IC,FIFO,16X4,ASYNCHRONOUS,LS-TTL,FP,16PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| package instruction | DFP, FL16,.3 |
| Reach Compliance Code | _compli |
| JESD-30 code | R-XDFP-F16 |
| Memory IC Type | OTHER FIFO |
| memory width | 4 |
| Number of terminals | 16 |
| word count | 16 words |
| character code | 16 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 16X4 |
| Package body material | CERAMIC |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL16,.3 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| power supply | 5 V |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| SN54LS224W | 5962-01-164-5285 | SNJ54LS224FK | |
|---|---|---|---|
| Description | IC,FIFO,16X4,ASYNCHRONOUS,LS-TTL,FP,16PIN,CERAMIC | IC,FIFO,16X4,ASYNCHRONOUS,LS-TTL,DIP,16PIN,CERAMIC | IC,FIFO,16X4,ASYNCHRONOUS,LS-TTL,LLCC,CERAMIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| Maker | Texas Instruments | Texas Instruments | Texas Instruments |
| package instruction | DFP, FL16,.3 | DIP, DIP16,.3 | QCCN, LCC(UNSPEC) |
| Reach Compliance Code | _compli | _compli | _compli |
| Memory IC Type | OTHER FIFO | OTHER FIFO | OTHER FIFO |
| memory width | 4 | 4 | 4 |
| word count | 16 words | 16 words | 16 words |
| character code | 16 | 16 | 16 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C |
| organize | 16X4 | 16X4 | 16X4 |
| Package body material | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DFP | DIP | QCCN |
| Encapsulate equivalent code | FL16,.3 | DIP16,.3 | LCC(UNSPEC) |
| Package form | FLATPACK | IN-LINE | CHIP CARRIER |
| power supply | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
| surface mount | YES | NO | YES |
| technology | TTL | TTL | TTL |
| Temperature level | MILITARY | MILITARY | MILITARY |
| Terminal form | FLAT | THROUGH-HOLE | NO LEAD |
| Terminal location | DUAL | DUAL | QUAD |
| JESD-30 code | R-XDFP-F16 | R-XDIP-T16 | - |
| Number of terminals | 16 | 16 | - |
| Package shape | RECTANGULAR | RECTANGULAR | - |
| Terminal pitch | 1.27 mm | 2.54 mm | - |