | - | 1 W |
| Maximum seat height | 0.95 mm | 0.8 mm | - | 0.95 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | - | 5.5 V |
| Minimum supply voltage (Vsup) | 2.2 V | 2.2 V | - | 2.2 V |
| width | 1.361 mm | 3 mm | - | 1.361 mm |
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