LSF0102YZT datasheet, PDF - EEWORLD Datasheet

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LSF0102YZT: DescriptionIC SPECIALTY INTERFACE CIRCUIT, Interface IC:Other; CategoryAnalog mixed-signal IC Drivers and interfaces; File Size3MB，44 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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LSF0102YZT Overview

IC SPECIALTY INTERFACE CIRCUIT, Interface IC:Other

LSF0102YZT Parametric

Parameter Name	Attribute value
Maker	Texas Instruments
package instruction	VFBGA,
Reach Compliance Code	unknow
Interface integrated circuit type	INTERFACE CIRCUIT
JESD-30 code	R-PBGA-B8
length	1.888 mm
Number of functions	1
Number of terminals	8
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Maximum seat height	0.625 mm
Maximum supply voltage	4.5 V
Minimum supply voltage	1 V
Nominal supply voltage	3.3 V
Supply voltage 1-max	5.5 V
Mains voltage 1-minute	1.8 V
Supply voltage1-Nom	3.3 V
surface mount	YES
Temperature level	AUTOMOTIVE
Terminal form	BALL
Terminal pitch	0.5 mm
Terminal location	BOTTOM
width	0.888 mm

LSF0102YZT Related Products

	LSF0102YZT	LSF0101DRY	LSF0101DTQR	LSF0102DQE	LSF0108RKS
Description	IC SPECIALTY INTERFACE CIRCUIT, Interface IC:Other	IC SPECIALTY INTERFACE CIRCUIT, Interface IC:Other	Single bi-directional multi-voltage level translator 6-X2SON -40 to 125	IC SPECIALTY INTERFACE CIRCUIT, Interface IC:Other	IC SPECIALTY INTERFACE CIRCUIT, Interface IC:Other
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
package instruction	VFBGA,	VSON,	BCC,	VSON,	HVQCCN,
Reach Compliance Code	unknow	unknow	compli	unknow	unknow
Interface integrated circuit type	INTERFACE CIRCUIT	INTERFACE CIRCUIT	INTERFACE CIRCUIT	INTERFACE CIRCUIT	INTERFACE CIRCUIT
JESD-30 code	R-PBGA-B8	R-PDSO-N6	R-PBCC-N6	R-PDSO-N8	R-PQCC-N20
length	1.888 mm	1.45 mm	1 mm	1.4 mm	4.5 mm
Number of functions	1	1	1	1	1
Number of terminals	8	6	6	8	20
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	VFBGA	VSON	BCC	VSON	HVQCCN
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	SMALL OUTLINE, VERY THIN PROFILE	CHIP CARRIER	SMALL OUTLINE, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Maximum seat height	0.625 mm	0.6 mm	0.4 mm	0.4 mm	1 mm
Maximum supply voltage	4.5 V	4.5 V	5 V	4.5 V	4.5 V
Minimum supply voltage	1 V	1 V	-	1 V	1 V
surface mount	YES	YES	YES	YES	YES
Temperature level	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
Terminal form	BALL	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal location	BOTTOM	DUAL	BOTTOM	DUAL	QUAD
width	0.888 mm	1 mm	0.8 mm	1 mm	2.5 mm
Nominal supply voltage	3.3 V	3.3 V	-	3.3 V	3.3 V
Supply voltage 1-max	5.5 V	5.5 V	-	5.5 V	5.5 V
Mains voltage 1-minute	1.8 V	1.8 V	-	1.8 V	1.8 V
Supply voltage1-Nom	3.3 V	3.3 V	-	3.3 V	3.3 V
Terminal pitch	0.5 mm	0.5 mm	-	0.35 mm	0.5 mm

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